頁 452 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF8S9260HR3	NXP	FET RF 70V 960MHZ NI-880H Transistor Type: LDMOS Frequency: 960MHz Gain: 18.6dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.7A Power - Output: 75W Voltage - Rated: 70V Package / Case: NI-880 Supplier Device Package: NI-880	封裝: NI-880	庫存5,808
MRF6P9220HR3	NXP	FET RF 68V 880MHZ NI-860C3 Transistor Type: LDMOS Frequency: 880MHz Gain: 20dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.6A Power - Output: 47W Voltage - Rated: 68V Package / Case: NI-860C3 Supplier Device Package: NI-860C3	封裝: NI-860C3	庫存3,264
BC337-16,112	NXP	TRANS NPN 45V 0.5A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V Power - Max: 625mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA)	庫存7,520
1N914B,113	NXP	DIODE GEN PURP 100V 200MA ALF2 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 100V Current - Average Rectified (Io): 200mA Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 5µA @ 75V Capacitance @ Vr, F: 4pF @ 0V, 1MHz Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Supplier Device Package: ALF2 Operating Temperature - Junction: 175°C (Max)	封裝: DO-204AH, DO-35, Axial	庫存3,408
MC33814AER2	NXP	IC CTRL SMALL ENG 2CYL 48LQFP Applications: Small Engine Current - Supply: 10mA Voltage - Supply: 4.5 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封裝: 48-LQFP Exposed Pad	庫存6,192
BUK210-50Y,127	NXP	MOSFET N-CH 50V 9A SOT263B-01 Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 5.5 V ~ 35 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 9A Rds On (Typ): 28 mOhm Input Type: Non-Inverting Features: Status Flag Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage Operating Temperature: 150°C (TJ) Package / Case: TO-220-5 Formed Leads Supplier Device Package: SOT263-01	封裝: TO-220-5 Formed Leads	庫存4,016
MCZ33937EKR2	NXP	IC PRE-DRIVER 3PHASE 54-SOIC Motor Type - Stepper: - Motor Type - AC, DC: Brushless DC (BLDC) Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: SPI Technology: NMOS Step Resolution: - Applications: Automotive Current - Output: - Voltage - Supply: 6 V ~ 58 V Voltage - Load: - Operating Temperature: -40°C ~ 135°C (TA) Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存4,144
TZA3047BVH/C1,551	NXP	IC LASER DRIVER 1.25GBPS 32-HBCC Type: Laser Diode Driver (Fiber Optic) Data Rate: 1.25Gbps Number of Channels: 1 Voltage - Supply: 3.14 V ~ 3.47 V Current - Supply: 40mA Current - Modulation: 100mA Current - Bias: 100mA Operating Temperature: -40°C ~ 85°C Package / Case: 32-HBCC Supplier Device Package: 32-HBCC (5x5) Mounting Type: Surface Mount	封裝: 32-HBCC	庫存2,480
74HCT594N,112	NXP	IC 8BIT SHIFT REGISTER 16DIP Logic Type: Shift Register Output Type: Push-Pull Number of Elements: 1 Number of Bits per Element: 8 Function: Serial to Parallel, Serial Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存2,176
TDA9981BHL/8/C1,55	NXP	IC HDMI TX 81MHZ 80-LQFP Type: Transmitter Applications: Recorders, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存3,680
MCZ33884EG	NXP	IC MULTIPLE CONTACT MON 24-SOIC Applications: Switch Monitoring Interface: SPI Voltage - Supply: 7 V ~ 26 V Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SOIC Mounting Type: Surface Mount	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存5,744
PCA9547PW,112	NXP	IC MUX 8CH I2C BUS 24-TSSOP Applications: Translating Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP Mounting Type: Surface Mount	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存27,894
SJA1000/N1,112	NXP	IC STAND-ALONE CAN CTRLR 28-DIP Protocol: CAN Function: Controller Interface: Parallel Standards: CAN 2.0 Voltage - Supply: 4.5 V ~ 5.5 V Current - Supply: 15mA Operating Temperature: -40°C ~ 125°C Package / Case: 28-DIP (0.600", 15.24mm) Supplier Device Package: 28-DIP	封裝: 28-DIP (0.600", 15.24mm)	庫存2,912
MPC8270CVVUPEA	NXP	IC MPU MPC82XX 450MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 450MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	封裝: 480-LBGA	庫存9,420
MC9S12GC96VPBER	NXP	IC MCU 16BIT 96KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	封裝: 52-LQFP	庫存3,680
MC9S08RE16CFDE	NXP	IC MCU 8BIT 16KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存4,352
MC9S08RG32CFGE	NXP	IC MCU 8BIT 32KB FLASH 44LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存4,736
MC68HC908JL8CSPE	NXP	IC MCU 8BIT 8KB FLASH 32SDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LED, LVD, POR, PWM Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 13x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-SDIP (0.400", 10.16mm) Supplier Device Package: 32-SDIP	封裝: 32-SDIP (0.400", 10.16mm)	庫存6,128
MC9S08PA60AVLH	NXP	IC MCU 8BIT 60KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存6,432
LPC1113FHN33/302K	NXP	IC MCU 32BIT 24KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: -	封裝: 32-VQFN Exposed Pad	庫存2,928
MM908E622ACDWB	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	封裝: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	庫存6,624
MSC8113TVT3600V	NXP	DSP TRI-CORE 431FCBGA Type: SC140 Core Interface: Ethernet, I2C, TDM, UART Clock Rate: 300MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	封裝: 431-BFBGA, FCBGA	庫存5,840
CSM56F801SLK	NXP	KIT LEARNING DSP 16BIT CSM56F801 Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	封裝: -	庫存8,244
SPC5605BK0VLU6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP	庫存6,976
TFA9871BUK/N1Z	NXP	IC AUDIO AMP CLASS D WLCSP Type: - Output Type: - Max Output Power x Channels @ Load: - Voltage - Supply: - Features: - Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	封裝: -	庫存6,832
MC34PF8100A0EPR2	NXP	POWER MANAGEMENT IC I.MX8 NON-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
LS1017AXE7NQA	NXP	IC MPU QORIQ 1.3GHZ 448FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: - RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Graphics Acceleration: - Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: - Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	封裝: -	Request a Quote
LPC5504JHI48EL	NXP	IC MCU 32BIT 128KB FLASH 48HVQFN Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 96MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 30 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 7x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: -	Request a Quote

