頁 179 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17V01PC20C	Xilinx Inc.	IC PROM SER 1MBIT 3.3V 20-PLCC Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存5,184
XC7Z045-L2FBG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,800
XCZU5CG-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存4,064
XCZU5CG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存3,008
XA7Z020-1CLG400Q	Xilinx Inc.	IC SOC CORTEX A-9 ZYNQ7 400BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	封裝: 400-LFBGA, CSPBGA	庫存5,760
XC6SLX100-N3FG484C	Xilinx Inc.	IC FPGA 326 I/O 484FBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 326 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,016
XC2V2000-5BF957I	Xilinx Inc.	IC FPGA 624 I/O 957FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: - Total RAM Bits: 1032192 Number of I/O: 624 Number of Gates: 2000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 957-BBGA, FCBGA Supplier Device Package: 957-FCBGA (40x40)	封裝: 957-BBGA, FCBGA	庫存4,160
XC6VHX380T-2FF1923CES9945	Xilinx Inc.	IC FPGA 720 I/O 1923FCBGA Number of LABs/CLBs: 29880 Number of Logic Elements/Cells: 382464 Total RAM Bits: 28311552 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存4,816
XCV200-4FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 176 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,624
XCV1600E-7FG860I	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 7776 Number of Logic Elements/Cells: 34992 Total RAM Bits: 589824 Number of I/O: 660 Number of Gates: 2188742 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	封裝: 860-BGA	庫存3,088
XC4020XL-1PQ208C	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 160 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,184
XC7V2000T-L2FHG1761E	Xilinx Inc.	IC FPGA 850 I/O 1761FCBGA Number of LABs/CLBs: 152700 Number of Logic Elements/Cells: 1954560 Total RAM Bits: 47628288 Number of I/O: 850 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (45x45)	封裝: 1760-BBGA, FCBGA	庫存3,904
XCVU125-1FLVA2104I	Xilinx Inc.	IC FPGA 832 I/O 2104FCBGA Number of LABs/CLBs: 89520 Number of Logic Elements/Cells: 1566600 Total RAM Bits: 90726400 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存2,112
XC7VX980T-2FFG1930C	Xilinx Inc.	IC FPGA 900 I/O 1930FCBGA Number of LABs/CLBs: 76500 Number of Logic Elements/Cells: 979200 Total RAM Bits: 55296000 Number of I/O: 900 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1930-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存3,856
XC7VX485T-1FFG1761C	Xilinx Inc.	IC FPGA 700 I/O 1761FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,544
XC5VLX110T-1FFG1738C	Xilinx Inc.	IC FPGA 680 I/O 1738FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 5455872 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存5,568
XC2VP40-7FG676C	Xilinx Inc.	IC FPGA 416 I/O 676FBGA Number of LABs/CLBs: 4848 Number of Logic Elements/Cells: 43632 Total RAM Bits: 3538944 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,016
XQ6SLX75-L1FG484I	Xilinx Inc.	IC FPGA SPARTAN 6 75K 484BGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,624
XC2VP2-7FGG256C	Xilinx Inc.	IC FPGA 140 I/O 256FGBGA Number of LABs/CLBs: 352 Number of Logic Elements/Cells: 3168 Total RAM Bits: 221184 Number of I/O: 140 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存5,744
XC3SD3400A-5FGG676C	Xilinx Inc.	IC FPGA 469 I/O 676FBGA Number of LABs/CLBs: 5968 Number of Logic Elements/Cells: 53712 Total RAM Bits: 2322432 Number of I/O: 469 Number of Gates: 3400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存58,116
XC2S200-5FG456I	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 284 Number of Gates: 200000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存4,352
XC6SLX25-L1FTG256C	Xilinx Inc.	IC FPGA 186 I/O 256FTBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 186 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存2,368
XC7K325T-1FFG900C	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,440
XC95144-10TQ100I	Xilinx Inc.	IC CPLD 144MC 10NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 81 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-LQFP	庫存5,056
XCR3384XL-12FTG256C	Xilinx Inc.	IC CPLD 384MC 10.8NS 256BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,272
XCR3256XL-10PQG208C	Xilinx Inc.	IC CPLD 256MC 9NS 208QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 164 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存10,296
XC2C32A-6VQG44C	Xilinx Inc.	IC CPLD 32MC 5.5NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.5ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 750 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存21,132
XA7S50-1FGGA484Q	Xilinx Inc.	XA7S50-1FGGA484Q Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存2,864

XC17V01PC20C

Xilinx Inc.

