頁 61 - NXP 產品 | 黑森爾電子
聯繫我們
SalesDept@heisener.com 86-755-83210559-802
登入/註冊
Language Translation

* Please refer to the English Version as our Official Version.

BOM
購物車 0

NXP 產品

記錄 26,590
頁  61/950
圖片
零件編號
製造商
描述
封裝
庫存
數量
hot MRF19030LR3
NXP

FET RF 65V 1.96GHZ NI-400

  • Transistor Type: LDMOS
  • Frequency: 1.96GHz
  • Gain: 13dB
  • Voltage - Test: 26V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 300mA
  • Power - Output: 30W
  • Voltage - Rated: 65V
  • Package / Case: NI-400
  • Supplier Device Package: NI-400
封裝: NI-400
庫存4,352
hot PCF8566T/1,118
NXP

IC LCD DVR UNVRSL LOW-MUX 40VSOP

  • Display Type: LCD
  • Configuration: 7 Segment + DP, 14 Segment (24 Segment)
  • Interface: I2C
  • Digits or Characters: 6 Characters, 12 Digits, 96 Elements
  • Current - Supply: 30µA
  • Voltage - Supply: 2.5 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 40-BSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 40-VSOP
封裝: 40-BSOP (0.295", 7.50mm Width)
庫存44,400
N74F399D,602
NXP

IC REGISTER QUAD 2PORT 16SOIC

  • Type: Multiplexer
  • Circuit: 4 x 2:1
  • Independent Circuits: 1
  • Current - Output High, Low: 1mA, 20mA
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封裝: 16-SOIC (0.154", 3.90mm Width)
庫存6,960
HEF4557BP,652
NXP

IC SHIFT REGISTER 1-64BIT 16DIP

  • Logic Type: Shift Register
  • Output Type: Complementary
  • Number of Elements: 1
  • Number of Bits per Element: 64
  • Function: Universal
  • Voltage - Supply: 4.5 V ~ 15.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
封裝: 16-DIP (0.300", 7.62mm)
庫存2,976
74LVC623ADB,118
NXP

IC TRANSCVR 8BIT N-INV 20SSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
封裝: 20-SSOP (0.209", 5.30mm Width)
庫存5,616
TDA9886HN/V5,118
NXP

IC IF-PLL DEMOD I2C-BUS 32-HVQFN

  • Type: Demodulator
  • Applications: TV
  • Mounting Type: Surface Mount
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
封裝: 32-VFQFN Exposed Pad
庫存5,856
TDA9886TS/V5,112
NXP

IC IF-PLL DEMOD I2C-BUS 24-SSOP

  • Type: Demodulator
  • Applications: TV
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
封裝: 24-SSOP (0.209", 5.30mm Width)
庫存3,424
NCX2220GU,115
NXP

IC COMPARATOR LOW VOLT 8-HXSON

  • Type: General Purpose
  • Number of Elements: 2
  • Output Type: Rail-to-Rail
  • Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
  • Voltage - Input Offset (Max): 30mV @ 5.5V
  • Current - Input Bias (Max): 1pA
  • Current - Output (Typ): -
  • Current - Quiescent (Max): 5µA
  • CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
  • Propagation Delay (Max): 0.8µs
  • Hysteresis: 20mV
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-XFDFN Exposed Pad
  • Mounting Type: Surface Mount
  • Supplier Device Package: 8-HXSON (1.35x1.7)
封裝: 8-XFDFN Exposed Pad
庫存33,066
NX3L2267GM-Q100X
NXP

IC SWITCH ANLG SPDT 10XQFN

  • Switch Circuit: SPDT
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Number of Circuits: 2
  • On-State Resistance (Max): 750 mOhm
  • Channel-to-Channel Matching (ΔRon): 90 mOhm
  • Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 40ns, 20ns
  • -3db Bandwidth: 60MHz
  • Charge Injection: 37pC
  • Channel Capacitance (CS(off), CD(off)): 35pF
  • Current - Leakage (IS(off)) (Max): 10nA
  • Crosstalk: -90dB @ 100kHz
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 10-XFQFN
  • Supplier Device Package: 10-XQFN (1.55x2)
封裝: 10-XFQFN
庫存6,352
HEF4067BP,652
NXP

IC MUX/DEMUX 4X16 24DIP

  • Switch Circuit: -
  • Multiplexer/Demultiplexer Circuit: 16:1
  • Number of Circuits: 1
  • On-State Resistance (Max): 155 Ohm
  • Channel-to-Channel Matching (ΔRon): 5 Ohm
  • Voltage - Supply, Single (V+): 3 V ~ 15 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): -
  • -3db Bandwidth: 70MHz
  • Charge Injection: -
  • Channel Capacitance (CS(off), CD(off)): 7.5pF
  • Current - Leakage (IS(off)) (Max): 200nA
  • Crosstalk: -50dB @ 1MHz
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 24-DIP (0.600", 15.24mm)
  • Supplier Device Package: 24-DIP
封裝: 24-DIP (0.600", 15.24mm)
庫存3,200
T2081NXE7PTB
NXP

IC SOC 64BIT 8X1.5GHZ 780FCBGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage
  • Package / Case: 780-FBGA, FCBGA
  • Supplier Device Package: 780-FCPBGA (23x23)
封裝: 780-FBGA, FCBGA
庫存5,280
hot MPC8548EPXAQGB
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存5,360
KMPC862TVR100B
NXP

IC MPU MPC8XX 100MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 100MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
封裝: 357-BBGA
庫存4,016
KMPC8540CVT667JB
NXP

IC MPU MPC85XX 667MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 784-BBGA, FCBGA
庫存7,648
XPC850DEVR66BUR2
NXP

IC MPU MPC8XX 66MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
封裝: 256-BBGA
庫存7,184
MC8610TPX800GB
NXP

IC MPU MPC86XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: DIU, LCD
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存2,848
MC908EY8MFAER
NXP

IC MCU 8BIT 8KB FLASH 32LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: LIN, SCI, SPI
  • Peripherals: POR, PWM
  • Number of I/O: 24
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存7,296
MCHC908MR8MFAE
NXP

IC MCU 8BIT 8KB FLASH 32LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 16
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 7x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存3,168
PCF7961ETT/M1AE160
NXP

IC TRANSPONDER ENTRY 20TSSOP

  • Frequency: 315MHz, 434MHz
  • Applications: Remote Keyless Entry
  • Modulation or Protocol: ASK, FSK
  • Data Rate (Max): 20kbps
  • Power - Output: -
  • Current - Transmitting: -
  • Data Interface: PCB, Surface Mount
  • Antenna Connector: PCB, Surface Mount
  • Memory Size: 16KB
  • Features: Programmable
  • Voltage - Supply: 2.1 V ~ 3.6 V
  • Operating Temperature: -
  • Package / Case: -
封裝: -
庫存7,002
MML20242HT1
NXP

IC LNA AMP E-PHEMT 12QFN

  • Frequency: 1.4GHz ~ 2.8GHz
  • P1dB: 24dBm
  • Gain: 34dB
  • Noise Figure: 0.57dB
  • RF Type: LTE, TDS-CDMA, W-CDMA
  • Voltage - Supply: 5V
  • Current - Supply: 160mA
  • Test Frequency: 1.95GHz
  • Package / Case: 12-VFQFN Exposed Pad
  • Supplier Device Package: 12-QFN (3x3)
封裝: 12-VFQFN Exposed Pad
庫存2,340
hot MCF54452VR266R
NXP

MCF5445X 32-BIT MPU COLDFIRE V4

  • Core Processor: Coldfire V4
  • Core Size: 32-Bit
  • Speed: 266MHz
  • Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • Number of I/O: 132
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 360-BBGA
  • Supplier Device Package: 360-PBGA (23x23)
封裝: 360-BBGA
庫存11,652
hot SPC5605BF1VLU6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 149
  • Program Memory Size: 768KB (768K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 29x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
封裝: 176-LQFP
庫存8,004
S9S12HY32J0CLHR
NXP

16-BIT MCU S12 CORE 32KB FLASH

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
  • Peripherals: LCD, Motor control PWM, POR, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存5,776
S9S12G48BCLCR
NXP

S12 CORE,48K FLASH,AU

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存3,904
LPC55S04JBD64E
NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 96MHz
  • Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 45
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 9x16b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-TQFP Exposed Pad
  • Supplier Device Package: 64-HTQFP (10x10)
封裝: -
庫存480
LTA1302RTS-1H
NXP

IC

  • Type: -
  • Protocol: -
  • Number of Drivers/Receivers: -
  • Duplex: -
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
TDF19988AHN-C137Y
NXP

AUTOMOTIVE, 165MHZ HDMI 1.4B TRA

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
MC35FS4508NAE
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
封裝: -
Request a Quote