頁 198 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCZU7EV-1FFVC1156I	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,888
XC2V250-5FGG456C	Xilinx Inc.	IC FPGA 200 I/O 456FBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: - Total RAM Bits: 442368 Number of I/O: 200 Number of Gates: 250000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存5,680
XA3S250E-4PQG208I	Xilinx Inc.	IC FPGA 158 I/O 208QFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 158 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存3,648
XCV300-4BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 260 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存4,208
XCS10XL-5CS144C	Xilinx Inc.	IC FPGA 112 I/O 144CSBGA Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存5,232
XC4052XL-1HQ240C	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1936 Number of Logic Elements/Cells: 4598 Total RAM Bits: 61952 Number of I/O: 193 Number of Gates: 52000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存2,448
XCVU440-2FLGA2892E	Xilinx Inc.	IC FPGA 1456 I/O 2892FCBGA Number of LABs/CLBs: 316620 Number of Logic Elements/Cells: 5540850 Total RAM Bits: 90726400 Number of I/O: 1456 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2892-BBGA, FCBGA Supplier Device Package: 2892-FCBGA (55x55)	封裝: 2892-BBGA, FCBGA	庫存6,288
XC6VHX380T-2FFG1154C	Xilinx Inc.	IC FPGA 320 I/O 1156FCBGA Number of LABs/CLBs: 29880 Number of Logic Elements/Cells: 382464 Total RAM Bits: 28311552 Number of I/O: 320 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,288
XQ7VX330T-1RF1761I	Xilinx Inc.	IC FPGA VIRTEX-7 330K 1761BGA Number of LABs/CLBs: 25500 Number of Logic Elements/Cells: 326400 Total RAM Bits: 27648000 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,256
XC6VLX365T-2FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 28440 Number of Logic Elements/Cells: 364032 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存20,148
XC7K420T-3FFG1156E	Xilinx Inc.	IC FPGA 400 I/O 1156FCBGA Number of LABs/CLBs: 32575 Number of Logic Elements/Cells: 416960 Total RAM Bits: 30781440 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,088
XC5VLX155T-2FFG1136C	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 12160 Number of Logic Elements/Cells: 155648 Total RAM Bits: 7815168 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存4,512
XC5VFX70T-3FF665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存6,256
XCKU5P-1SFVB784I	Xilinx Inc.	XCKU5P-1SFVB784I Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 35737600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存2,720
XCKU040-1SFVA784C	Xilinx Inc.	IC FPGA 468 I/O 784FCBGA Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Total RAM Bits: 21606000 Number of I/O: 468 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCCSPBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存5,408
XC5VLX50T-1FFG1136I	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 2211840 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存6,208
XC2VP30-6FG676C	Xilinx Inc.	IC FPGA 416 I/O 676FBGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,156
XC4VLX15-11SFG363I	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 13824 Total RAM Bits: 884736 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存6,132
XA3S1000-4FGG456Q	Xilinx Inc.	IC FPGA 333 I/O 456FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 333 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存6,240
XC6SLX9-2FT256I	Xilinx Inc.	IC FPGA 186 I/O 256FTBGA Number of LABs/CLBs: 715 Number of Logic Elements/Cells: 9152 Total RAM Bits: 589824 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存7,040
XC3S50-4PQG208C	Xilinx Inc.	IC FPGA 124 I/O 208 QFP Number of LABs/CLBs: 192 Number of Logic Elements/Cells: 1728 Total RAM Bits: 73728 Number of I/O: 124 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存12,636
XC6SLX4-2CPG196C	Xilinx Inc.	IC FPGA 106 I/O 196CSBGA Number of LABs/CLBs: 300 Number of Logic Elements/Cells: 3840 Total RAM Bits: 221184 Number of I/O: 106 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8x8)	封裝: 196-TFBGA, CSBGA	庫存8,472
XC3S250E-4TQG144I	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 108 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存5,824
XC6SLX4-2CSG225I	Xilinx Inc.	IC FPGA 132 I/O 225CSBGA Number of LABs/CLBs: 300 Number of Logic Elements/Cells: 3840 Total RAM Bits: 221184 Number of I/O: 132 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存20,232
XC95216-20HQ208I	Xilinx Inc.	IC CPLD 216MC 20NS 208HQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 166 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存3,392
XCR3032XL-10CSG48I	Xilinx Inc.	IC CPLD 32MC 9.1NS 48CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 750 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-FBGA, CSPBGA Supplier Device Package: 48-CSBGA (7x7)	封裝: 48-FBGA, CSPBGA	庫存6,016
XC9572XL-10VQG44C	Xilinx Inc.	IC CPLD 72MC 10NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存28,908
XCVU080-H1FFVA2104E	Xilinx Inc.	IC FPGA VIRTEX-U 2104FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.922 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存5,104

XCZU7EV-1FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,888

XC2V250-5FGG456C

Xilinx Inc.

IC FPGA 200 I/O 456FBGA

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: -
Total RAM Bits: 442368
Number of I/O: 200
Number of Gates: 250000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存5,680

XA3S250E-4PQG208I

Xilinx Inc.

IC FPGA 158 I/O 208QFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 158
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存3,648

XCV300-4BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 260
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存4,208

XCS10XL-5CS144C

Xilinx Inc.

IC FPGA 112 I/O 144CSBGA

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 10000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存5,232

XC4052XL-1HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Number of LABs/CLBs: 1936
Number of Logic Elements/Cells: 4598
Total RAM Bits: 61952
Number of I/O: 193
Number of Gates: 52000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存2,448

XCVU440-2FLGA2892E

Xilinx Inc.

IC FPGA 1456 I/O 2892FCBGA

Number of LABs/CLBs: 316620
Number of Logic Elements/Cells: 5540850
Total RAM Bits: 90726400
Number of I/O: 1456
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2892-BBGA, FCBGA
Supplier Device Package: 2892-FCBGA (55x55)

封裝: 2892-BBGA, FCBGA

庫存6,288

XC6VHX380T-2FFG1154C

Xilinx Inc.

IC FPGA 320 I/O 1156FCBGA

Number of LABs/CLBs: 29880
Number of Logic Elements/Cells: 382464
Total RAM Bits: 28311552
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,288

XQ7VX330T-1RF1761I

Xilinx Inc.

IC FPGA VIRTEX-7 330K 1761BGA

Number of LABs/CLBs: 25500
Number of Logic Elements/Cells: 326400
Total RAM Bits: 27648000
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,256

XC6VLX365T-2FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 28440
Number of Logic Elements/Cells: 364032
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存20,148

XC7K420T-3FFG1156E

Xilinx Inc.

IC FPGA 400 I/O 1156FCBGA

Number of LABs/CLBs: 32575
Number of Logic Elements/Cells: 416960
Total RAM Bits: 30781440
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,088

XC5VLX155T-2FFG1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Number of LABs/CLBs: 12160
Number of Logic Elements/Cells: 155648
Total RAM Bits: 7815168
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存4,512

XC5VFX70T-3FF665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 5600
Number of Logic Elements/Cells: 71680
Total RAM Bits: 5455872
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存6,256

XCKU5P-1SFVB784I

Xilinx Inc.

XCKU5P-1SFVB784I

Number of LABs/CLBs: 27120
Number of Logic Elements/Cells: 474600
Total RAM Bits: 35737600
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,720

XCKU040-1SFVA784C

Xilinx Inc.

IC FPGA 468 I/O 784FCBGA

Number of LABs/CLBs: 30300
Number of Logic Elements/Cells: 530250
Total RAM Bits: 21606000
Number of I/O: 468
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCCSPBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存5,408

XC5VLX50T-1FFG1136I

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 2211840
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存6,208

XC2VP30-6FG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

Number of LABs/CLBs: 3424
Number of Logic Elements/Cells: 30816
Total RAM Bits: 2506752
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,156

XC4VLX15-11SFG363I

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 13824
Total RAM Bits: 884736
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存6,132

XA3S1000-4FGG456Q

Xilinx Inc.

IC FPGA 333 I/O 456FBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 333
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存6,240

XC6SLX9-2FT256I

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

Number of LABs/CLBs: 715
Number of Logic Elements/Cells: 9152
Total RAM Bits: 589824
Number of I/O: 186
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存7,040

XC3S50-4PQG208C

Xilinx Inc.

IC FPGA 124 I/O 208 QFP

Number of LABs/CLBs: 192
Number of Logic Elements/Cells: 1728
Total RAM Bits: 73728
Number of I/O: 124
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存12,636

XC6SLX4-2CPG196C

Xilinx Inc.

IC FPGA 106 I/O 196CSBGA

Number of LABs/CLBs: 300
Number of Logic Elements/Cells: 3840
Total RAM Bits: 221184
Number of I/O: 106
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 196-TFBGA, CSBGA
Supplier Device Package: 196-CSPBGA (8x8)

封裝: 196-TFBGA, CSBGA

庫存8,472

XC3S250E-4TQG144I

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 108
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存5,824

XC6SLX4-2CSG225I

Xilinx Inc.

IC FPGA 132 I/O 225CSBGA

Number of LABs/CLBs: 300
Number of Logic Elements/Cells: 3840
Total RAM Bits: 221184
Number of I/O: 132
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存20,232

XC95216-20HQ208I

Xilinx Inc.

IC CPLD 216MC 20NS 208HQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 216
Number of Gates: 4800
Number of I/O: 166
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存3,392

XCR3032XL-10CSG48I

Xilinx Inc.

IC CPLD 32MC 9.1NS 48CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 750
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-FBGA, CSPBGA
Supplier Device Package: 48-CSBGA (7x7)

封裝: 48-FBGA, CSPBGA

庫存6,016

XC9572XL-10VQG44C

Xilinx Inc.

IC CPLD 72MC 10NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存28,908

XCVU080-H1FFVA2104E

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.922 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存5,104