頁 532 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  532/950
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AFT18S260W31SR3
NXP

IC TRANS RF LDMOS

  • Transistor Type: LDMOS
  • Frequency: 1.88GHz
  • Gain: 19.6dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.8A
  • Power - Output: 50W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S-2L2LA
  • Supplier Device Package: NI-780S-2L2LA
封裝: NI-780S-2L2LA
庫存5,216
PDTA144EE,115
NXP

TRANS PREBIAS PNP 150MW SC75

  • Transistor Type: PNP - Pre-Biased
  • Current - Collector (Ic) (Max): 100mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 47k
  • Resistor - Emitter Base (R2) (Ohms): 47k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
  • Current - Collector Cutoff (Max): 100nA (ICBO)
  • Frequency - Transition: -
  • Power - Max: 150mW
  • Mounting Type: Surface Mount
  • Package / Case: SC-75, SOT-416
  • Supplier Device Package: SC-75
封裝: SC-75, SOT-416
庫存6,064
BFR93AW,135
NXP

TRANS NPN 12V 35MA 5GHZ SOT323

  • Transistor Type: NPN
  • Voltage - Collector Emitter Breakdown (Max): 12V
  • Frequency - Transition: 5GHz
  • Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
  • Gain: -
  • Power - Max: 300mW
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
  • Current - Collector (Ic) (Max): 35mA
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: SC-70, SOT-323
  • Supplier Device Package: SOT-323-3
封裝: SC-70, SOT-323
庫存7,200
TEA18363T/1J
NXP

IC CTRLR SMPS DCM/QR 8SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): No
  • Voltage - Breakdown: -
  • Topology: Flyback
  • Voltage - Start Up: 14.9V
  • Voltage - Supply (Vcc/Vdd): 9.9 V ~ 30 V
  • Duty Cycle: -
  • Frequency - Switching: 25kHz ~ 132.5kHz
  • Power (Watts): 75W
  • Fault Protection: Over Power, Over Temperature, Over Voltage
  • Control Features: -
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
  • Mounting Type: Surface Mount
封裝: 8-SOIC (0.154", 3.90mm Width)
庫存2,304
HEF4068BT,653
NXP

IC GATE NAND 1CH 8-INP 14-SO

  • Logic Type: NAND Gate
  • Number of Circuits: 1
  • Number of Inputs: 8
  • Features: -
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): 4µA
  • Current - Output High, Low: 3mA, 3mA
  • Logic Level - Low: 1.5 V ~ 4 V
  • Logic Level - High: 3.5 V ~ 11 V
  • Max Propagation Delay @ V, Max CL: 65ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-SO
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
封裝: 14-SOIC (0.154", 3.90mm Width)
庫存7,152
74LVC543APW,118
NXP

IC REGISTERED TXRX 8BIT 24TSSOP

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
封裝: 24-TSSOP (0.173", 4.40mm Width)
庫存7,040
MC145483EJ
NXP

IC CODEC-FI 13BIT 3V 20-TSSOP

  • Type: PCM, Filter
  • Data Interface: PCM Audio Interface
  • Resolution (Bits): 13 b
  • Number of ADCs / DACs: 1 / 1
  • Sigma Delta: No
  • S/N Ratio, ADCs / DACs (db) Typ: -
  • Dynamic Range, ADCs / DACs (db) Typ: -
  • Voltage - Supply, Analog: -
  • Voltage - Supply, Digital: 2.7 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存4,608
P89LPC922FDH,512
NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 18MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存2,400
S912XEP100BCAG
NXP

IC MCU 16BIT 1MB FLASH 144LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 119
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 24x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存3,440
MKL14Z64VFT4
NXP

IC MCU 32BIT 64KB FLASH 48QFN

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 15x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
封裝: 48-VFQFN Exposed Pad
庫存7,840
MC908KX8CDWE
NXP

