頁 177 - Xilinx Inc. 產品 - 嵌入式 - 現場可編程閘陣列 (FPGA)

零件編號	製造商	描述	封裝	庫存	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCV200E-7PQ240I	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存3,728	5292	114688	158	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV200E-7PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存3,200	5292	114688	158	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV200E-7FG456I	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 284 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存4,656	5292	114688	284	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV200E-7FG456C	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 284 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存6,368	5292	114688	284	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV200E-7FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存9,612	5292	114688	176	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	256-BGA	256-FBGA (17x17)
XCV200E-7FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存13,764	5292	114688	176	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	256-BGA	256-FBGA (17x17)
XCV200E-7CS144I	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存2,880	5292	114688	94	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	144-TFBGA, CSPBGA	144-LCSBGA (12x12)
XCV200E-7CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存5,600	5292	114688	94	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	144-TFBGA, CSPBGA	144-LCSBGA (12x12)
XCV200E-7BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 260 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存7,168	5292	114688	260	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV200E-7BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 260 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存6,288	5292	114688	260	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV200E-6PQ240I	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存7,472	5292	114688	158	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV200E-6PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 158 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存15,696	5292	114688	158	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP	240-PQFP (32x32)
XCV200E-6FG456I	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 284 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存3,760	5292	114688	284	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV200E-6FG456C	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 284 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存12,552	5292	114688	284	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	456-BBGA	456-FBGA (23x23)
XCV200E-6FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存5,248	5292	114688	176	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	256-BGA	256-FBGA (17x17)
XCV200E-6FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 176 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存18,552	5292	114688	176	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	256-BGA	256-FBGA (17x17)
XCV200E-6CS144I	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存4,800	5292	114688	94	306393	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	144-TFBGA, CSPBGA	144-LCSBGA (12x12)
XCV200E-6CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存7,728	5292	114688	94	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	144-TFBGA, CSPBGA	144-LCSBGA (12x12)
XCV200E-6BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 260 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存7,792	5292	114688	260	306393	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	352-LBGA, Metal	352-MBGA (35x35)
XCV2000E-8FG860C	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 660 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	封裝: 860-BGA	庫存3,616	43200	655360	660	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	860-BGA	860-FBGA (42.5x42.5)
XCV2000E-8FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 512 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存2,400	43200	655360	512	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV2000E-8FG1156C	Xilinx Inc.	IC FPGA 804 I/O 1156FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 804 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	封裝: 1156-BBGA	庫存7,360	43200	655360	804	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	1156-BBGA	1156-FBGA (35x35)
XCV2000E-8BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 404 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	封裝: 560-LBGA, Metal	庫存7,136	43200	655360	404	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV2000E-7FG860I	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 660 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	封裝: 860-BGA	庫存6,528	43200	655360	660	2541952	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	860-BGA	860-FBGA (42.5x42.5)
XCV2000E-7FG860C	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 660 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	封裝: 860-BGA	庫存2,608	43200	655360	660	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	860-BGA	860-FBGA (42.5x42.5)
XCV2000E-7FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 512 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存4,432	43200	655360	512	2541952	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV2000E-7FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 512 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存5,504	43200	655360	512	2541952	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV2000E-7FG1156I	Xilinx Inc.	IC FPGA 804 I/O 1156FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 804 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	封裝: 1156-BBGA	庫存10,164	43200	655360	804	2541952	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	1156-BBGA	1156-FBGA (35x35)

XCV200E-7PQ240I

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 158
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存3,728

5292

114688

158

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

240-BFQFP

240-PQFP (32x32)

XCV200E-7PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 158
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存3,200

5292

114688

158

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

240-BFQFP

240-PQFP (32x32)

XCV200E-7FG456I

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 284
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存4,656

5292

114688

284

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

456-BBGA

456-FBGA (23x23)

XCV200E-7FG456C

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 284
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存6,368

5292

114688

284

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

456-BBGA

456-FBGA (23x23)

XCV200E-7FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 176
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存9,612

5292

114688

176

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

256-BGA

256-FBGA (17x17)

XCV200E-7FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 176
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存13,764

5292

114688

176

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

256-BGA

256-FBGA (17x17)

XCV200E-7CS144I

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 94
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存2,880

5292

114688

94

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

144-TFBGA, CSPBGA

144-LCSBGA (12x12)

XCV200E-7CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 94
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存5,600

5292

114688

94

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

144-TFBGA, CSPBGA

144-LCSBGA (12x12)

XCV200E-7BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 260
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存7,168

5292

114688

260

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

352-LBGA, Metal

352-MBGA (35x35)

XCV200E-7BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 260
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存6,288

5292

114688

260

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

352-LBGA, Metal

352-MBGA (35x35)

XCV200E-6PQ240I

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 158
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存7,472

5292

114688

158

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

240-BFQFP

240-PQFP (32x32)

XCV200E-6PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 158
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存15,696

5292

114688

158

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

240-BFQFP

240-PQFP (32x32)

XCV200E-6FG456I

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 284
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存3,760

5292

114688

284

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

456-BBGA

456-FBGA (23x23)

XCV200E-6FG456C

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 284
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存12,552

5292

114688

284

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

456-BBGA

456-FBGA (23x23)

XCV200E-6FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 176
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存5,248

5292

114688

176

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

256-BGA

256-FBGA (17x17)

XCV200E-6FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 176
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存18,552

5292

114688

176

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

256-BGA

256-FBGA (17x17)

XCV200E-6CS144I

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 94
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存4,800

5292

114688

94

306393

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

144-TFBGA, CSPBGA

144-LCSBGA (12x12)

XCV200E-6CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 94
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存7,728

5292

114688

94

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

144-TFBGA, CSPBGA

144-LCSBGA (12x12)

XCV200E-6BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 260
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存7,792

5292

114688

260

306393

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

352-LBGA, Metal

352-MBGA (35x35)

XCV2000E-8FG860C

Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 660
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 860-BGA
Supplier Device Package: 860-FBGA (42.5x42.5)

封裝: 860-BGA

庫存3,616

43200

655360

660

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

860-BGA

860-FBGA (42.5x42.5)

XCV2000E-8FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 512
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存2,400

43200

655360

512

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV2000E-8FG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 804
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA
Supplier Device Package: 1156-FBGA (35x35)

封裝: 1156-BBGA

庫存7,360

43200

655360

804

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

1156-BBGA

1156-FBGA (35x35)

XCV2000E-8BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 404
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

庫存7,136

43200

655360

404

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV2000E-7FG860I

Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 660
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 860-BGA
Supplier Device Package: 860-FBGA (42.5x42.5)

封裝: 860-BGA

庫存6,528

43200

655360

660

2541952

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

860-BGA

860-FBGA (42.5x42.5)

XCV2000E-7FG860C

Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 660
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 860-BGA
Supplier Device Package: 860-FBGA (42.5x42.5)

封裝: 860-BGA

庫存2,608

43200

655360

660

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

860-BGA

860-FBGA (42.5x42.5)

XCV2000E-7FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 512
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存4,432

43200

655360

512

2541952

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV2000E-7FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 512
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存5,504

43200

655360

512

2541952

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV2000E-7FG1156I

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 804
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA
Supplier Device Package: 1156-FBGA (35x35)

封裝: 1156-BBGA

庫存10,164

43200

655360

804

2541952

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

1156-BBGA

1156-FBGA (35x35)