頁 225 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC18V256SO20C	Xilinx Inc.	IC PROM SRL CONFIG 256K 20-SOIC Programmable Type: In System Programmable Memory Size: 256Kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存9,564
XC17S200APD8C	Xilinx Inc.	IC PROM SER 200000 C-TEMP 8-DIP Programmable Type: OTP Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存5,024
XC17256ELVO8C	Xilinx Inc.	IC 3V SER CFG PROM 256K 8-SOIC Programmable Type: OTP Memory Size: 256Kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存133,584
XC18V512PCG20C	Xilinx Inc.	IC PROM REPROGR 512KB 20-PLCC Programmable Type: In System Programmable Memory Size: 512kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存33,300
XCZU3EG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存7,840
XCZU2CG-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存7,600
XC7A100T-2FGG676CES9937	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存5,552
XC6SLX75T-4FGG484C	Xilinx Inc.	IC FPGA 268 I/O 484FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 268 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存2,592
XC2V80-6CSG144C	Xilinx Inc.	IC FPGA 92 I/O 144CSBGA Number of LABs/CLBs: 128 Number of Logic Elements/Cells: - Total RAM Bits: 147456 Number of I/O: 92 Number of Gates: 80000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存6,272
XCV600-4BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 316 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存3,872
XCV200E-6FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存5,248
XC4062XL-1BG432C	Xilinx Inc.	IC FPGA 352 I/O 432MBGA Number of LABs/CLBs: 2304 Number of Logic Elements/Cells: 5472 Total RAM Bits: 73728 Number of I/O: 352 Number of Gates: 62000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存5,232
XC4005XL-3VQ100I	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 77 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存4,304
XC4013E-4PQ160C	Xilinx Inc.	IC FPGA 129 I/O 160QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 129 Number of Gates: 13000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存2,064
XC5VLX110-3FF676C	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,696
XC5VFX100T-1FF1738C	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 102400 Total RAM Bits: 8404992 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存2,864
XC5VLX85-1FF676C	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,000
XC4VLX40-11FFG668I	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 4608 Number of Logic Elements/Cells: 41472 Total RAM Bits: 1769472 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存7,764
XC4VLX60-10FF1148C	Xilinx Inc.	IC FPGA 640 I/O 1148FCBGA Number of LABs/CLBs: 6656 Number of Logic Elements/Cells: 59904 Total RAM Bits: 2949120 Number of I/O: 640 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	封裝: 1148-BBGA, FCBGA	庫存6,960
XC5VLX50-3FFG324C	Xilinx Inc.	IC FPGA 220 I/O 324FBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 1769472 Number of I/O: 220 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-BBGA, FCBGA Supplier Device Package: 324-FCBGA (19x19)	封裝: 324-BBGA, FCBGA	庫存6,400
XC6SLX75-L1FGG484C	Xilinx Inc.	IC FPGA 280 I/O 484FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 280 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存2,272
XC9536-10VQG44C	Xilinx Inc.	IC CPLD 36MC 10NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存87,036
XCR3512XL-10FGG324C	Xilinx Inc.	IC CPLD 512MC 9NS 324BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 260 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 324-BBGA Supplier Device Package: 324-FBGA (23x23)	封裝: 324-BBGA	庫存4,496
XC9536XL-10VQG44C	Xilinx Inc.	IC CPLD 36MC 10NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存16,116
XC7S50-L1FGGA484I	Xilinx Inc.	XC7S50-L1FGGA484I Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.92 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	封裝: 484-BGA	庫存5,056
XC7S25-1CSGA225Q	Xilinx Inc.	XC7S25-1CSGA225Q Number of LABs/CLBs: - Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存7,704
XCVU5P-1FLVB2104E	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 75072 Number of Logic Elements/Cells: 1313763 Total RAM Bits: 190976000 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存2,592
XCDAISY-FFG1152	Xilinx Inc.	FFG1152 DAISY SAMPLE Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,352

XC18V256SO20C

Xilinx Inc.

IC PROM SRL CONFIG 256K 20-SOIC

Programmable Type: In System Programmable
Memory Size: 256Kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存9,564

XC17S200APD8C

Xilinx Inc.

IC PROM SER 200000 C-TEMP 8-DIP

Programmable Type: OTP
Memory Size: 2Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存5,024

XC17256ELVO8C

Xilinx Inc.

IC 3V SER CFG PROM 256K 8-SOIC

Programmable Type: OTP
Memory Size: 256Kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存133,584

XC18V512PCG20C

Xilinx Inc.

IC PROM REPROGR 512KB 20-PLCC

Programmable Type: In System Programmable
Memory Size: 512kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存33,300

XCZU3EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存7,840

XCZU2CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存7,600

XC7A100T-2FGG676CES9937

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存5,552

XC6SLX75T-4FGG484C

Xilinx Inc.

IC FPGA 268 I/O 484FBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 268
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存2,592

XC2V80-6CSG144C

Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

Number of LABs/CLBs: 128
Number of Logic Elements/Cells: -
Total RAM Bits: 147456
Number of I/O: 92
Number of Gates: 80000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存6,272

XCV600-4BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 316
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存3,872

XCV200E-6FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 176
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存5,248

XC4062XL-1BG432C

Xilinx Inc.

IC FPGA 352 I/O 432MBGA

Number of LABs/CLBs: 2304
Number of Logic Elements/Cells: 5472
Total RAM Bits: 73728
Number of I/O: 352
Number of Gates: 62000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存5,232

XC4005XL-3VQ100I

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 77
Number of Gates: 5000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存4,304

XC4013E-4PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 129
Number of Gates: 13000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存2,064

XC5VLX110-3FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,696

XC5VFX100T-1FF1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 102400
Total RAM Bits: 8404992
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存2,864

XC5VLX85-1FF676C

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3538944
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,000

XC4VLX40-11FFG668I

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 4608
Number of Logic Elements/Cells: 41472
Total RAM Bits: 1769472
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存7,764

XC4VLX60-10FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

Number of LABs/CLBs: 6656
Number of Logic Elements/Cells: 59904
Total RAM Bits: 2949120
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1148-BBGA, FCBGA
Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

庫存6,960

XC5VLX50-3FFG324C

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 1769472
Number of I/O: 220
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-BBGA, FCBGA
Supplier Device Package: 324-FCBGA (19x19)

封裝: 324-BBGA, FCBGA

庫存6,400

XC6SLX75-L1FGG484C

Xilinx Inc.

IC FPGA 280 I/O 484FBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存2,272

XC9536-10VQG44C

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存87,036

XCR3512XL-10FGG324C

Xilinx Inc.

IC CPLD 512MC 9NS 324BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 260
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Supplier Device Package: 324-FBGA (23x23)

封裝: 324-BBGA

庫存4,496

XC9536XL-10VQG44C

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存16,116

XC7S50-L1FGGA484I

Xilinx Inc.

XC7S50-L1FGGA484I

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.92 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

封裝: 484-BGA

庫存5,056

XC7S25-1CSGA225Q

Xilinx Inc.

XC7S25-1CSGA225Q

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存7,704

XCVU5P-1FLVB2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

Number of LABs/CLBs: 75072
Number of Logic Elements/Cells: 1313763
Total RAM Bits: 190976000
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存2,592

XCDAISY-FFG1152

Xilinx Inc.

FFG1152 DAISY SAMPLE

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,352