圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN CIC FFC RCPT 2POS 2.54MM
|
封裝: - |
庫存4,050 |
|
Free Hanging (In-Line) | Receptacle | 2 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | Latch Lock | Straight | Phosphor Bronze | Gold | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN CIC FFC RCPT 2POS 2.54MM
|
封裝: - |
庫存6,948 |
|
Free Hanging (In-Line) | Receptacle | 2 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | - | Straight | Phosphor Bronze | Gold | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC/FPC 22POS .5MM SMD R/A
|
封裝: - |
庫存5,148 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC VERT SMD
|
封裝: - |
庫存2,100 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 10 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 19
|
封裝: - |
庫存7,668 |
|
Surface Mount, Right Angle | Contacts, Bottom | 19 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 6POS 0.50MM R/A
|
封裝: - |
庫存4,752 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 25POS 1.25MM PCB
|
封裝: - |
庫存8,082 |
|
Through Hole | Contacts, Vertical, 1 Sided | 25 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC VERT SMD
|
封裝: - |
庫存8,136 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 8 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 9POS .3MM SMD R/A
|
封裝: - |
庫存3,402 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 9 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 9POS .3MM SMD R/A
|
封裝: - |
庫存4,842 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 9 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC VERT 21POS 1MM SMD
|
封裝: - |
庫存5,130 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 21 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 17POS 1.00MM SMD
|
封裝: - |
庫存4,896 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 17 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 3POS 2MM SMD R/A
|
封裝: - |
庫存2,628 |
|
Surface Mount, Right Angle | Contacts, Bottom | 3 | 0.079" (2.00mm) | Solder | 0.30mm | 0.191" (4.85mm) | - | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | Solder Retention | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 18
|
封裝: - |
庫存7,308 |
|
Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC FPC VERT 4POS 1MM SMD
|
封裝: - |
庫存6,228 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 4 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 26POS 1.25MM R/A
|
封裝: - |
庫存6,246 |
|
Through Hole, Right Angle | Contacts, Top | 26 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 13POS 0.30MM R/A
|
封裝: - |
庫存5,076 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 13 | 0.012" (0.30mm) | Solder | 0.30mm | 0.039" (1.00mm) | - | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC/FPC 20POS .5MM SMD R/A
|
封裝: - |
庫存8,766 |
|
Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 17
|
封裝: - |
庫存5,940 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 2POS 2MM SMD R/A
|
封裝: - |
庫存7,776 |
|
Surface Mount, Right Angle | Contacts, Bottom | 2 | 0.079" (2.00mm) | Solder | 0.30mm | 0.191" (4.85mm) | - | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | Solder Retention | 50V | -40°C ~ 125°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 22
|
封裝: - |
庫存6,084 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 13POS 1.00MM SMD
|
封裝: - |
庫存5,670 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 25POS 1.25MM R/A
|
封裝: - |
庫存4,590 |
|
Through Hole, Right Angle | Contacts, Top | 25 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 16
|
封裝: - |
庫存4,284 |
|
Surface Mount, Right Angle | Contacts, Bottom | 16 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 22
|
封裝: - |
庫存6,462 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 15
|
封裝: - |
庫存2,988 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 24POS 1.25MM R/A
|
封裝: - |
庫存6,714 |
|
Through Hole, Right Angle | Contacts, Top | 24 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 4POS 0.5MM R/A
|
封裝: - |
庫存6,552 |
|
Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |