頁 238 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PRIXP425BC	Intel	IC MPU XSCALE 400MHZ 492BGA Core Processor: Xscale Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 1.1 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Cryptography Package / Case: 492-BBGA Supplier Device Package: 492-BGA (35x35)	封裝: 492-BBGA	庫存6,352
10AS032E3F29I2LG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,832
10AS032E2F29E2SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,448
EPCE8QC100N	Intel	IC CONFIG DEVICE 100QFP Programmable Type: In System Programmable Memory Size: 8MB Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (20x14)	封裝: 100-BQFP	庫存6,464
10M16DCF484I6G	Intel	IC FPGA 320 I/O 484FBGA Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 16000 Total RAM Bits: 562176 Number of I/O: 320 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存6,304
EP2A15B652C7	Intel	IC FPGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 425984 Number of I/O: - Number of Gates: 1900000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存4,656
EP20K100FC196-2X	Intel	IC FPGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: - Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 196-BGA Supplier Device Package: 196-BGA	封裝: 196-BGA	庫存5,344
10AX115N4F40I3SGES	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,100
EP20K200FC484-2XV	Intel	IC FPGA 382 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 382 Number of Gates: 526000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,504
10AX090N2F40I1SG	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,832
EP2SGX60EF1152C4	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 534 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,488
5AGXMB1G4F31C5N	Intel	IC FPGA 384 I/O 896FBGA Number of LABs/CLBs: 14151 Number of Logic Elements/Cells: 300000 Total RAM Bits: 17358848 Number of I/O: 384 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存4,064
EP3C40F484I7N	Intel	IC FPGA 331 I/O 484FBGA Number of LABs/CLBs: 2475 Number of Logic Elements/Cells: 39600 Total RAM Bits: 1161216 Number of I/O: 331 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BGA	庫存6,224
10M16DCF256A7G	Intel	IC FPGA 178 I/O 256FBGA Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 16000 Total RAM Bits: 562176 Number of I/O: 178 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存3,376
EPM7128STC100-10	Intel	IC CPLD 128MC 10NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 84 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存6,060
EPM570GT100I5N	Intel	IC CPLD 440MC 5.4NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.4ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 570 Number of Macrocells: 440 Number of Gates: - Number of I/O: 76 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-TQFP	庫存6,864
EPM240F100I5N	Intel	IC CPLD 192MC 4.7NS 100FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 4.7ns Voltage Supply - Internal: 2.5V, 3.3V Number of Logic Elements/Blocks: 240 Number of Macrocells: 192 Number of Gates: - Number of I/O: 80 Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 100-LBGA Supplier Device Package: 100-FBGA (11x11)	封裝: 100-LBGA	庫存12,456
1SG065HH3F35I1VG	Intel	IC FPGA STRATIX10GX 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 612000 Total RAM Bits: 51380224 Number of I/O: 392 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5ASXFB3H4F40C4G	Intel	IC SOC CORTEX-A9 925MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	封裝: -	Request a Quote
1SG280HN3F43E3XG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
AGIB023R18A1E2V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGFB027R31C2E1V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXMA4K1F40I2WN	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
1SG250HN1F43E2LG	Intel	IC FPGA 688 I/O 1760FBGA Number of LABs/CLBs: 312500 Number of Logic Elements/Cells: 2500000 Total RAM Bits: - Number of I/O: 688 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	封裝: -	Request a Quote
1SG280HU2F50I2VG	Intel	IC FPGA 704 I/O 2397BGA Number of LABs/CLBs: 350000 Number of Logic Elements/Cells: 2800000 Total RAM Bits: - Number of I/O: 704 Number of Gates: - Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote
5SGXEA7K2F40C3G	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
AGFD023R24C3E4X	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	封裝: -	Request a Quote
AGFB012R24B2E3V	Intel	IC FPGA AGILEX-F 2486FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

PRIXP425BC

Intel

IC MPU XSCALE 400MHZ 492BGA

Core Processor: Xscale
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 1.1 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Cryptography
Package / Case: 492-BBGA
Supplier Device Package: 492-BGA (35x35)

封裝: 492-BBGA

庫存6,352

10AS032E3F29I2LG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,832

10AS032E2F29E2SG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,448

EPCE8QC100N

Intel

IC CONFIG DEVICE 100QFP

Programmable Type: In System Programmable
Memory Size: 8MB
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (20x14)

封裝: 100-BQFP

庫存6,464

10M16DCF484I6G

Intel

IC FPGA 320 I/O 484FBGA

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 16000
Total RAM Bits: 562176
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存6,304

EP2A15B652C7

Intel

IC FPGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 425984
Number of I/O: -
Number of Gates: 1900000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,656

EP20K100FC196-2X

Intel

IC FPGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: -
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 196-BGA
Supplier Device Package: 196-BGA

封裝: 196-BGA

庫存5,344

10AX115N4F40I3SGES

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,100

EP20K200FC484-2XV

Intel

IC FPGA 382 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 382
Number of Gates: 526000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,504

10AX090N2F40I1SG

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,832

EP2SGX60EF1152C4

Intel

IC FPGA 534 I/O 1152FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 534
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,488

5AGXMB1G4F31C5N

Intel

IC FPGA 384 I/O 896FBGA

Number of LABs/CLBs: 14151
Number of Logic Elements/Cells: 300000
Total RAM Bits: 17358848
Number of I/O: 384
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存4,064

EP3C40F484I7N

Intel

IC FPGA 331 I/O 484FBGA

Number of LABs/CLBs: 2475
Number of Logic Elements/Cells: 39600
Total RAM Bits: 1161216
Number of I/O: 331
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BGA

庫存6,224

10M16DCF256A7G

Intel

IC FPGA 178 I/O 256FBGA

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 16000
Total RAM Bits: 562176
Number of I/O: 178
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存3,376

EPM7128STC100-10

Intel

IC CPLD 128MC 10NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 84
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存6,060

EPM570GT100I5N

Intel

IC CPLD 440MC 5.4NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.4ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 570
Number of Macrocells: 440
Number of Gates: -
Number of I/O: 76
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-TQFP

庫存6,864

EPM240F100I5N

Intel

IC CPLD 192MC 4.7NS 100FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 4.7ns
Voltage Supply - Internal: 2.5V, 3.3V
Number of Logic Elements/Blocks: 240
Number of Macrocells: 192
Number of Gates: -
Number of I/O: 80
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Supplier Device Package: 100-FBGA (11x11)

封裝: 100-LBGA

庫存12,456

1SG065HH3F35I1VG

Intel

IC FPGA STRATIX10GX 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 612000
Total RAM Bits: 51380224
Number of I/O: 392
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5ASXFB3H4F40C4G

Intel

IC SOC CORTEX-A9 925MHZ 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

封裝: -

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1SG280HN3F43E3XG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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AGIB023R18A1E2V

Intel

IC FPGA AGILEX-I 1805FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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AGFB027R31C2E1V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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5SGXMA4K1F40I2WN

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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1SG250HN1F43E2LG

Intel

IC FPGA 688 I/O 1760FBGA

Number of LABs/CLBs: 312500
Number of Logic Elements/Cells: 2500000
Total RAM Bits: -
Number of I/O: 688
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

封裝: -

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1SG280HU2F50I2VG

Intel

IC FPGA 704 I/O 2397BGA

Number of LABs/CLBs: 350000
Number of Logic Elements/Cells: 2800000
Total RAM Bits: -
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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5SGXEA7K2F40C3G

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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AGFD023R24C3E4X

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

封裝: -

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AGFB012R24B2E3V

Intel

IC FPGA AGILEX-F 2486FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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