頁 629 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  629/950
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hot PMV30XN,215
NXP

MOSFET N-CH 20V 3.2A SOT-23

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 20V
  • Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
  • Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
  • Vgs(th) (Max) @ Id: 1.5V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs: 7.4nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds: 420pF @ 15V
  • Vgs (Max): ±12V
  • FET Feature: -
  • Power Dissipation (Max): 380mW (Ta)
  • Rds On (Max) @ Id, Vgs: 35 mOhm @ 3.2A, 4.5V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: TO-236AB (SOT23)
  • Package / Case: TO-236-3, SC-59, SOT-23-3
封裝: TO-236-3, SC-59, SOT-23-3
庫存141,612
BUK7Y35-55B,115
NXP

MOSFET N-CH 55V 28.43A LFPAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 55V
  • Current - Continuous Drain (Id) @ 25°C: 28.43A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 13.1nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 781pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 60W (Tc)
  • Rds On (Max) @ Id, Vgs: 35 mOhm @ 15A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: LFPAK56, Power-SO8
  • Package / Case: SC-100, SOT-669
封裝: SC-100, SOT-669
庫存2,816
LD6836CX4/20P,315
NXP

IC REG LINEAR 2V 300MA 4WLCSP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 2V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.16V @ 300mA
  • Current - Output: 300mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 4-XFBGA, WLCSP
  • Supplier Device Package: 4-WLCSP (0.76x0.76)
封裝: 4-XFBGA, WLCSP
庫存4,464
BUK221-50DY,118
NXP

MOSFET N-CH 50V 4A SOT427

  • Switch Type: General Purpose
  • Number of Outputs: 2
  • Ratio - Input:Output: 1:1
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: On/Off
  • Voltage - Load: 5.5 V ~ 35 V
  • Voltage - Supply (Vcc/Vdd): Not Required
  • Current - Output (Max): 4A
  • Rds On (Typ): 73 mOhm
  • Input Type: Non-Inverting
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
  • Supplier Device Package: D2PAK
封裝: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
庫存7,680
MC33882DH
NXP

IC SWITCH 6X LOW-SIDE 30-HSOP

  • Switch Type: General Purpose
  • Number of Outputs: 6
  • Ratio - Input:Output: 1:1
  • Output Configuration: Low Side
  • Output Type: N-Channel
  • Interface: SPI, Parallel
  • Voltage - Load: 8 V ~ 25 V
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Current - Output (Max): -
  • Rds On (Typ): 400 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 30-HSOP
封裝: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
庫存7,392
74LVT16244BEV,151
NXP

IC BUFF DVR TRI-ST 16BIT 56VFBGA

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 2.7 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFBGA
  • Supplier Device Package: 56-VFBGA (4.5x7)
封裝: 56-VFBGA
庫存6,560
74ABT541DB,112
NXP

IC BUFF/DVR TRI-ST 8BIT 20SSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
封裝: 20-SSOP (0.209", 5.30mm Width)
庫存7,424
SCC2681AC1N40,112
NXP

IC UART DUAL 40-DIP

  • Features: Configurable GPIO, Internal Oscillator, Timer/Counter
  • Number of Channels: 2, DUART
  • FIFO's: -
  • Protocol: -
  • Data Rate (Max): 1Mbps
  • Voltage - Supply: 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: -
  • Mounting Type: Through Hole
  • Package / Case: 40-DIP (0.600", 15.24mm)
  • Supplier Device Package: 40-DIP
封裝: 40-DIP (0.600", 15.24mm)
庫存6,832
PCA9544AD,112
NXP

IC I2C MUX 4CH 20SOIC

  • Applications: Translating Switch
  • Interface: I2C, SMBus
  • Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
  • Mounting Type: Surface Mount
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存7,904
PCA9675BQ,118
NXP

IC I/O EXPANDER I2C 16B 24DHVQFN

  • Number of I/O: 16
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 1MHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-DHVQFN (5.5x3.5)
封裝: 24-VFQFN Exposed Pad
庫存4,224
PCA9554AN,112
NXP

