圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FPC TOP 7POS 1.00MM R/A
|
封裝: - |
庫存4,500 |
|
Through Hole, Right Angle | Contacts, Top | 7 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 18POS 1.25MM R/A
|
封裝: - |
庫存7,128 |
|
Through Hole, Right Angle | Contacts, Top | 18 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 6C
|
封裝: - |
庫存5,814 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
0.2 FPC BACK FLIP HSG ASSY 12CKT
|
封裝: - |
庫存6,498 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 12 | 0.008" (0.20mm) | Solder | - | - | Flip Lock, Backlock | - | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | - | - | 50V | -40°C ~ 85°C | - |
||
Molex, LLC |
CONN FFC FPC VERT 7POS 1MM SMD
|
封裝: - |
庫存8,118 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 7 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 5C
|
封裝: - |
庫存6,732 |
|
Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 17POS 1.25MM R/A
|
封裝: - |
庫存4,500 |
|
Through Hole, Right Angle | Contacts, Top | 17 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 19POS 1.25MM PCB
|
封裝: - |
庫存4,050 |
|
Through Hole | Contacts, Vertical, 1 Sided | 19 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 18POS 1.25MM PCB
|
封裝: - |
庫存5,958 |
|
Through Hole | Contacts, Vertical, 1 Sided | 18 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC VERT 22POS 1.00MM PCB
|
封裝: - |
庫存4,266 |
|
Through Hole | Contacts, Vertical, 1 Sided | 22 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.213" (5.40mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 9C
|
封裝: - |
庫存8,370 |
|
Surface Mount, Right Angle | Contacts, Bottom | 9 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 11POS 1.25MM R/A
|
封裝: - |
庫存7,470 |
|
Through Hole, Right Angle | Contacts, Top | 11 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 8C
|
封裝: - |
庫存3,420 |
|
Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 4C
|
封裝: - |
庫存7,452 |
|
Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 7C
|
封裝: - |
庫存4,032 |
|
Surface Mount, Right Angle | Contacts, Bottom | 7 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 13POS 1.25MM R/A
|
封裝: - |
庫存2,214 |
|
Through Hole, Right Angle | Contacts, Top | 13 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 6C
|
封裝: - |
庫存5,562 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC TOP 15POS 1.25MM R/A
|
封裝: - |
庫存5,328 |
|
Through Hole, Right Angle | Contacts, Top | 15 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 5C
|
封裝: - |
庫存3,510 |
|
Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 17POS 1.25MM PCB
|
封裝: - |
庫存4,590 |
|
Through Hole | Contacts, Vertical, 1 Sided | 17 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 4C
|
封裝: - |
庫存6,210 |
|
Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 9C
|
封裝: - |
庫存5,508 |
|
Surface Mount, Right Angle | Contacts, Bottom | 9 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 5POS 1.00MM R/A
|
封裝: - |
庫存6,534 |
|
Through Hole, Right Angle | Contacts, Top | 5 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 13POS 1.25MM PCB
|
封裝: - |
庫存7,452 |
|
Through Hole | Contacts, Vertical, 1 Sided | 13 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 8C
|
封裝: - |
庫存3,186 |
|
Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 7C
|
封裝: - |
庫存7,056 |
|
Surface Mount, Right Angle | Contacts, Bottom | 7 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 6C
|
封裝: - |
庫存3,186 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 5C
|
封裝: - |
庫存5,256 |
|
Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |