頁 611 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF7S38010HR5	NXP	FET RF 65V 3.6GHZ NI-400 Transistor Type: LDMOS Frequency: 3.4GHz ~ 3.6GHz Gain: 15dB Voltage - Test: 30V Current Rating: - Noise Figure: - Current - Test: 160mA Power - Output: 2W Voltage - Rated: 65V Package / Case: NI-400-240 Supplier Device Package: NI-400-240	封裝: NI-400-240	庫存6,160
MRF6S9045NR1	NXP	FET RF 68V 880MHZ TO-270-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 22.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 350mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270AA Supplier Device Package: TO-270-2	封裝: TO-270AA	庫存3,856
MMRF1318NR1	NXP	FET RF 110V 450MHZ Transistor Type: LDMOS Frequency: 450MHz Gain: 22dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 900mA Power - Output: 300W Voltage - Rated: 110V Package / Case: TO-270-4 Supplier Device Package: TO-270 WB-4	封裝: TO-270-4	庫存2,336
PVR100AD-B3V3,115	NXP	TRANS NPN 45V 0.1A 6TSOP Transistor Type: NPN + Zener Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Power - Max: 300mW Frequency - Transition: - Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP	封裝: SC-74, SOT-457	庫存6,800
BB182,335	NXP	DIODE VHF VAR CAP 32V SOD523 Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Capacitance Ratio: 22 Capacitance Ratio Condition: C1/C28 Voltage - Peak Reverse (Max): 32V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封裝: SC-79, SOD-523	庫存3,664
PCF8538UG/2DA/1Z	NXP	IC LCD DRIVER UNIV DIE Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, SPI Digits or Characters: 57 Characters, 114 Characters, 918 Elements Current - Supply: 45µA Voltage - Supply: 2.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存2,544
74HC7731N,112	NXP	IC QUAD 64BIT SHIFT REGIS 16-DIP Logic Type: Register, Multiplexed Output Type: Push-Pull Number of Elements: 4 Number of Bits per Element: 64 Function: Universal Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存2,100
UJA1078TW/5V0,112	NXP	IC SBC CAN/DUAL LIN 5V 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存6,368
PCA9554BS3,118	NXP	IC I/O EXPANDER I2C 8B 16HVQFN Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3)	封裝: 16-VFQFN Exposed Pad	庫存3,104
MC8641VU1000NE	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	封裝: 994-BCBGA, FCCBGA	庫存6,064
MPC8379VRANG	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存4,576
MPC860TVR80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存5,616
P87C51RB2BA,512	NXP	IC MCU 8BIT 16KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存4,720
KMI15/2B,115	NXP	MAGNETIC SWITCH SPEC PURP 2SIP Function: Special Purpose Technology: Magnetoresistive Polarization: - Sensing Range: - Test Condition: - Voltage - Supply: 0.5 V ~ 16 V Current - Supply (Max): - Current - Output (Max): 14mA (Typ) Output Type: Current Source Features: Amplified Output, Temperature Compensated Operating Temperature: -40°C ~ 85°C (TA) Package / Case: SOT-453C Supplier Device Package: 2-SIP	封裝: SOT-453C	庫存8,064
MMA7368FLR2	NXP	ACCELEROMETER 1.5G 14LGA Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-VFLGA Supplier Device Package: 14-LGA (3x5)	封裝: 14-VFLGA	庫存5,940
LS1012ASE7EKB	NXP	LS1012A ST WE 600MHZ RV2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,416
MC9S08PA8AVLDR	NXP	S08PA 8-BIT MCU S08 CORE 8KB F Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存5,824
LPC804M111JDH24J	NXP	32-BIT ARM CORTEX-M0+ Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 15MHz Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 20 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存5,952
SE050A2HQ1/Z01SHZ	NXP	ECC AES DES QFN20 Type: IoT Secure Element Applications: Industry 4.0 Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Supplier Device Package: 20-HX2QFN (3x3)	封裝: 20-XFQFN Exposed Pad	庫存5,536
TJA1042TK-3-2Z	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	封裝: -	Request a Quote
MC35FS6505CAE	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
MC33665ATU4AE	NXP	BMS GATEWAY IC UART Function: Power Management Battery Chemistry: - Number of Cells: 3 Fault Protection: - Interface: UART Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
MIMX8QX5GVLFZAC	NXP	I.MX 8X FIPS Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21x21)	封裝: -	Request a Quote
LPC55S36JBD100E	NXP	IC MCU 32BIT 256KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 3x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-HLQFP (14x14)	封裝: -	Request a Quote
MKE13Z128VLH7	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 72MHz Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 58 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
PCF8551ATT-AY	NXP	LCD DRIVER Display Type: LCD Configuration: 36 Segment Interface: I2C Digits or Characters: 9 Characters, 18 Characters, 144 Elements Current - Supply: 1.2 µA Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: -	庫存14,355
SE050D2HQ1-Z01PAZ	NXP	SE050D2HQ1/Z01PAZ Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S912ZVLA64AVFM	NXP	S12Z CPU, 64K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 6x10b; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	封裝: -	Request a Quote

MRF7S38010HR5

NXP

FET RF 65V 3.6GHZ NI-400

Transistor Type: LDMOS
Frequency: 3.4GHz ~ 3.6GHz
Gain: 15dB
Voltage - Test: 30V
Current Rating: -
Noise Figure: -
Current - Test: 160mA
Power - Output: 2W
Voltage - Rated: 65V
Package / Case: NI-400-240
Supplier Device Package: NI-400-240

封裝: NI-400-240

庫存6,160

MRF6S9045NR1

NXP

FET RF 68V 880MHZ TO-270-2

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 22.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 350mA
Power - Output: 10W
Voltage - Rated: 68V
Package / Case: TO-270AA
Supplier Device Package: TO-270-2

封裝: TO-270AA

庫存3,856

MMRF1318NR1

NXP

FET RF 110V 450MHZ

Transistor Type: LDMOS
Frequency: 450MHz
Gain: 22dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 900mA
Power - Output: 300W
Voltage - Rated: 110V
Package / Case: TO-270-4
Supplier Device Package: TO-270 WB-4

封裝: TO-270-4

庫存2,336

PVR100AD-B3V3,115

NXP

TRANS NPN 45V 0.1A 6TSOP

Transistor Type: NPN + Zener
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Power - Max: 300mW
Frequency - Transition: -
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP

封裝: SC-74, SOT-457

庫存6,800

BB182,335

NXP

DIODE VHF VAR CAP 32V SOD523

Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio: 22
Capacitance Ratio Condition: C1/C28
Voltage - Peak Reverse (Max): 32V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封裝: SC-79, SOD-523

庫存3,664

PCF8538UG/2DA/1Z

NXP

IC LCD DRIVER UNIV DIE

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C, SPI
Digits or Characters: 57 Characters, 114 Characters, 918 Elements
Current - Supply: 45µA
Voltage - Supply: 2.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存2,544

74HC7731N,112

NXP

IC QUAD 64BIT SHIFT REGIS 16-DIP

Logic Type: Register, Multiplexed
Output Type: Push-Pull
Number of Elements: 4
Number of Bits per Element: 64
Function: Universal
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存2,100

UJA1078TW/5V0,112

NXP

IC SBC CAN/DUAL LIN 5V 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存6,368

PCA9554BS3,118

NXP

IC I/O EXPANDER I2C 8B 16HVQFN

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-HVQFN (3x3)

封裝: 16-VFQFN Exposed Pad

庫存3,104

MC8641VU1000NE

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

封裝: 994-BCBGA, FCCBGA

庫存6,064

MPC8379VRANG

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存4,576

MPC860TVR80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存5,616

P87C51RB2BA,512

NXP

IC MCU 8BIT 16KB OTP 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存4,720

KMI15/2B,115

NXP

MAGNETIC SWITCH SPEC PURP 2SIP

Function: Special Purpose
Technology: Magnetoresistive
Polarization: -
Sensing Range: -
Test Condition: -
Voltage - Supply: 0.5 V ~ 16 V
Current - Supply (Max): -
Current - Output (Max): 14mA (Typ)
Output Type: Current Source
Features: Amplified Output, Temperature Compensated
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: SOT-453C
Supplier Device Package: 2-SIP

封裝: SOT-453C

庫存8,064

MMA7368FLR2

NXP

ACCELEROMETER 1.5G 14LGA

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 14-VFLGA
Supplier Device Package: 14-LGA (3x5)

封裝: 14-VFLGA

庫存5,940

LS1012ASE7EKB

NXP

LS1012A ST WE 600MHZ RV2

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,416

MC9S08PA8AVLDR

NXP

S08PA 8-BIT MCU S08 CORE 8KB F

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 37
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存5,824

LPC804M111JDH24J

NXP

32-BIT ARM CORTEX-M0+

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 15MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 20
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存5,952

SE050A2HQ1/Z01SHZ

NXP

ECC AES DES QFN20

Type: IoT Secure Element
Applications: Industry 4.0
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Supplier Device Package: 20-HX2QFN (3x3)

封裝: 20-XFQFN Exposed Pad

庫存5,536

TJA1042TK-3-2Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 120 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

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MC35FS6505CAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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MC33665ATU4AE

NXP

BMS GATEWAY IC UART

Function: Power Management
Battery Chemistry: -
Number of Cells: 3
Fault Protection: -
Interface: UART
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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MIMX8QX5GVLFZAC

NXP

I.MX 8X FIPS

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width: 3 Core, 64-Bit
Speed: 1.2GHz, 264MHz
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Package / Case: 609-BFBGA
Supplier Device Package: 609-FBGA (21x21)

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LPC55S36JBD100E

NXP

IC MCU 32BIT 256KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 23x16b; D/A 3x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-HLQFP (14x14)

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MKE13Z128VLH7

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 72MHz
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Number of I/O: 58
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

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PCF8551ATT-AY

NXP

LCD DRIVER

Display Type: LCD
Configuration: 36 Segment
Interface: I2C
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Current - Supply: 1.2 µA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

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SE050D2HQ1-Z01PAZ

NXP

SE050D2HQ1/Z01PAZ

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

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S912ZVLA64AVFM

NXP

S12Z CPU, 64K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 6x10b; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

封裝: -

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