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Xilinx Inc. 產品

記錄 7,167
頁  182/256
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hot XC17S40SO20C
Xilinx Inc.

IC PROM PROG C-TEMP 5V 20-SOIC

  • Programmable Type: OTP
  • Memory Size: 400kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存4,000
XCZU15EG-3FFVC900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
封裝: 900-BBGA, FCBGA
庫存4,528
XCZU7CG-1FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存2,000
hot XC2V500-4FG456I
Xilinx Inc.

IC FPGA 264 I/O 456FBGA

  • Number of LABs/CLBs: 768
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 589824
  • Number of I/O: 264
  • Number of Gates: 500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存15,084
hot XCV800-5BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 4704
  • Number of Logic Elements/Cells: 21168
  • Total RAM Bits: 114688
  • Number of I/O: 404
  • Number of Gates: 888439
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封裝: 560-LBGA, Metal
庫存4,784
XCV400E-8BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 163840
  • Number of I/O: 316
  • Number of Gates: 569952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存3,024
hot XCS30XL-5VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 77
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
封裝: 100-TQFP
庫存39,084
XC4062XL-3BG560I
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 384
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
封裝: 560-LBGA, Metal
庫存4,080
hot XC4005E-3PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 61
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
封裝: 84-LCC (J-Lead)
庫存25,608
XC7VX690T-3FFG1927E
Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1927-FCBGA (45x45)
封裝: 1924-BBGA, FCBGA
庫存7,856
XQ6VLX240T-L1RF784I
Xilinx Inc.

IC FPGA VIRTEX 6 241K 784-BGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: -
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: -
封裝: 784-BBGA, FCBGA
庫存5,104
XC6VSX315T-2FFG1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
封裝: 1156-BBGA, FCBGA
庫存4,656
XC7K410T-2FBG676I
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封裝: 676-BBGA, FCBGA
庫存3,424
XC5VLX30-3FF676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 30720
  • Total RAM Bits: 1179648
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封裝: 676-BBGA, FCBGA
庫存7,072
XC2VP7-5FFG672I
Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存3,296
hot XC7K160T-2FB484I
Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

  • Number of LABs/CLBs: 12675
  • Number of Logic Elements/Cells: 162240
  • Total RAM Bits: 11980800
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
封裝: 484-BBGA, FCBGA
庫存7,072
hot XC4VLX15-10SFG363C
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 884736
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
封裝: 363-FBGA, FCBGA
庫存78,384
hot XC3S1600E-4FGG484I
Xilinx Inc.

IC FPGA 376 I/O 484FBGA

  • Number of LABs/CLBs: 3688
  • Number of Logic Elements/Cells: 33192
  • Total RAM Bits: 663552
  • Number of I/O: 376
  • Number of Gates: 1600000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存11,268
hot XC2VP4-5FG256C
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 752
  • Number of Logic Elements/Cells: 6768
  • Total RAM Bits: 516096
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存4,272
XC2VP2-6FG256C
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存3,152
hot XC3S1400A-5FGG484C
Xilinx Inc.

IC FPGA 375 I/O 484FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 375
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存5,280
XC3S500E-5FG320C
Xilinx Inc.

IC FPGA 232 I/O 320FBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 232
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
封裝: 320-BGA
庫存3,648
hot XC3S400-4FG456C
Xilinx Inc.

IC FPGA 264 I/O 456FBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 264
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存134,988
XC7A35T-L2FTG256E
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33208
  • Total RAM Bits: 1843200
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
封裝: 256-LBGA
庫存6,912
XC6SLX9-3CSG225C
Xilinx Inc.

IC FPGA 160 I/O 225CSBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
封裝: 225-LFBGA, CSPBGA
庫存2,640
hot XC95108-15PQ160C
Xilinx Inc.

IC CPLD 108MC 15NS 160QFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 6
  • Number of Macrocells: 108
  • Number of Gates: 2400
  • Number of I/O: 108
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
封裝: 160-BQFP
庫存7,872
hot XC2C256-7TQG144C
Xilinx Inc.

IC CPLD 256MC 6.7NS 144QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 118
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存79,068
XCKU115-L1FLVD1517I
Xilinx Inc.

IC FPGA

  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Total RAM Bits: 77721600
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.880 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,632