圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FFC VERT 32POS 0.50MM SMD
|
封裝: - |
庫存6,462 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 32 | 0.020" (0.50mm) | Solder | 0.30mm | 0.159" (4.04mm) | Flip Lock | Straight, Tapered | Copper Alloy | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA9T), Nylon 9T, Glass Filled | - | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 35POS .3MM SMD R/A
|
封裝: - |
庫存7,488 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 35 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 35POS .3MM SMD R/A
|
封裝: - |
庫存5,958 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 35 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 33POS .3MM SMD R/A
|
封裝: - |
庫存6,786 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 33POS .3MM SMD R/A
|
封裝: - |
庫存6,588 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
05 FFCFPC ZIF E02HSGASSY16CKTEMB
|
封裝: - |
庫存3,888 |
|
Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 20POS 0.50MM R/A
|
封裝: - |
庫存4,194 |
|
Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -30°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC TOP 9POS 0.50MM R/A
|
封裝: - |
庫存4,986 |
|
Surface Mount, Right Angle | Contacts, Top | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 18POS 0.50MM SMD
|
封裝: - |
庫存2,880 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 12POS 0.50MM R/A
|
封裝: - |
庫存7,488 |
|
Surface Mount, Right Angle | Contacts, Top | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 26POS 1.00MM R/A
|
封裝: - |
庫存5,724 |
|
Surface Mount, Right Angle | Contacts, Top | 26 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
FPC BACK FLIP HSG ASSY17CKTEMBST
|
封裝: - |
庫存6,606 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 41POS .3MM SMD R/A
|
封裝: - |
庫存7,830 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 41 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 18POS 0.50MM SMD
|
封裝: - |
庫存7,452 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 9POS 1.00MM SMD
|
封裝: - |
庫存2,502 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 9 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | - | - | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 11POS 0.5MM R/A
|
封裝: - |
庫存3,436 |
|
Surface Mount, Right Angle | Contacts, Bottom | 11 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 21POS 0.50MM SMD
|
封裝: - |
庫存2,034 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 10POS 1.00MM SMD
|
封裝: - |
庫存2,988 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 10 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | - | - | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 27POS 1.00MM R/A
|
封裝: - |
庫存7,596 |
|
Surface Mount, Right Angle | Contacts, Top | 27 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC PLUG 5POS 2.54MM
|
封裝: - |
庫存8,892 |
|
Free Hanging (In-Line) | Plug | 5 | 0.100" (2.54mm) | IDC | 0.30mm | - | - | - | Phosphor Bronze | Gold | Polyester, Glass Filled | - | Position 1, 3, 5 Molded Closed | - | - | UL94 V-0 |
||
Molex, LLC |
CONN FFC/FPC 45POS .5MM SMD R/A
|
封裝: - |
庫存3,294 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 23POS 1.00MM R/A
|
封裝: - |
庫存7,254 |
|
Surface Mount, Right Angle | Contacts, Bottom | 23 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 27POS 0.30MM R/A
|
封裝: - |
庫存8,046 |
|
Surface Mount, Right Angle | Contacts, Bottom | 27 | 0.012" (0.30mm) | Solder | 0.20mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 18POS 1.00MM SMD
|
封裝: - |
庫存2,448 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 17POS 0.50MM SMD
|
封裝: - |
庫存3,096 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 31POS .3MM SMD R/A
|
封裝: - |
庫存5,328 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 31POS .3MM SMD R/A
|
封裝: - |
庫存3,528 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 31 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 39POS .3MM SMD R/A
|
封裝: - |
庫存5,346 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |