圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FFC VERT 29POS 0.50MM SMD
|
封裝: - |
庫存7,146 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 29 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 29POS 0.50MM SMD
|
封裝: - |
庫存8,478 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 29 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 24POS 0.50MM SMD
|
封裝: - |
庫存7,182 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 18POS 0.50MM R/A
|
封裝: - |
庫存2,412 |
|
Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 22POS 0.50MM R/A
|
封裝: - |
庫存7,668 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 19POS 1.25MM PCB
|
封裝: - |
庫存4,572 |
|
Through Hole | Contacts, Vertical, 1 Sided | 19 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 28POS 0.50MM SMD
|
封裝: - |
庫存6,192 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 28POS 0.50MM SMD
|
封裝: - |
庫存3,780 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 14POS 0.50MM R/A
|
封裝: - |
庫存4,680 |
|
Surface Mount, Right Angle | Contacts, Top | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 19POS 0.50MM R/A
|
封裝: - |
庫存3,186 |
|
Surface Mount, Right Angle | Contacts, Bottom | 19 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 12POS 0.50MM R/A
|
封裝: - |
庫存2,502 |
|
Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 27POS 0.50MM SMD
|
封裝: - |
庫存4,374 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 27 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 27POS 0.50MM SMD
|
封裝: - |
庫存5,256 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 27 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 13POS 0.5MM R/A
|
封裝: - |
庫存8,226 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 24POS 1.00MM R/A
|
封裝: - |
庫存2,502 |
|
Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 26POS 0.50MM SMD
|
封裝: - |
庫存3,472 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 26POS 0.50MM SMD
|
封裝: - |
庫存4,860 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
05 FFCFPC ZIF EO2HSGASSY21CKTEMB
|
封裝: - |
庫存6,354 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC/FPC 50POS .5MM SMD R/A
|
封裝: - |
庫存6,084 |
|
Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 37POS .3MM SMD R/A
|
封裝: - |
庫存6,282 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 37 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 37POS .3MM SMD R/A
|
封裝: - |
庫存3,600 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 37 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 25POS 0.50MM SMD
|
封裝: - |
庫存8,280 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 25 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 25POS 0.50MM SMD
|
封裝: - |
庫存7,650 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 25 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 25POS 1.00MM R/A
|
封裝: - |
庫存4,266 |
|
Surface Mount, Right Angle | Contacts, Top | 25 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 21POS 0.50MM R/A
|
封裝: - |
庫存3,042 |
|
Surface Mount, Right Angle | Contacts, Top | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 13POS 1.00MM R/A
|
封裝: - |
庫存8,748 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 29POS 1.00MM R/A
|
封裝: - |
庫存7,758 |
|
Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 17POS 0.50MM R/A
|
封裝: - |
庫存5,148 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |