頁 199 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FF1152	Xilinx Inc.	FF1152 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,640
XC17S10PD8C	Xilinx Inc.	IC PROM PROG C-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 100kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存31,752
XCZU9EG-1FFVB1156E	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,824
XCZU5EG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存6,656
XCZU2CG-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存3,296
XC2V1500-4BG575I	Xilinx Inc.	IC FPGA 392 I/O 575BGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 392 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 575-BBGA Supplier Device Package: 575-BGA (31x31)	封裝: 575-BBGA	庫存6,372
XC2V8000-5FFG1517I	Xilinx Inc.	IC FPGA 1108 I/O 1517FCBGA Number of LABs/CLBs: 11648 Number of Logic Elements/Cells: - Total RAM Bits: 3096576 Number of I/O: 1108 Number of Gates: 8000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存4,688
XC2V500-5FGG256C	Xilinx Inc.	IC FPGA 172 I/O 256FBGA Number of LABs/CLBs: 768 Number of Logic Elements/Cells: - Total RAM Bits: 589824 Number of I/O: 172 Number of Gates: 500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,960
XCV100E-6FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 176 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,016
XCS05-3VQ100I	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 100 Number of Logic Elements/Cells: 238 Total RAM Bits: 3200 Number of I/O: 77 Number of Gates: 5000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存15,900
XC4036XL-1BG432C	Xilinx Inc.	IC FPGA 288 I/O 432MBGA Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 288 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存6,128
XC6VLX365T-3FF1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 28440 Number of Logic Elements/Cells: 364032 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,536
XC6VSX315T-3FF1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 24600 Number of Logic Elements/Cells: 314880 Total RAM Bits: 25952256 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,896
XQ5VLX110-1EF676I	Xilinx Inc.	IC FPGA VIRTEX-5FX 110K 676-FBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,416
XC4VLX60-12FF668C	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 6656 Number of Logic Elements/Cells: 59904 Total RAM Bits: 2949120 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存7,728
XC2VP20-5FGG676C	Xilinx Inc.	IC FPGA 404 I/O 676FBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 404 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存6,672
XC4VLX15-12SF363C	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 13824 Total RAM Bits: 884736 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存4,352
XC6SLX100T-3FG676I	Xilinx Inc.	IC FPGA 376 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 376 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,560
XC3S1600E-4FGG400I	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 3688 Number of Logic Elements/Cells: 33192 Total RAM Bits: 663552 Number of I/O: 304 Number of Gates: 1600000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存31,200
XC3SD1800A-5FGG676C	Xilinx Inc.	IC FPGA 519 I/O 676FBGA Number of LABs/CLBs: 4160 Number of Logic Elements/Cells: 37440 Total RAM Bits: 1548288 Number of I/O: 519 Number of Gates: 1800000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存5,680
XC3S1600E-4FG320I	Xilinx Inc.	IC FPGA 250 I/O 320FBGA Number of LABs/CLBs: 3688 Number of Logic Elements/Cells: 33192 Total RAM Bits: 663552 Number of I/O: 250 Number of Gates: 1600000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 320-BGA Supplier Device Package: 320-FBGA (19x19)	封裝: 320-BGA	庫存6,112
XA3S700A-4FGG400I	Xilinx Inc.	IC FPGA 311 I/O 400FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 311 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存6,368
XC3S50-4VQ100I	Xilinx Inc.	IC FPGA 63 I/O 100VQFP Number of LABs/CLBs: 192 Number of Logic Elements/Cells: 1728 Total RAM Bits: 73728 Number of I/O: 63 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存9,792
XC3S1400A-4FTG256C	Xilinx Inc.	IC FPGA 161 I/O 256FTBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 25344 Total RAM Bits: 589824 Number of I/O: 161 Number of Gates: 1400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存94,236
XC3S200-4VQG100I	Xilinx Inc.	IC FPGA 63 I/O 100VQFP Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 4320 Total RAM Bits: 221184 Number of I/O: 63 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存7,476
XC9572XV-7VQ44C	Xilinx Inc.	IC CPLD 72MC 7.5NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 2.37 V ~ 2.62 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存6,608
XCR3128XL-6CSG144C	Xilinx Inc.	IC CPLD 128MC 144BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 5.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 108 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存3,488
XCDAISY-CPG196	Xilinx Inc.	IC 196 BALL CHIP-SCALE BGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,880

XCMECH-FF1152

Xilinx Inc.

FF1152 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,640

XC17S10PD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 100kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存31,752

XCZU9EG-1FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,824

XCZU5EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存6,656

XCZU2CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存3,296

XC2V1500-4BG575I

Xilinx Inc.

IC FPGA 392 I/O 575BGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: -
Total RAM Bits: 884736
Number of I/O: 392
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 575-BBGA
Supplier Device Package: 575-BGA (31x31)

封裝: 575-BBGA

庫存6,372

XC2V8000-5FFG1517I

Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

Number of LABs/CLBs: 11648
Number of Logic Elements/Cells: -
Total RAM Bits: 3096576
Number of I/O: 1108
Number of Gates: 8000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存4,688

XC2V500-5FGG256C

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

Number of LABs/CLBs: 768
Number of Logic Elements/Cells: -
Total RAM Bits: 589824
Number of I/O: 172
Number of Gates: 500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,960

XCV100E-6FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 176
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,016

XCS05-3VQ100I

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 100
Number of Logic Elements/Cells: 238
Total RAM Bits: 3200
Number of I/O: 77
Number of Gates: 5000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存15,900

XC4036XL-1BG432C

Xilinx Inc.

IC FPGA 288 I/O 432MBGA

Number of LABs/CLBs: 1296
Number of Logic Elements/Cells: 3078
Total RAM Bits: 41472
Number of I/O: 288
Number of Gates: 36000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存6,128

XC6VLX365T-3FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 28440
Number of Logic Elements/Cells: 364032
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,536

XC6VSX315T-3FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 24600
Number of Logic Elements/Cells: 314880
Total RAM Bits: 25952256
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,896

XQ5VLX110-1EF676I

Xilinx Inc.

IC FPGA VIRTEX-5FX 110K 676-FBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,416

XC4VLX60-12FF668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 6656
Number of Logic Elements/Cells: 59904
Total RAM Bits: 2949120
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存7,728

XC2VP20-5FGG676C

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

Number of LABs/CLBs: 2320
Number of Logic Elements/Cells: 20880
Total RAM Bits: 1622016
Number of I/O: 404
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存6,672

XC4VLX15-12SF363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 13824
Total RAM Bits: 884736
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存4,352

XC6SLX100T-3FG676I

Xilinx Inc.

IC FPGA 376 I/O 676FCBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 376
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,560

XC3S1600E-4FGG400I

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 3688
Number of Logic Elements/Cells: 33192
Total RAM Bits: 663552
Number of I/O: 304
Number of Gates: 1600000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存31,200

XC3SD1800A-5FGG676C

Xilinx Inc.

IC FPGA 519 I/O 676FBGA

Number of LABs/CLBs: 4160
Number of Logic Elements/Cells: 37440
Total RAM Bits: 1548288
Number of I/O: 519
Number of Gates: 1800000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存5,680

XC3S1600E-4FG320I

Xilinx Inc.

IC FPGA 250 I/O 320FBGA

Number of LABs/CLBs: 3688
Number of Logic Elements/Cells: 33192
Total RAM Bits: 663552
Number of I/O: 250
Number of Gates: 1600000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 320-BGA
Supplier Device Package: 320-FBGA (19x19)

封裝: 320-BGA

庫存6,112

XA3S700A-4FGG400I

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存6,368

XC3S50-4VQ100I

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

Number of LABs/CLBs: 192
Number of Logic Elements/Cells: 1728
Total RAM Bits: 73728
Number of I/O: 63
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存9,792

XC3S1400A-4FTG256C

Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

Number of LABs/CLBs: 2816
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 161
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存94,236

XC3S200-4VQG100I

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 4320
Total RAM Bits: 221184
Number of I/O: 63
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存7,476

XC9572XV-7VQ44C

Xilinx Inc.

IC CPLD 72MC 7.5NS 44VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 2.37 V ~ 2.62 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存6,608

XCR3128XL-6CSG144C

Xilinx Inc.

IC CPLD 128MC 144BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 5.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 108
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存3,488

XCDAISY-CPG196

Xilinx Inc.

IC 196 BALL CHIP-SCALE BGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,880