MRF8S9260HR3

NXP

FET RF 70V 960MHZ NI-880H

Transistor Type: LDMOS
Frequency: 960MHz
Gain: 18.6dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.7A
Power - Output: 75W
Voltage - Rated: 70V
Package / Case: NI-880
Supplier Device Package: NI-880

封裝: NI-880

庫存5,808

MRF6P9220HR3

NXP

FET RF 68V 880MHZ NI-860C3

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 20dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.6A
Power - Output: 47W
Voltage - Rated: 68V
Package / Case: NI-860C3
Supplier Device Package: NI-860C3

封裝: NI-860C3

庫存3,264

BC337-16,112

NXP

TRANS NPN 45V 0.5A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Power - Max: 625mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA)

庫存7,520

1N914B,113

NXP

DIODE GEN PURP 100V 200MA ALF2

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 100V
Current - Average Rectified (Io): 200mA
Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 5µA @ 75V
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Supplier Device Package: ALF2
Operating Temperature - Junction: 175°C (Max)

封裝: DO-204AH, DO-35, Axial

庫存3,408

MC33814AER2

NXP

IC CTRL SMALL ENG 2CYL 48LQFP

Applications: Small Engine
Current - Supply: 10mA
Voltage - Supply: 4.5 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封裝: 48-LQFP Exposed Pad

庫存6,192

BUK210-50Y,127

NXP

MOSFET N-CH 50V 9A SOT263B-01

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 5.5 V ~ 35 V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 9A
Rds On (Typ): 28 mOhm
Input Type: Non-Inverting
Features: Status Flag
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Operating Temperature: 150°C (TJ)
Package / Case: TO-220-5 Formed Leads
Supplier Device Package: SOT263-01

封裝: TO-220-5 Formed Leads

庫存4,016

MCZ33937EKR2

NXP

IC PRE-DRIVER 3PHASE 54-SOIC

Motor Type - Stepper: -
Motor Type - AC, DC: Brushless DC (BLDC)
Function: Controller - Commutation, Direction Management
Output Configuration: Pre-Driver - Half Bridge (3)
Interface: SPI
Technology: NMOS
Step Resolution: -
Applications: Automotive
Current - Output: -
Voltage - Supply: 6 V ~ 58 V
Voltage - Load: -
Operating Temperature: -40°C ~ 135°C (TA)
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存4,144

TZA3047BVH/C1,551

NXP

IC LASER DRIVER 1.25GBPS 32-HBCC

Type: Laser Diode Driver (Fiber Optic)
Data Rate: 1.25Gbps
Number of Channels: 1
Voltage - Supply: 3.14 V ~ 3.47 V
Current - Supply: 40mA
Current - Modulation: 100mA
Current - Bias: 100mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-HBCC
Supplier Device Package: 32-HBCC (5x5)
Mounting Type: Surface Mount

封裝: 32-HBCC

庫存2,480

74HCT594N,112

NXP

IC 8BIT SHIFT REGISTER 16DIP

Logic Type: Shift Register
Output Type: Push-Pull
Number of Elements: 1
Number of Bits per Element: 8
Function: Serial to Parallel, Serial
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存2,176

TDA9981BHL/8/C1,55

NXP

IC HDMI TX 81MHZ 80-LQFP

Type: Transmitter
Applications: Recorders, Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存3,680

MCZ33884EG

NXP

IC MULTIPLE CONTACT MON 24-SOIC

Applications: Switch Monitoring
Interface: SPI
Voltage - Supply: 7 V ~ 26 V
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SOIC
Mounting Type: Surface Mount

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存5,744

PCA9547PW,112

NXP

IC MUX 8CH I2C BUS 24-TSSOP

Applications: Translating Multiplexer
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP
Mounting Type: Surface Mount

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存27,894

SJA1000/N1,112

NXP

IC STAND-ALONE CAN CTRLR 28-DIP

Protocol: CAN
Function: Controller
Interface: Parallel
Standards: CAN 2.0
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Supply: 15mA
Operating Temperature: -40°C ~ 125°C
Package / Case: 28-DIP (0.600", 15.24mm)
Supplier Device Package: 28-DIP

封裝: 28-DIP (0.600", 15.24mm)

庫存2,912

MPC8270CVVUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 450MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

封裝: 480-LBGA

庫存9,420

MC9S12GC96VPBER

NXP

IC MCU 16BIT 96KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

封裝: 52-LQFP

庫存3,680

MC9S08RE16CFDE

NXP

IC MCU 8BIT 16KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存4,352

MC9S08RG32CFGE

NXP

IC MCU 8BIT 32KB FLASH 44LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存4,736

MC68HC908JL8CSPE

NXP

IC MCU 8BIT 8KB FLASH 32SDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 13x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-SDIP (0.400", 10.16mm)
Supplier Device Package: 32-SDIP

封裝: 32-SDIP (0.400", 10.16mm)

庫存6,128

MC9S08PA60AVLH

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 57
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存6,432

LPC1113FHN33/302K

NXP

IC MCU 32BIT 24KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 24KB (24K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: -

封裝: 32-VQFN Exposed Pad

庫存2,928

MM908E622ACDWB

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

封裝: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

庫存6,624

MSC8113TVT3600V

NXP

DSP TRI-CORE 431FCBGA

Type: SC140 Core
Interface: Ethernet, I2C, TDM, UART
Clock Rate: 300MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

封裝: 431-BFBGA, FCBGA

庫存5,840

CSM56F801SLK

NXP

KIT LEARNING DSP 16BIT CSM56F801

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

封裝: -

庫存8,244

SPC5605BK0VLU6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

庫存6,976

TFA9871BUK/N1Z

NXP

IC AUDIO AMP CLASS D WLCSP

Type: -
Output Type: -
Max Output Power x Channels @ Load: -
Voltage - Supply: -
Features: -
Mounting Type: -
Operating Temperature: -
Supplier Device Package: -
Package / Case: -

封裝: -

庫存6,832

MC34PF8100A0EPR2

NXP

POWER MANAGEMENT IC I.MX8 NON-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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LS1017AXE7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.3GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: -
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

封裝: -

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LPC5504JHI48EL

NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 96MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 30
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 7x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: -

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