頁 237 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  237/351
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10AS032H1F35I1HG
Intel

IC SOC FPGA 384 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,168
hot EPC1213LC20
Intel

IC CONFIG DEVICE 212KBIT 20PLCC

  • Programmable Type: OTP
  • Memory Size: 212kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
封裝: 20-LCC (J-Lead)
庫存4,208
hot EPF10K30ATC144-3
Intel

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 12288
  • Number of I/O: 102
  • Number of Gates: 69000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存6,128
10CX220YF672E6G
Intel

672-PIN FBGA

  • Number of LABs/CLBs: 80330
  • Number of Logic Elements/Cells: 220000
  • Total RAM Bits: 13752320
  • Number of I/O: 236
  • Number of Gates: -
  • Voltage - Supply: 0.9V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存6,368
10M08DFV81I7G
Intel

IC FPGA 56 I/O 81WLCSP

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 56
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 81-UFBGA, WLCSP
  • Supplier Device Package: 81-VBGA, WLCSP (4.5x4.4)
封裝: 81-UFBGA, WLCSP
庫存20,772
EP4SGX360HF35C2
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 14144
  • Number of Logic Elements/Cells: 353600
  • Total RAM Bits: 23105536
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,032
5SGXMA7H2F35C1N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,448
hot EP2S130F1020I4
Intel

IC FPGA 742 I/O 1020FBGA

  • Number of LABs/CLBs: 6627
  • Number of Logic Elements/Cells: 132540
  • Total RAM Bits: 6747840
  • Number of I/O: 742
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封裝: 1020-BBGA
庫存4,656
5SGXMA7H3F35C3N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存3,136
EP3CLS200F484C7
Intel

IC FPGA 210 I/O 484FBGA

  • Number of LABs/CLBs: 12404
  • Number of Logic Elements/Cells: 198464
  • Total RAM Bits: 8211456
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存5,376
5SGXMA3K3F35I4N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存3,344
5AGXBB5D4F40C5N
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 19811
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA
庫存3,008
EP2S30F484C4N
Intel

IC FPGA 342 I/O 484FBGA

  • Number of LABs/CLBs: 1694
  • Number of Logic Elements/Cells: 33880
  • Total RAM Bits: 1369728
  • Number of I/O: 342
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存6,288
hot EP3C40F484C6N
Intel

IC FPGA 331 I/O 484FBGA

  • Number of LABs/CLBs: 2475
  • Number of Logic Elements/Cells: 39600
  • Total RAM Bits: 1161216
  • Number of I/O: 331
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BGA
庫存6,896
EPM9560RI240-20
Intel

IC CPLD 560MC 20NS 240RQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 35
  • Number of Macrocells: 560
  • Number of Gates: 12000
  • Number of I/O: 191
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-RQFP (32x32)
封裝: 240-BFQFP Exposed Pad
庫存4,448
5M570ZT144C4N
Intel

IC CPLD 440MC 9NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 114
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存6,048
5SGXMB6R2F40I2LG
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
AGFC023R24C3I3E
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
AGFA027R24C2E2VR2
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXMA3K1F40C2NCV
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
1ST280EY2F55E1VG
Intel

IC FPGA 296 I/O 2912BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封裝: -
Request a Quote
5SGXMA7K3F35I4G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
AGFB027R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
5SGXEA4H2F35I3G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
5SEEBF45I2LG
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359250
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: -
Request a Quote
1SX065HH3F35E3VG
Intel

IC FPGA STRATIX10SX 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 650K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
5AGZME5H2F35C3NCV
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 150960
  • Number of Logic Elements/Cells: 400000
  • Total RAM Bits: 34322432
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
5SGXEB6R2F40I3G
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 53248000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-FBGA (40x40)
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote