頁 612 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
ON5441,518	NXP	MOSFET RF 20SOIC Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,504
PBSS8110AS,126	NXP	TRANS NPN 100V 1A TO92 Transistor Type: NPN Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 100V Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A Current - Collector Cutoff (Max): 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V Power - Max: 830mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存2,880
PBRP113ES,126	NXP	TRANS PREBIAS PNP 500MW TO92-3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 800mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 1k Resistor - Emitter Base (R2) (Ohms): 1k DC Current Gain (hFE) (Min) @ Ic, Vce: - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存4,864
BZX84-B15/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 15V Tolerance: ±2% Power - Max: 250mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 50nA @ 10.5V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存7,776
SSTUG32865ET/G,518	NXP	IC BUFFER 1.8V 28BIT 160-TFBGA Logic Type: 1:2 Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 28 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 160-TFBGA Supplier Device Package: 160-TFBGA (9x13)	封裝: 160-TFBGA	庫存4,384
74HC283PW,118	NXP	IC 4BIT BINAR FULL ADDER 16TSSOP Logic Type: Binary Full Adder with Fast Carry Supply Voltage: 2 V ~ 6 V Number of Bits: 4 Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存5,136
SC16C852LIET,151	NXP	IC UART DL 1.8V W/FIFO 36-TFBGA Features: - Number of Channels: 2, DUART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 36-TFBGA Supplier Device Package: 36-TFBGA (3.5x3.5)	封裝: 36-TFBGA	庫存2,240
MCZ33903CP3EKR2	NXP	IC SBC CAN HS 3.3V 32SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存4,352
PCA6408AHKX	NXP	IC I/O EXPANDER 8BIT GP 16XQFN Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-XFQFN Supplier Device Package: 16-XQFN (1.8x2.6)	封裝: 16-XFQFN	庫存5,872
MPC8360ECVVAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存7,840
MPC850DEVR80BU	NXP	IC MPU MPC8XX 80MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	封裝: 256-BBGA	庫存2,352
MC7447AHX1000LB	NXP	IC MPU MPC74XX 1.0GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封裝: 360-BCBGA, FCCBGA	庫存6,228
P5040NSE72QC	NXP	IC SOC 64BIT 4X2.2GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 2.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (10), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.2V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存2,928
MCF5216CVM66	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 142 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	封裝: 256-LBGA	庫存8,832
MK51DX256CMC10	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 37x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	封裝: 121-LFBGA	庫存26,472
KMSC8122TMP4800V	NXP	DSP 16BIT QUAD 300MHZ 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 300MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	封裝: 431-BFBGA, FCBGA	庫存3,136
MP3V7007GP	NXP	IC PRESSURE SENSOR 8-SOP Pressure Type: Compound Operating Pressure: ±1.02 PSI (±7 kPa) Output Type: Analog Voltage Output: 0.06 V ~ 2.82 V Accuracy: ±5% Voltage - Supply: 2.7 V ~ 3.3 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbed Features: Amplified Output, Temperature Compensated Termination Style: PCB Maximum Pressure: ±10.88 PSI (±75 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Side Port Supplier Device Package: 8-SOP	封裝: 8-SMD, Gull Wing, Side Port	庫存6,768
MKW31Z256VHT4	NXP	KINETIS L 32-BIT MCU ARM CORTEX- Type: TxRx + MCU RF Family/Standard: Bluetooth Protocol: Bluetooth v4.2 Modulation: - Frequency: 2.4GHz Data Rate (Max): - Power - Output: 4dBm Sensitivity: -102dBm Memory Size: 256kB Flash, 64kB RAM Serial Interfaces: I2C, SPI, UART GPIO: - Voltage - Supply: 1.71 V ~ 3.6 V Current - Receiving: 6.2mA Current - Transmitting: 6mA Operating Temperature: - Package / Case: 48-VFQFN	封裝: 48-VFQFN	庫存18,792
TWR-METRO-KIT-EU	NXP	KIT DEV TOWER METRO EUROPE Type: Transceiver, 6LoWPAN Frequency: - For Use With/Related Products: Freescale Tower System Supplied Contents: 4 Boards	封裝: -	庫存3,114
MC33FS6513NAER2	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP Exposed Pad	庫存5,904
SP5745CFK1AMKU6R	NXP	DUAL CORE 2M FLASH Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP Exposed Pad	庫存5,184
SPC5643LAMLL6	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 64MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存4,240
S912XD64F2CAA	NXP	16-BIT MCU S12X CORE 64KB FLAS Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存5,424
SAF7754HV/N205ZK	NXP	DSP AUDIO MULTI-TUNER Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,024
MWCT1015SFVMH	NXP	WCT1015 100BGA Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	封裝: -	Request a Quote
FD32K142HRT0VLLT	NXP	S32K142, M4F, FLASH 256K, RAM 32 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
NAFE11348B40BSMP	NXP	IC Number of Bits: - Number of Channels: - Power (Watts): - Voltage - Supply, Analog: - Voltage - Supply, Digital: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MPF7100BVBA4ES	NXP	PF7100 PMIC I.MX8DXP/DX Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: -	Request a Quote

ON5441,518

NXP

MOSFET RF 20SOIC

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,504

PBSS8110AS,126

NXP

TRANS NPN 100V 1A TO92

Transistor Type: NPN
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 100V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V
Power - Max: 830mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存2,880

PBRP113ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 800mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 1k
Resistor - Emitter Base (R2) (Ohms): 1k
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存4,864

BZX84-B15/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 15V
Tolerance: ±2%
Power - Max: 250mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 10.5V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存7,776

SSTUG32865ET/G,518

NXP

IC BUFFER 1.8V 28BIT 160-TFBGA

Logic Type: 1:2 Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 2 V
Number of Bits: 28
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 160-TFBGA
Supplier Device Package: 160-TFBGA (9x13)

封裝: 160-TFBGA

庫存4,384

74HC283PW,118

NXP

IC 4BIT BINAR FULL ADDER 16TSSOP

Logic Type: Binary Full Adder with Fast Carry
Supply Voltage: 2 V ~ 6 V
Number of Bits: 4
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存5,136

SC16C852LIET,151

NXP

IC UART DL 1.8V W/FIFO 36-TFBGA

Features: -
Number of Channels: 2, DUART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 36-TFBGA
Supplier Device Package: 36-TFBGA (3.5x3.5)

封裝: 36-TFBGA

庫存2,240

MCZ33903CP3EKR2

NXP

IC SBC CAN HS 3.3V 32SOIC

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存4,352

PCA6408AHKX

NXP

IC I/O EXPANDER 8BIT GP 16XQFN

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 1.65 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Supplier Device Package: 16-XQFN (1.8x2.6)

封裝: 16-XFQFN

庫存5,872

MPC8360ECVVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存7,840

MPC850DEVR80BU

NXP

IC MPU MPC8XX 80MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

封裝: 256-BBGA

庫存2,352

MC7447AHX1000LB

NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

庫存6,228

P5040NSE72QC

NXP

IC SOC 64BIT 4X2.2GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 2.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (10), 10 Gbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.2V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存2,928

MCF5216CVM66

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

封裝: 256-LBGA

庫存8,832

MK51DX256CMC10

NXP

IC MCU 32BIT 256KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 78
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 37x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封裝: 121-LFBGA

庫存26,472

KMSC8122TMP4800V

NXP

DSP 16BIT QUAD 300MHZ 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 300MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

封裝: 431-BFBGA, FCBGA

庫存3,136

MP3V7007GP

NXP

IC PRESSURE SENSOR 8-SOP

Pressure Type: Compound
Operating Pressure: ±1.02 PSI (±7 kPa)
Output Type: Analog Voltage
Output: 0.06 V ~ 2.82 V
Accuracy: ±5%
Voltage - Supply: 2.7 V ~ 3.3 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbed
Features: Amplified Output, Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±10.88 PSI (±75 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Side Port
Supplier Device Package: 8-SOP

封裝: 8-SMD, Gull Wing, Side Port

庫存6,768

MKW31Z256VHT4

NXP

KINETIS L 32-BIT MCU ARM CORTEX-

Type: TxRx + MCU
RF Family/Standard: Bluetooth
Protocol: Bluetooth v4.2
Modulation: -
Frequency: 2.4GHz
Data Rate (Max): -
Power - Output: 4dBm
Sensitivity: -102dBm
Memory Size: 256kB Flash, 64kB RAM
Serial Interfaces: I2C, SPI, UART
GPIO: -
Voltage - Supply: 1.71 V ~ 3.6 V
Current - Receiving: 6.2mA
Current - Transmitting: 6mA
Operating Temperature: -
Package / Case: 48-VFQFN

封裝: 48-VFQFN

庫存18,792

TWR-METRO-KIT-EU

NXP

KIT DEV TOWER METRO EUROPE

Type: Transceiver, 6LoWPAN
Frequency: -
For Use With/Related Products: Freescale Tower System
Supplied Contents: 4 Boards

封裝: -

庫存3,114

MC33FS6513NAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

庫存5,904

SP5745CFK1AMKU6R

NXP

DUAL CORE 2M FLASH

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP Exposed Pad

庫存5,184

SPC5643LAMLL6

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 64MHz
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存4,240

S912XD64F2CAA

NXP

16-BIT MCU S12X CORE 64KB FLAS

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存5,424

SAF7754HV/N205ZK

NXP

DSP AUDIO MULTI-TUNER

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,024

MWCT1015SFVMH

NXP

WCT1015 100BGA

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

封裝: -

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FD32K142HRT0VLLT

NXP

S32K142, M4F, FLASH 256K, RAM 32

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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NAFE11348B40BSMP

NXP

IC

Number of Bits: -
Number of Channels: -
Power (Watts): -
Voltage - Supply, Analog: -
Voltage - Supply, Digital: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MPF7100BVBA4ES

NXP

PF7100 PMIC I.MX8DXP/DX

Applications: i.MX Processors
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: -

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