IC PROM SER 1MBIT 3.3V 20-PLCC

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存5,184

XC7Z045-L2FBG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,800

XCZU5CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存4,064

XCZU5CG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存3,008

XA7Z020-1CLG400Q

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 400BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)

封裝: 400-LFBGA, CSPBGA

庫存5,760

XC6SLX100-N3FG484C

Xilinx Inc.

IC FPGA 326 I/O 484FBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 326
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,016

XC2V2000-5BF957I

Xilinx Inc.

IC FPGA 624 I/O 957FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: -
Total RAM Bits: 1032192
Number of I/O: 624
Number of Gates: 2000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 957-BBGA, FCBGA
Supplier Device Package: 957-FCBGA (40x40)

封裝: 957-BBGA, FCBGA

庫存4,160

XC6VHX380T-2FF1923CES9945

Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

Number of LABs/CLBs: 29880
Number of Logic Elements/Cells: 382464
Total RAM Bits: 28311552
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存4,816

XCV200-4FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 176
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,624

XCV1600E-7FG860I

Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Number of LABs/CLBs: 7776
Number of Logic Elements/Cells: 34992
Total RAM Bits: 589824
Number of I/O: 660
Number of Gates: 2188742
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 860-BGA
Supplier Device Package: 860-FBGA (42.5x42.5)

封裝: 860-BGA

庫存3,088

XC4020XL-1PQ208C

Xilinx Inc.

IC FPGA 160 I/O 208QFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 160
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,184

XC7V2000T-L2FHG1761E

Xilinx Inc.

IC FPGA 850 I/O 1761FCBGA

Number of LABs/CLBs: 152700
Number of Logic Elements/Cells: 1954560
Total RAM Bits: 47628288
Number of I/O: 850
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (45x45)

封裝: 1760-BBGA, FCBGA

庫存3,904

XCVU125-1FLVA2104I

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

Number of LABs/CLBs: 89520
Number of Logic Elements/Cells: 1566600
Total RAM Bits: 90726400
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存2,112

XC7VX980T-2FFG1930C

Xilinx Inc.

IC FPGA 900 I/O 1930FCBGA

Number of LABs/CLBs: 76500
Number of Logic Elements/Cells: 979200
Total RAM Bits: 55296000
Number of I/O: 900
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1930-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存3,856

XC7VX485T-1FFG1761C

Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,544

XC5VLX110T-1FFG1738C

Xilinx Inc.

IC FPGA 680 I/O 1738FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 5455872
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存5,568

XC2VP40-7FG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

Number of LABs/CLBs: 4848
Number of Logic Elements/Cells: 43632
Total RAM Bits: 3538944
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,016

XQ6SLX75-L1FG484I

Xilinx Inc.

IC FPGA SPARTAN 6 75K 484BGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,624

XC2VP2-7FGG256C

Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

Number of LABs/CLBs: 352
Number of Logic Elements/Cells: 3168
Total RAM Bits: 221184
Number of I/O: 140
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存5,744

XC3SD3400A-5FGG676C

Xilinx Inc.

IC FPGA 469 I/O 676FBGA

Number of LABs/CLBs: 5968
Number of Logic Elements/Cells: 53712
Total RAM Bits: 2322432
Number of I/O: 469
Number of Gates: 3400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存58,116

XC2S200-5FG456I

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 284
Number of Gates: 200000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存4,352

XC6SLX25-L1FTG256C

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 186
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存2,368

XC7K325T-1FFG900C

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,440

XC95144-10TQ100I

Xilinx Inc.

IC CPLD 144MC 10NS 100TQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 144
Number of Gates: 3200
Number of I/O: 81
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-LQFP

庫存5,056

XCR3384XL-12FTG256C

Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 10.8ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,272

XCR3256XL-10PQG208C

Xilinx Inc.

IC CPLD 256MC 9NS 208QFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 164
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存10,296

XC2C32A-6VQG44C

Xilinx Inc.

IC CPLD 32MC 5.5NS 44VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.5ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 750
Number of I/O: 33
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存21,132

XA7S50-1FGGA484Q

Xilinx Inc.

XA7S50-1FGGA484Q

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存2,864