頁 628 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF5S4140HSR5	NXP	FET RF 65V 465MHZ NI-780S Transistor Type: LDMOS Frequency: 465MHz Gain: 21dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.25A Power - Output: 28W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	封裝: NI-780S	庫存4,896
MMRF1312GSR5	NXP	TRANS 960-1215MHZ 1000W PEAK 50V Transistor Type: LDMOS (Dual) Frequency: 1.03GHz Gain: 19.6dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 1000W Voltage - Rated: 112V Package / Case: NI-1230-4S GW Supplier Device Package: NI-1230-4S Gull Wing	封裝: NI-1230-4S GW	庫存5,024
PDTA144TS,126	NXP	TRANS PREBIAS PNP 500MW TO92-3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存3,456
BFU530XAR	NXP	TRANS RF NPN 12V 40MA SOT-143B Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.7dB @ 900MHz Gain: 22dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Current - Collector (Ic) (Max): 40mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	封裝: TO-253-4, TO-253AA	庫存6,192
BAS16T,115	NXP	DIODE GEN PURP 100V 155MA SC75 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 100V Current - Average Rectified (Io): 155mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 500nA @ 80V Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75 Operating Temperature - Junction: 150°C (Max)	封裝: SC-75, SOT-416	庫存6,592
MC68882RC16A	NXP	IC COPROCESSOR FLOAT PT 68-PGA Type: Floating-Point Co-Processor Applications: - Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-PGA (27x27)	封裝: 68-BCPGA	庫存7,744
TL431BSDT,215	NXP	IC VREF SHUNT ADJ SOT23 Reference Type: Shunt Output Type: Adjustable Voltage - Output (Min/Fixed): 2.495V Voltage - Output (Max): 36V Current - Output: 100mA Tolerance: ±0.5% Temperature Coefficient: - Noise - 0.1Hz to 10Hz: - Noise - 10Hz to 10kHz: - Voltage - Input: - Current - Supply: - Current - Cathode: 600µA Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存6,928
74HC283PW,112	NXP	IC 4BIT BINAR FULL ADDER 16TSSOP Logic Type: Binary Full Adder with Fast Carry Supply Voltage: 2 V ~ 6 V Number of Bits: 4 Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存7,872
MC33889DW	NXP	IC SYSTEM BASE W/CAN 28-SOIC Applications: Automotive Interface: CAN Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存12,612
P1017NSN5CFB	NXP	IC MPU Q OR IQ 500MHZ 457TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 500MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 457-LFBGA Supplier Device Package: 457-TEPBGA-1 (19x19)	封裝: 457-LFBGA	庫存3,440
MPC8547EPXAQGD	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存4,992
P2041NSN7PNAC	NXP	IC MPU Q OR IQ 1.5GHZ 780FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	封裝: 780-BBGA, FCBGA	庫存4,160
MPC870CZT133	NXP	IC MPU MPC8XX 133MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	封裝: 256-BBGA	庫存4,448
MC912D60AMFUE8	NXP	IC MCU 16BIT 60KB FLASH 80QFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CAN, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 48 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8/10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存15,396
MK21DX256VLK5	NXP	IC MCU 32BIT 256KB FLASH 80LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 60 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存7,280
S9S12HY32J0CLH	NXP	IC MCU 16BIT 32KB FLASH 64LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存5,552
LPC12H25FBD64/301,	NXP	IC MCU 32BIT ARM 64LQFP Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,520
MK10FX512VLQ12	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 66x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,432
TDA8706AM/C3,518	NXP	IC ADC 6BIT W/MUX 24SSOP Type: ADC, Video RGB Number of Channels: - Resolution (Bits): 6 b Sampling Rate (Per Second): 40M Data Interface: - Voltage Supply Source: Analog and Digital Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	封裝: 24-SSOP (0.209", 5.30mm Width)	庫存4,640
TEA6849H/V1,518	NXP	IC CAR RADIO TUNER 80-LQFP Frequency: AM, FM, WB Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: 88mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 7.8 V ~ 9.2 V Operating Temperature: -40°C ~ 85°C Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存7,650
SA620DK,118	NXP	IC LNA MIXER VCO 1GHZ 20-SSOP Frequency: 800MHz ~ 1.2GHz P1dB: 16dBm (39.8mW) Gain: 11.5dB Noise Figure: 1.3dB ~ 1.9dB RF Type: Cordless Phones, UHF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 10.4mA Test Frequency: 900MHz Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	封裝: 20-LSSOP (0.173", 4.40mm Width)	庫存2,934
TEA19362T/1J	NXP	IC FLYBACK SMPS CTLR 10SO Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: - Topology: Flyback Voltage - Start Up: 14.9V Voltage - Supply (Vcc/Vdd): 0 V ~ 120 V Duty Cycle: - Frequency - Switching: 71kHz Power (Watts): - Fault Protection: Over Power, Over Temperature, Over Voltage Control Features: - Operating Temperature: -25°C ~ 125°C (TJ) Package / Case: 10-SOIC (0.154", 3.90mm Width) Supplier Device Package: 10-SO Mounting Type: Surface Mount	封裝: 10-SOIC (0.154", 3.90mm Width)	庫存2,800
MK20DN512VLK10R	NXP	KINETIS K 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-FQFP (12x12)	封裝: 80-LQFP	庫存2,128
LPC54605J512ET100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (9x9)	封裝: 100-TFBGA	庫存4,720
MPC8313CVRAGDC	NXP	IC MPU POWERQUICC II PRO 516PBGA Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	封裝: 516-BBGA Exposed Pad	庫存6,192
MC33FS8430G0KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
MWCT2016SHT0VPAR	NXP	MWCT2016S,MAXQFP100 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SAF775CHN-N208Z-MP	NXP	CAR RADIO TUNER & AUDIO DSP Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 184-VQFN Multi Row, Exposed Pad Supplier Device Package: 184-HVQFN (12x12)	封裝: -	Request a Quote

MRF5S4140HSR5

NXP

FET RF 65V 465MHZ NI-780S

Transistor Type: LDMOS
Frequency: 465MHz
Gain: 21dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.25A
Power - Output: 28W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

封裝: NI-780S

庫存4,896

MMRF1312GSR5

NXP

TRANS 960-1215MHZ 1000W PEAK 50V

Transistor Type: LDMOS (Dual)
Frequency: 1.03GHz
Gain: 19.6dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 1000W
Voltage - Rated: 112V
Package / Case: NI-1230-4S GW
Supplier Device Package: NI-1230-4S Gull Wing

封裝: NI-1230-4S GW

庫存5,024

PDTA144TS,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存3,456

BFU530XAR

NXP

TRANS RF NPN 12V 40MA SOT-143B

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.7dB @ 900MHz
Gain: 22dB
Power - Max: 450mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Current - Collector (Ic) (Max): 40mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

封裝: TO-253-4, TO-253AA

庫存6,192

BAS16T,115

NXP

DIODE GEN PURP 100V 155MA SC75

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 100V
Current - Average Rectified (Io): 155mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 500nA @ 80V
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)

封裝: SC-75, SOT-416

庫存6,592

MC68882RC16A

NXP

IC COPROCESSOR FLOAT PT 68-PGA

Type: Floating-Point Co-Processor
Applications: -
Mounting Type: Through Hole
Package / Case: 68-BCPGA
Supplier Device Package: 68-PGA (27x27)

封裝: 68-BCPGA

庫存7,744

TL431BSDT,215

NXP

IC VREF SHUNT ADJ SOT23

Reference Type: Shunt
Output Type: Adjustable
Voltage - Output (Min/Fixed): 2.495V
Voltage - Output (Max): 36V
Current - Output: 100mA
Tolerance: ±0.5%
Temperature Coefficient: -
Noise - 0.1Hz to 10Hz: -
Noise - 10Hz to 10kHz: -
Voltage - Input: -
Current - Supply: -
Current - Cathode: 600µA
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存6,928

74HC283PW,112

NXP

IC 4BIT BINAR FULL ADDER 16TSSOP

Logic Type: Binary Full Adder with Fast Carry
Supply Voltage: 2 V ~ 6 V
Number of Bits: 4
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存7,872

MC33889DW

NXP

IC SYSTEM BASE W/CAN 28-SOIC

Applications: Automotive
Interface: CAN
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC
Mounting Type: Surface Mount

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存12,612

P1017NSN5CFB

NXP

IC MPU Q OR IQ 500MHZ 457TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 500MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 457-LFBGA
Supplier Device Package: 457-TEPBGA-1 (19x19)

封裝: 457-LFBGA

庫存3,440

MPC8547EPXAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存4,992

P2041NSN7PNAC

NXP

IC MPU Q OR IQ 1.5GHZ 780FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

封裝: 780-BBGA, FCBGA

庫存4,160

MPC870CZT133

NXP

IC MPU MPC8XX 133MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

封裝: 256-BBGA

庫存4,448

MC912D60AMFUE8

NXP

IC MCU 16BIT 60KB FLASH 80QFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: CAN, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存15,396

MK21DX256VLK5

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存7,280

S9S12HY32J0CLH

NXP

IC MCU 16BIT 32KB FLASH 64LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存5,552

LPC12H25FBD64/301,

NXP

IC MCU 32BIT ARM 64LQFP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,520

MK10FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 66x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,432

TDA8706AM/C3,518

NXP

IC ADC 6BIT W/MUX 24SSOP

Type: ADC, Video RGB
Number of Channels: -
Resolution (Bits): 6 b
Sampling Rate (Per Second): 40M
Data Interface: -
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

封裝: 24-SSOP (0.209", 5.30mm Width)

庫存4,640

TEA6849H/V1,518

NXP

IC CAR RADIO TUNER 80-LQFP

Frequency: AM, FM, WB
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: 88mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 7.8 V ~ 9.2 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存7,650

SA620DK,118

NXP

IC LNA MIXER VCO 1GHZ 20-SSOP

Frequency: 800MHz ~ 1.2GHz
P1dB: 16dBm (39.8mW)
Gain: 11.5dB
Noise Figure: 1.3dB ~ 1.9dB
RF Type: Cordless Phones, UHF
Voltage - Supply: 2.7 V ~ 5.5 V
Current - Supply: 10.4mA
Test Frequency: 900MHz
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

封裝: 20-LSSOP (0.173", 4.40mm Width)

庫存2,934

TEA19362T/1J

NXP

IC FLYBACK SMPS CTLR 10SO

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: -
Topology: Flyback
Voltage - Start Up: 14.9V
Voltage - Supply (Vcc/Vdd): 0 V ~ 120 V
Duty Cycle: -
Frequency - Switching: 71kHz
Power (Watts): -
Fault Protection: Over Power, Over Temperature, Over Voltage
Control Features: -
Operating Temperature: -25°C ~ 125°C (TJ)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 10-SO
Mounting Type: Surface Mount

封裝: 10-SOIC (0.154", 3.90mm Width)

庫存2,800

MK20DN512VLK10R

NXP

KINETIS K 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 27x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-FQFP (12x12)

封裝: 80-LQFP

庫存2,128

LPC54605J512ET100E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)

封裝: 100-TFBGA

庫存4,720

MPC8313CVRAGDC

NXP

IC MPU POWERQUICC II PRO 516PBGA

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

封裝: 516-BBGA Exposed Pad

庫存6,192

MC33FS8430G0KS

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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MWCT2016SHT0VPAR

NXP

MWCT2016S,MAXQFP100

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

SAF775CHN-N208Z-MP

NXP

CAR RADIO TUNER & AUDIO DSP

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 184-VQFN Multi Row, Exposed Pad
Supplier Device Package: 184-HVQFN (12x12)

封裝: -

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