頁 454 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  454/950
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ON5223,118
NXP

MOSFET RF SOT426 D2PAK

  • Transistor Type: -
  • Frequency: -
  • Gain: -
  • Voltage - Test: -
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: -
  • Power - Output: -
  • Voltage - Rated: -
  • Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
  • Supplier Device Package: SOT-426
封裝: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
庫存6,640
hot MRF5S9101NR1
NXP

FET RF 68V 960MHZ TO-270-4

  • Transistor Type: LDMOS
  • Frequency: 960MHz
  • Gain: 17.5dB
  • Voltage - Test: 26V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 700mA
  • Power - Output: 100W
  • Voltage - Rated: 68V
  • Package / Case: TO-270AB
  • Supplier Device Package: TO-270 WB-4
封裝: TO-270AB
庫存6,544
PDTC143EEF,115
NXP

TRANS PREBIAS NPN 250MW SC89

  • Transistor Type: NPN - Pre-Biased
  • Current - Collector (Ic) (Max): 100mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 4.7k
  • Resistor - Emitter Base (R2) (Ohms): 4.7k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
  • Current - Collector Cutoff (Max): 1µA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: SC-89, SOT-490
  • Supplier Device Package: SC-89
封裝: SC-89, SOT-490
庫存7,408
PZM3.0NB,115
NXP

DIODE ZENER 3V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 3V
  • Tolerance: ±5%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 95 Ohms
  • Current - Reverse Leakage @ Vr: 10µA @ 1V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封裝: TO-236-3, SC-59, SOT-23-3
庫存7,856
LD6815TD/28P,125
NXP

IC REG LINEAR 2.8V 150MA 5TSOP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 2.8V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.25V @ 150mA (Typ)
  • Current - Output: 150mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 35µA ~ 150µA
  • PSRR: 75dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Transient Voltage
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: SC-74A, SOT-753
  • Supplier Device Package: 5-TSOP
封裝: SC-74A, SOT-753
庫存2,784
MC44BC374EJB
NXP

IC MODULATOR ANT BOOSTER 24TSSOP

  • Type: Modulator
  • Applications: Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
封裝: 24-TSSOP (0.173", 4.40mm Width)
庫存6,512
PCA9502BS,157
NXP

IC I/O EXPANDER I2C/SPI 24HVQFN

  • Number of I/O: 8
  • Interface: I2C, SPI
  • Interrupt Output: No
  • Features: -
  • Output Type: Push-Pull
  • Current - Output Source/Sink: -
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
封裝: 24-VFQFN Exposed Pad
庫存4,992
P2040NXE1MMB
NXP

IC MPU Q OR IQ 1.2GHZ 780FCBGA

  • Core Processor: PowerPC e500mc
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Security; SEC 4.2
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (5)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: -
  • Supplier Device Package: 780-FCPBGA (23x23)
封裝: -
庫存5,168
MPC8323ECVRADDC
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
封裝: 516-BBGA
庫存3,392
P1013NXN2HFB
NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.055GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
封裝: 689-BBGA Exposed Pad
庫存7,376
MCIMX6U5DVM10ACR
NXP

IC MPU I.MX6DL 1.0GHZ 624MAPBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-LFBGA
  • Supplier Device Package: 624-MAPBGA (21x21)
封裝: 624-LFBGA
庫存3,296
hot MPC850DSLZQ50BU
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
封裝: 256-BBGA
庫存4,800
MC9S08DV16MLF
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存4,656
P89V51RC2FA,512
NXP

IC MCU 8BIT 32KB FLASH 44PLCC

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存6,880
hot MCF52256CVN66
NXP

IC MCU 32BIT 256KB FLASH 144BGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 66MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 96
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
封裝: 144-LBGA
庫存29,436
hot S9S12G192F0VLL
NXP

IC MCU 16BIT 192KB FLASH 100LQFP

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 86
  • Program Memory Size: 192KB (192K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 11K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存7,424
TEA6360T/V2,518
NXP

IC STEREO EQUALIZER CIRC 32SO

  • Function: Audio Tone Processor
  • Applications: Automotive Audio, Consumer Audio
  • Number of Channels: 2
  • Interface: I2C
  • Voltage - Supply: 7 V ~ 13.2 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Specifications: 5-Band
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SO
封裝: 32-SOIC (0.295", 7.50mm Width)
庫存6,256
MMA6341LR2
NXP

ACCELEROMETER 3-9G ANALOG 14LGA

  • Type: Analog
  • Axis: X, Y
  • Acceleration Range: ±3g, 9g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)
  • Bandwidth: 400Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Features: Selectable Scale, Sleep Mode
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VFLGA
  • Supplier Device Package: 14-LGA (3x5)
封裝: 14-VFLGA
庫存5,544
HTMS1001FUG/AM,005
NXP

IC TRANSPONDER HITAG

  • Type: RFID Transponder
  • Frequency: 100kHz ~ 150kHz
  • Standards: ISO 11784, ISO 11785
  • Interface: -
  • Voltage - Supply: 4 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: Die
  • Supplier Device Package: Wafer
封裝: Die
庫存6,624
NT3H2111W0FHKH
NXP

IC RFID NFC 13.56MHZ 8XQFN

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: I2C
  • Voltage - Supply: 3.3V
  • Operating Temperature: -40°C ~ 105°C
  • Package / Case: 8-XFQFN Exposed Pad
  • Supplier Device Package: 8-XQFN (1.6x1.6)
封裝: 8-XFQFN Exposed Pad
庫存29,328
OM5569/NT312D,699
NXP

DEMO BOARD NTAG I2C

  • Type: Near Field Communication
  • Frequency: 13.56MHz
  • For Use With/Related Products: NT3H1101
  • Supplied Contents: Board
封裝: -
庫存7,470
T2081NXN8T1B
NXP

QORIQ 64B POWERARCH8X 1.8GHZ T

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存5,760
FS32K144HAT0MLHR
NXP

S32K144 32-BIT MCU ARM

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存5,824
FS32K144HFT0VLHT
NXP

S32K144 32-BIT MCU ARM CORTEX-M

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存4,928
MC33PF8200ESES
NXP

IC POWER MANAGEMENT I.MX8QM

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: 56-VFQFN Exposed Pad
庫存5,792
MC9S12XHZ256CAL
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
  • Peripherals: LCD, Motor control PWM, POR, PWM, WDT
  • Number of I/O: 85
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
  • Data Converters: A/D 16x8/10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封裝: 112-LQFP
庫存4,944
FD32K146HFT0MLLT
NXP

S32K144 32-BIT MCU, ARM CORTEX-M

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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LPC55S28JBD100Y
NXP

IC MCU 32BIT 512KB FLSH 100HLQFP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 64
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP Exposed Pad
  • Supplier Device Package: 100-HLQFP (14x14)
封裝: -
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