頁 64 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6S24140HSR3	NXP	FET RF 68V 2.39GHZ NI-88OS Transistor Type: LDMOS Frequency: 2.39GHz Gain: 15.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.3A Power - Output: 28W Voltage - Rated: 68V Package / Case: NI-880S Supplier Device Package: NI-880S	封裝: NI-880S	庫存2,992
BZX284-B68,115	NXP	DIODE ZENER 68V 400MW SOD2 Voltage - Zener (Nom) (Vz): 68V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 160 Ohms Current - Reverse Leakage @ Vr: 50nA @ 47.6V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封裝: SOD-110	庫存3,456
UBA2211BP/N1,112	NXP	IC CFL DRIVER 8DIP Type: CFL/TL Driver Frequency: 40.05kHz ~ 42.68kHz Voltage - Supply: 10.7 V ~ 13.8 V Current - Supply: - Current - Output Source/Sink: 1.35A Dimming: No Operating Temperature: -40°C ~ 150°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	封裝: 8-DIP (0.300", 7.62mm)	庫存4,528
HEF4024BT,652	NXP	IC 7STAGE BINARY COUNTER 14SOIC Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 7 Reset: Asynchronous Timing: - Count Rate: 35MHz Trigger Type: Negative Edge Voltage - Supply: 4.5 V ~ 15.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存4,320
74ABT648D,623	NXP	IC TRANSCEIVER 8BIT INV 24SOIC Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存7,104
PC33663BSEFR2	NXP	DUAL LINCELL 14SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存5,312
SL3FCS1001FV/DH,11	NXP	IC I-CODE SLI FCP2 Applications: - Interface: - Voltage - Supply: - Package / Case: 2-FlipChip Supplier Device Package: FCP2 Mounting Type: Surface Mount	封裝: 2-FlipChip	庫存2,944
P5020NXN1QMB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存4,512
MPC8545VTAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存7,520
XPC850SRZT66BU	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23)	封裝: 256-BGA	庫存3,888
MC860SRCVR50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存4,704
MCHC711KS2CFNE4	NXP	IC MCU 8BIT 32KB OTP 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: 640 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	封裝: 68-LCC (J-Lead)	庫存5,328
MC912DG128AVPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存6,960
S9S12XS256J0CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存3,536
MC9S08PA8VWJ	NXP	IC MCU 8BIT 8KB FLASH 20SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存6,560
SAC57D54HCVMO	NXP	IC MCU 32BIT 4MB FLASH 516MAPBGA Core Processor: ARM? Cortex?-A5, -M4, -M0+ Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 320MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2.3M x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 516-BGA Supplier Device Package: 516-MAPBGA (27x27)	封裝: 516-BGA	庫存10,728
MPX4100AP1	NXP	PRESSURE SENSOR ABSOLUTE 6-SIP Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 4.9 V Accuracy: ±1.8% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	封裝: 6-SIP Module	庫存5,346
MMA5206NDIKGCWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,346
MMA6805AKW	NXP	ACCELEROMETER 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	封裝: 16-QFN Exposed Pad	庫存8,838
TEA6843HL/V1,518	NXP	IC CAR RADIO TUNER 80-LQFP Frequency: AM, FM, WB Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: 90mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 2.5 V ~ 12 V Operating Temperature: -40°C ~ 85°C Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存5,508
MC13821-1575EVK	NXP	KIT EVALUATION MC13821-1575 Type: Amplifier Frequency: 1575.42MHz For Use With/Related Products: - Supplied Contents: -	封裝: -	庫存2,898
MWE6IC9080NBR1	NXP	RF AMP LDMOS TO-272 960MHZ Frequency: 865MHz ~ 960MHz P1dB: 90W Gain: 28.8dB Noise Figure: - RF Type: GSM, EDGE Voltage - Supply: 28V Current - Supply: - Test Frequency: - Package / Case: TO-272-14 Variant, Flat Leads Supplier Device Package: TO-272 WB-14	封裝: TO-272-14 Variant, Flat Leads	庫存8,586
MC35FS4500CAER2	NXP	FS4500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP Exposed Pad	庫存5,136
MC07XSF517BEK	NXP	IC SWITCH 54SOIC Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 18V (Max) Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A, 11A Rds On (Typ): 7 mOhm, 17 mOhm Input Type: - Features: Internal PWM Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-HSOP	封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存7,712
LS1020AXE7MQB	NXP	LS1 32BIT ARM SOC 1.2GHZ DDR3/ Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (1) USB: USB 2.0 (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: -40°C ~ 105°C Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: 525-FBGA, FCBGA	庫存5,168
SPC5674KAVMS2	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z7d Core Size: 32-Bit Dual-Core Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	封裝: 473-LFBGA	庫存4,992
LPC5504JBD64K	NXP	IC MCU 32BIT 128KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 45 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	封裝: -	Request a Quote
MC33FS6505KAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote

