頁 178 - Xilinx Inc. 產品 - 嵌入式 - 現場可編程閘陣列 (FPGA) | 黑森爾電子
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Xilinx Inc. 產品 - 嵌入式 - 現場可編程閘陣列 (FPGA)

記錄 5,652
頁  178/202
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零件編號
製造商
描述
封裝
庫存
數量
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCV300-6PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存7,984
6912
65536
166
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300-6FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 312
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存4,752
6912
65536
312
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300-6BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 316
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存4,224
6912
65536
316
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300-6BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存4,112
6912
65536
260
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300-5PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存15,744
6912
65536
166
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300-5PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存7,368
6912
65536
166
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV300-5FG456I
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 312
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存5,376
6912
65536
312
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300-5FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 312
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存6,672
6912
65536
312
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV300-5BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 316
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存7,824
6912
65536
316
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300-5BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 316
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存4,960
6912
65536
316
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XCV300-5BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存5,248
6912
65536
260
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300-5BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存5,200
6912
65536
260
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300-4PQ240I
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存8,796
6912
65536
166
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300-4PQ240C
Xilinx Inc.

IC FPGA 166 I/O 240QFP

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 166
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存8,124
6912
65536
166
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
hot XCV300-4FG456I
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 312
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存17,244
6912
65536
312
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300-4FG456C
Xilinx Inc.

IC FPGA 312 I/O 456FBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 312
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存3,680
6912
65536
312
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV300-4BG432I
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 316
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存8,436
6912
65536
316
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300-4BG432C
Xilinx Inc.

IC FPGA 316 I/O 432MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 316
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存8,688
6912
65536
316
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
hot XCV300-4BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存7,952
6912
65536
260
322970
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV300-4BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存4,208
6912
65536
260
322970
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV2600E-8FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 12696
  • Number of Logic Elements/Cells: 57132
  • Total RAM Bits: 753664
  • Number of I/O: 804
  • Number of Gates: 3263755
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
封裝: 1156-BBGA
庫存5,584
57132
753664
804
3263755
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
hot XCV2600E-7FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 12696
  • Number of Logic Elements/Cells: 57132
  • Total RAM Bits: 753664
  • Number of I/O: 804
  • Number of Gates: 3263755
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
封裝: 1156-BBGA
庫存4,976
57132
753664
804
3263755
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV2600E-6FG1156C
Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

  • Number of LABs/CLBs: 12696
  • Number of Logic Elements/Cells: 57132
  • Total RAM Bits: 753664
  • Number of I/O: 804
  • Number of Gates: 3263755
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
封裝: 1156-BBGA
庫存3,936
57132
753664
804
3263755
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV200E-8PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 158
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP
庫存2,416
5292
114688
158
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP
240-PQFP (32x32)
XCV200E-8FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存3,616
5292
114688
284
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XCV200E-8FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 176
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-BGA
庫存6,312
5292
114688
176
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XCV200E-8CS144C
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 94
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
封裝: 144-TFBGA, CSPBGA
庫存5,200
5292
114688
94
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
144-TFBGA, CSPBGA
144-LCSBGA (12x12)
hot XCV200E-8BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 260
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
封裝: 352-LBGA, Metal
庫存6,336
5292
114688
260
306393
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)