頁 530 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PCF8576CH/1,118	NXP	IC LCD DRIVER 64-LQFP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, 2-Wire Serial Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 120µA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存3,584
CBT6810PW,118	NXP	IC BUS SWITCH 10BIT 24TSSOP Type: Bus Switch Circuit: 10 x 1:1 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存7,040
HSTL16918DGG,512	NXP	IC MEMORY ADDRESS LATCH 48TSSOP Logic Type: D-Type Latch Circuit: 9:18 Output Type: Tri-State Voltage - Supply: 3.15 V ~ 3.45 V Independent Circuits: 1 Delay Time - Propagation: 3.4ns Current - Output High, Low: 24mA, 24mA Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存4,464
74LVC646AD,112	NXP	IC TRANSCEIVER 8BIT N-INV 24SOIC Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存5,760
MCZ33897BEFR2	NXP	IC TXRX CAN SGL WIRE 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 500mV Data Rate: 83.33Kbps Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,320
MC145574APB	NXP	IC TRANSCEIVER ISDN 32-LQFP Type: Transceiver Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存28,488
MPC8323VRADDC	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存6,084
KMPC8255AVVPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	封裝: 480-LBGA	庫存2,016
MPC8272ZQTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存5,152
P1020NXN2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存39,780
MCHLC908QT1PE	NXP	IC MCU 8BIT 1.5KB FLASH 8DIP Core Processor: HC08 Core Size: 8-Bit Speed: 2MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存6,832
MC68HC16Z1CEH20	NXP	IC MCU 16BIT ROMLESS 132QFP Core Processor: CPU16 Core Size: 16-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 16 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	封裝: 132-BQFP Bumpered	庫存5,872
MKM33Z64CLL5R	NXP	IC MCU 32BIT 64KB FLASH 100LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Number of I/O: 68 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, 4x24b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,112
MK50DX256CMC10	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	封裝: 121-LFBGA	庫存6,480
MKL26Z64VFM4	NXP	IC MCU 32BIT 64KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存19,692
TDA8771AH/C1,557	NXP	IC VIDEO DAC 8BIT TRIPLE 44-QFP Number of Bits: 8 Number of D/A Converters: 3 Settling Time: 15µs (Typ) Output Type: Voltage - Buffered Differential Output: No Data Interface: Parallel Reference Type: Internal Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V INL/DNL (LSB): ±0.5, ±0.25 Architecture: String DAC Operating Temperature: 0°C ~ 70°C Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10) Mounting Type: -	封裝: 44-QFP	庫存4,912
MC145158DW2	NXP	IC SER-IN PLL FREQ SYNTH 16-SOIC Type: PLL Clock/Frequency Synthesizer PLL: Yes Input: Clock Output: Clock Number of Circuits: 1 Ratio - Input:Output: 1:1 Differential - Input:Output: No/No Frequency - Max: 25MHz Divider/Multiplier: Yes/No Voltage - Supply: 3 V ~ 9 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存60,120
SA620DK,112	NXP	IC LNA MIXER VCO 1GHZ 20SSOP Frequency: 800MHz ~ 1.2GHz P1dB: 16dBm (39.8mW) Gain: 11.5dB Noise Figure: 1.3dB ~ 1.9dB RF Type: Cordless Phones, UHF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 10.4mA Test Frequency: 900MHz Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	封裝: 20-LSSOP (0.173", 4.40mm Width)	庫存6,102
MC33771BTP2AER2	NXP	BCC14 Function: Battery Cell Controller Battery Chemistry: Lithium-Ion Number of Cells: 7 ~ 14 Fault Protection: Over/Under Voltage Interface: TPL Operating Temperature: -40°C ~ 105°C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP Exposed Pad	庫存2,000
MIMX8MD6DVAJZAA	NXP	I.MX 8MDUAL 17X17 NO LID Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE SATA: - USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	封裝: 621-FBGA, FCBGA	庫存5,552
LPC54605J256ET100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (9x9)	封裝: 100-TFBGA	庫存7,040
S912ZVC12F0VKHR	NXP	MAGNIV 16-BIT MCU S12Z CORE 12 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP Exposed Pad	庫存4,864
MC34PF8100CCEP	NXP	IC POWER MANAGEMENT I.MX8QXP Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: 56-VFQFN Exposed Pad	庫存4,064
MIMX8US3CVP08SA	NXP	8ULP SINGLE CORTEX A35 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S32K328GHT1VPCST	NXP	IC Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 240MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: 142 Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 1.125M x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 172-QFP Exposed Pad Supplier Device Package: 172-QFP-EP	封裝: -	Request a Quote
MGD3160AM535EKT	NXP	GATE DRIVER Driven Configuration: High-Side Channel Type: Single Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Voltage - Supply: 4.5V ~ 40V Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): 15A, 15A Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	封裝: -	庫存786
MC33FS8410G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
MC33FS8425G0ES	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote

PCF8576CH/1,118

NXP

IC LCD DRIVER 64-LQFP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C, 2-Wire Serial
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 120µA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存3,584