IC I/O EXPANDER I2C 8B 16DIP

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
封裝: 16-DIP (0.300", 7.62mm)
庫存6,432
74LV4053N,112
NXP

IC MUX/DEMUX TRIPLE 2X1 16DIP

  • Switch Circuit: SPDT
  • Multiplexer/Demultiplexer Circuit: 2:1
  • Number of Circuits: 3
  • On-State Resistance (Max): 105 Ohm
  • Channel-to-Channel Matching (ΔRon): 2 Ohm
  • Voltage - Supply, Single (V+): 1 V ~ 6 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 31ns, 24ns
  • -3db Bandwidth: 200MHz
  • Charge Injection: -
  • Channel Capacitance (CS(off), CD(off)): 3.5pF
  • Current - Leakage (IS(off)) (Max): 2µA
  • Crosstalk: -60dB @ 1MHz
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
封裝: 16-DIP (0.300", 7.62mm)
庫存5,232
MPC8572ELVTAULE
NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
封裝: 1023-BFBGA, FCBGA
庫存5,680
hot MCIMX6D5EYM10AD
NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封裝: 624-FBGA, FCBGA
庫存18,864
MC9S08QG44CDTE
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
封裝: 16-TSSOP (0.173", 4.40mm Width)
庫存7,920
MC908JL16CDWER
NXP

IC MCU 8BIT 16KB FLASH 28SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: I2C, SCI
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 23
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存6,544
hot MC9S12H128VPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 16MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: LCD, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封裝: 112-LQFP
庫存11,676
LPC4078FBD144,551
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4032 x 8
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 8x12b, D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存4,128
hot MK40DX256VMC7
NXP

IC MCU 32BIT 256KB FLASH 121BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 74
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 34x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 121-LFBGA
  • Supplier Device Package: 121-MAPBGA (8x8)
封裝: 121-LFBGA
庫存5,072
hot MK60DN512VMC10
NXP

IC MCU 32BIT 512KB FLASH 121BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 86
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 38x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 121-LBGA
  • Supplier Device Package: 121-MAPBGA (8x8)
封裝: 121-LBGA
庫存5,248
SL2S2102FUD,003
NXP

IC I-CODE SLI SOT1122

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 15693, ISO 18000-3
  • Interface: -
  • Voltage - Supply: 1.5 V ~ 1.7 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: Die
  • Supplier Device Package: -
封裝: Die
庫存3,420
BGF844,127
NXP

POWER MODULE GSM800 EDGE SOT365C

  • Frequency: 869MHz ~ 894MHz
  • P1dB: -
  • Gain: 30dB
  • Noise Figure: -
  • RF Type: GSM, EDGE
  • Voltage - Supply: 30V
  • Current - Supply: 245mA ~ 320mA
  • Test Frequency: -
  • Package / Case: SOT-365C
  • Supplier Device Package: SOT-365C
封裝: SOT-365C
庫存4,752
MC33771BTP1AE
NXP

BCC14

  • Function: Battery Cell Controller
  • Battery Chemistry: Lithium-Ion
  • Number of Cells: 7 ~ 14
  • Fault Protection: Over/Under Voltage
  • Interface: TPL
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP Exposed Pad
庫存7,168
SPC5603BF2MLL4
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 384KB (384K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 28K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存4,192
MK63FN1M0VLQ12R
NXP

KINETIS K63: 120MHZ CORTEX-M4F M

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I²S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 41x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存7,456
S32G233ASBK1VUCT
NXP

S32G233A ARM CORTEX-M7 AND -A53,

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
  • Speed: 400MHz, 1GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L, LPDDR4
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1/2.5Gbps (4)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
封裝: -
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FC32K144HFT0MLHT
NXP

IC

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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MC33FS8400G5KS
NXP

SAFETY POWER MANAGEMENT IC, QFN5

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
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