MRF6S24140HSR3

NXP

FET RF 68V 2.39GHZ NI-88OS

Transistor Type: LDMOS
Frequency: 2.39GHz
Gain: 15.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.3A
Power - Output: 28W
Voltage - Rated: 68V
Package / Case: NI-880S
Supplier Device Package: NI-880S

封裝: NI-880S

庫存2,992

BZX284-B68,115

NXP

DIODE ZENER 68V 400MW SOD2

Voltage - Zener (Nom) (Vz): 68V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 160 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 47.6V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封裝: SOD-110

庫存3,456

UBA2211BP/N1,112

NXP

IC CFL DRIVER 8DIP

Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Voltage - Supply: 10.7 V ~ 13.8 V
Current - Supply: -
Current - Output Source/Sink: 1.35A
Dimming: No
Operating Temperature: -40°C ~ 150°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

封裝: 8-DIP (0.300", 7.62mm)

庫存4,528

HEF4024BT,652

NXP

IC 7STAGE BINARY COUNTER 14SOIC

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 7
Reset: Asynchronous
Timing: -
Count Rate: 35MHz
Trigger Type: Negative Edge
Voltage - Supply: 4.5 V ~ 15.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存4,320

74ABT648D,623

NXP

IC TRANSCEIVER 8BIT INV 24SOIC

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存7,104

PC33663BSEFR2

NXP

DUAL LINCELL 14SOIC

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存5,312

SL3FCS1001FV/DH,11

NXP

IC I-CODE SLI FCP2

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: 2-FlipChip
Supplier Device Package: FCP2
Mounting Type: Surface Mount

封裝: 2-FlipChip

庫存2,944

P5020NXN1QMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存4,512

MPC8545VTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存7,520

XPC850SRZT66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BGA
Supplier Device Package: 256-PBGA (23x23)

封裝: 256-BGA

庫存3,888

MC860SRCVR50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存4,704

MCHC711KS2CFNE4

NXP

IC MCU 8BIT 32KB OTP 68PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 4MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 51
Program Memory Size: 32KB (32K x 8)
Program Memory Type: OTP
EEPROM Size: 640 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

封裝: 68-LCC (J-Lead)

庫存5,328

MC912DG128AVPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 69
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存6,960

S9S12XS256J0CAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存3,536

MC9S08PA8VWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存6,560

SAC57D54HCVMO

NXP

IC MCU 32BIT 4MB FLASH 516MAPBGA

Core Processor: ARM? Cortex?-A5, -M4, -M0+
Core Size: 32-Bit Tri-Core
Speed: 80MHz, 160MHz, 320MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2.3M x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封裝: 516-BGA

庫存10,728

MPX4100AP1

NXP

PRESSURE SENSOR ABSOLUTE 6-SIP

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
Output Type: Analog Voltage
Output: 0.3 V ~ 4.9 V
Accuracy: ±1.8%
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: Male - 0.19" (4.93mm) Tube
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

封裝: 6-SIP Module

庫存5,346

MMA5206NDIKGCWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,346

MMA6805AKW

NXP

ACCELEROMETER 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

封裝: 16-QFN Exposed Pad

庫存8,838

TEA6843HL/V1,518

NXP

IC CAR RADIO TUNER 80-LQFP

Frequency: AM, FM, WB
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: 90mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 2.5 V ~ 12 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存5,508

MC13821-1575EVK

NXP

KIT EVALUATION MC13821-1575

Type: Amplifier
Frequency: 1575.42MHz
For Use With/Related Products: -
Supplied Contents: -

封裝: -

庫存2,898

MWE6IC9080NBR1

NXP

RF AMP LDMOS TO-272 960MHZ

Frequency: 865MHz ~ 960MHz
P1dB: 90W
Gain: 28.8dB
Noise Figure: -
RF Type: GSM, EDGE
Voltage - Supply: 28V
Current - Supply: -
Test Frequency: -
Package / Case: TO-272-14 Variant, Flat Leads
Supplier Device Package: TO-272 WB-14

封裝: TO-272-14 Variant, Flat Leads

庫存8,586

MC35FS4500CAER2

NXP

FS4500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

庫存5,136

MC07XSF517BEK

NXP

IC SWITCH 54SOIC

Switch Type: General Purpose
Number of Outputs: 6
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 18V (Max)
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): 5.5A, 11A
Rds On (Typ): 7 mOhm, 17 mOhm
Input Type: -
Features: Internal PWM
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-HSOP

封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存7,712

LS1020AXE7MQB

NXP

LS1 32BIT ARM SOC 1.2GHZ DDR3/

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (3)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (1), USB 3.0 + PHY
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C
Security Features: -
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: 525-FBGA, FCBGA

庫存5,168

SPC5674KAVMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封裝: 473-LFBGA

庫存4,992

LPC5504JBD64K

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 96MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 45
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 9x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封裝: -

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MC33FS6505KAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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