CBT6810PW,118

NXP

IC BUS SWITCH 10BIT 24TSSOP

Type: Bus Switch
Circuit: 10 x 1:1
Independent Circuits: 1
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存7,040

HSTL16918DGG,512

NXP

IC MEMORY ADDRESS LATCH 48TSSOP

Logic Type: D-Type Latch
Circuit: 9:18
Output Type: Tri-State
Voltage - Supply: 3.15 V ~ 3.45 V
Independent Circuits: 1
Delay Time - Propagation: 3.4ns
Current - Output High, Low: 24mA, 24mA
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存4,464

74LVC646AD,112

NXP

IC TRANSCEIVER 8BIT N-INV 24SOIC

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存5,760

MCZ33897BEFR2

NXP

IC TXRX CAN SGL WIRE 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 500mV
Data Rate: 83.33Kbps
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,320

MC145574APB

NXP

IC TRANSCEIVER ISDN 32-LQFP

Type: Transceiver
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存28,488

MPC8323VRADDC

NXP

IC MPU MPC83XX 266MHZ 516BGA

Core Processor: PowerPC e300c2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存6,084

KMPC8255AVVPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

封裝: 480-LBGA

庫存2,016

MPC8272ZQTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存5,152

P1020NXN2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存39,780

MCHLC908QT1PE

NXP

IC MCU 8BIT 1.5KB FLASH 8DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 2MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存6,832

MC68HC16Z1CEH20

NXP

IC MCU 16BIT ROMLESS 132QFP

Core Processor: CPU16
Core Size: 16-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 16
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

封裝: 132-BQFP Bumpered

庫存5,872

MKM33Z64CLL5R

NXP

IC MCU 32BIT 64KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 68
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x16b, 4x24b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,112

MK50DX256CMC10

NXP

IC MCU 32BIT 256KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 78
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 27x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封裝: 121-LFBGA

庫存6,480

MKL26Z64VFM4

NXP

IC MCU 32BIT 64KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存19,692

TDA8771AH/C1,557

NXP

IC VIDEO DAC 8BIT TRIPLE 44-QFP

Number of Bits: 8
Number of D/A Converters: 3
Settling Time: 15µs (Typ)
Output Type: Voltage - Buffered
Differential Output: No
Data Interface: Parallel
Reference Type: Internal
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
INL/DNL (LSB): ±0.5, ±0.25
Architecture: String DAC
Operating Temperature: 0°C ~ 70°C
Package / Case: 44-QFP
Supplier Device Package: 44-PQFP (10x10)
Mounting Type: -

封裝: 44-QFP

庫存4,912

MC145158DW2

NXP

IC SER-IN PLL FREQ SYNTH 16-SOIC

Type: PLL Clock/Frequency Synthesizer
PLL: Yes
Input: Clock
Output: Clock
Number of Circuits: 1
Ratio - Input:Output: 1:1
Differential - Input:Output: No/No
Frequency - Max: 25MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存60,120

SA620DK,112

NXP

IC LNA MIXER VCO 1GHZ 20SSOP

Frequency: 800MHz ~ 1.2GHz
P1dB: 16dBm (39.8mW)
Gain: 11.5dB
Noise Figure: 1.3dB ~ 1.9dB
RF Type: Cordless Phones, UHF
Voltage - Supply: 2.7 V ~ 5.5 V
Current - Supply: 10.4mA
Test Frequency: 900MHz
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

封裝: 20-LSSOP (0.173", 4.40mm Width)

庫存6,102

MC33771BTP2AER2

NXP

BCC14

Function: Battery Cell Controller
Battery Chemistry: Lithium-Ion
Number of Cells: 7 ~ 14
Fault Protection: Over/Under Voltage
Interface: TPL
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP Exposed Pad

庫存2,000

MIMX8MD6DVAJZAA

NXP

I.MX 8MDUAL 17X17 NO LID

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.3GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet: GbE
SATA: -
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

封裝: 621-FBGA, FCBGA

庫存5,552

LPC54605J256ET100E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)

封裝: 100-TFBGA

庫存7,040

S912ZVC12F0VKHR

NXP

MAGNIV 16-BIT MCU S12Z CORE 12

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 16x10b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP Exposed Pad

庫存4,864

MC34PF8100CCEP

NXP

IC POWER MANAGEMENT I.MX8QXP

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: 56-VFQFN Exposed Pad

庫存4,064

MIMX8US3CVP08SA

NXP

8ULP SINGLE CORTEX A35

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

S32K328GHT1VPCST

NXP

IC

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 240MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: 142
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 1.125M x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 172-QFP Exposed Pad
Supplier Device Package: 172-QFP-EP

封裝: -

Request a Quote

MGD3160AM535EKT

NXP

GATE DRIVER

Driven Configuration: High-Side
Channel Type: Single
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Voltage - Supply: 4.5V ~ 40V
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): 15A, 15A
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

封裝: -

庫存786

MC33FS8410G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote

MC33FS8425G0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

Request a Quote