IC MCU 8BIT 8KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
封裝: 16-SOIC (0.295", 7.50mm Width)
庫存9,444
MKE06Z128VLK4
NXP

IC MCU 32BIT 128KB FLASH 80LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CAN, I2C, SPI, UART/USART
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 71
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 2x6b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (14x14)
封裝: 80-LQFP
庫存9,108
ASC8851ET/M2,551
NXP

IC IP CAMERA MPU SXGA TFBGA

  • Applications: Embedded Multimedia Communication, Security and Entertainment
  • Core Processor: ARM9?
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
  • Number of I/O: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 484-TFBGA
  • Supplier Device Package: 484-TFBGA (15x15)
封裝: 484-TFBGA
庫存6,912
MMA9553LT
NXP

ACCELEROMETER 2-8G I2C/SPI 16LGA

  • Type: Digital
  • Axis: X, Y, Z
  • Acceleration Range: ±2g, 4g, 8g
  • Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
  • Sensitivity (mV/g): -
  • Bandwidth: 1.9Hz ~ 244Hz
  • Output Type: I2C, SPI
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-VFLGA
  • Supplier Device Package: 16-LGA (3x3)
封裝: 16-VFLGA
庫存5,814
PN5110A0HN1/C2,151
NXP

IC TRANSMISSION MOD 32-HVQFN

  • Type: RFID Reader/Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE, NFC
  • Interface: I2C, SPI, UART
  • Voltage - Supply: 1.6 V ~ 3.6 V
  • Operating Temperature: -30°C ~ 85°C
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
封裝: 32-VFQFN Exposed Pad
庫存8,082
LS1026ASN8T1A
NXP

QORIQ LAYERSCAPE 2XA72 64BIT ARM

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,376
LS1023AXE7PQB
NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存4,848
MCIMX6S5DVM10ADR
NXP

II.MX 6S ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
封裝: 624-LFBGA
庫存3,776
S912XEQ512F1VAL
NXP

16-BIT MCU S12X CORE 512KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封裝: 112-LQFP
庫存2,144
S9S12GA192F0MLFR
NXP

16-BIT MCU S12 CORE 192KB FLAS

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 192KB (192K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 11K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存6,576
S9S08SL16F1MTJR
NXP

8-BIT MCU S08 CORE 16KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I²C, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存3,136
S9S12GN48F0MLF
NXP

16-BIT MCU S12 CORE 48KB FLASH

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存5,360
PCF8553DTT-AY
NXP

LCD DRIVER

  • Display Type: LCD
  • Configuration: 40 Segment
  • Interface: I2C, SPI
  • Digits or Characters: 10 Characters, 20 Characters, 160 Elements
  • Current - Supply: 1.2 µA
  • Voltage - Supply: 1.8V ~ 5.5V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 56-TSSOP
封裝: -
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S9S12GN32J0VFTR
NXP

IC MCU 16BIT 32KB FLASH 48TFQFN

  • Core Processor: S12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-TFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
封裝: -
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LPC55S26JEV98E
NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 64
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 144K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 98-VFBGA
  • Supplier Device Package: 98-VFBGA (7x7)
封裝: -
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MPF5020CMMACES
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
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PCF85053ATKJ
NXP

IC CPU RTC I2C SOT2413-1

  • Type: Clock/Calendar
  • Features: Alarm, Daylight Savings, Leap Year, SRAM
  • Memory Size: 128B
  • Time Format: HH:MM:SS (12/24 hr)
  • Date Format: YY-MM-DD
  • Interface: I2C
  • Voltage - Supply: 1.7V ~ 3.6V
  • Voltage - Supply, Battery: 1.55V ~ 3.6V
  • Current - Timekeeping (Max): 1mA @ 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 12-VFDFN Exposed Pad
  • Supplier Device Package: 12-HVSON (3x3)
封裝: -
庫存35,853
MC33PF8100FJES
NXP

POWER MANAGEMENT IC, I.MX8, PRE-

  • Applications: Processor
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
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