頁 164 - Intel 產品 | 黑森爾電子
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Intel 產品

記錄 9,824
頁  164/351
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5CSXFC2C6U23I7LN
Intel

672-PIN UBGA

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存5,120
EPXA1F484C1ES
Intel

IC EXCALIBUR ARM 484FBGA

  • Core Type: 32-Bit ARM9
  • Speed: 266MHz
  • Interface: EBI/EMI, UART/USART
  • Program SRAM Bytes: 32K
  • FPGA SRAM: -
  • EEPROM Size: -
  • Data SRAM Bytes: 16K
  • FPGA Core Cells: 4160
  • FPGA Gates: 100K
  • FPGA Registers: -
  • Voltage - Supply: 1.8V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存5,728
EP20K60ETC144-1
Intel

IC FPGA 92 I/O 144TQFP

  • Number of LABs/CLBs: 2560
  • Number of Logic Elements/Cells: 2560
  • Total RAM Bits: 32768
  • Number of I/O: 92
  • Number of Gates: 162000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存6,560
hot EP1K10QC208-3
Intel

IC FPGA 120 I/O 208QFP

  • Number of LABs/CLBs: 72
  • Number of Logic Elements/Cells: 576
  • Total RAM Bits: 12288
  • Number of I/O: 120
  • Number of Gates: 56000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存7,408
EP3SL200H780C4L
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 200000
  • Total RAM Bits: 10901504
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封裝: 780-BBGA, FCBGA
庫存2,672
5SGXEA7H3F35C2LN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存7,280
10AX027H3F34I2SG
Intel

1152-PIN FBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存5,920
EP3SL70F780I4
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 2700
  • Number of Logic Elements/Cells: 67500
  • Total RAM Bits: 2699264
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存4,048
EP2SGX30DF780C3N
Intel

IC FPGA 361 I/O 780FBGA

  • Number of LABs/CLBs: 1694
  • Number of Logic Elements/Cells: 33880
  • Total RAM Bits: 1369728
  • Number of I/O: 361
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA
庫存3,376
EP3SL50F780I4N
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 2184192
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存2,640
EP3C25F256C7
Intel

IC FPGA 156 I/O 256FBGA

  • Number of LABs/CLBs: 1539
  • Number of Logic Elements/Cells: 24624
  • Total RAM Bits: 608256
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存6,800
EP4CGX22CF19C8
Intel

IC FPGA 150 I/O 324FBGA

  • Number of LABs/CLBs: 1330
  • Number of Logic Elements/Cells: 21280
  • Total RAM Bits: 774144
  • Number of I/O: 150
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-FBGA (19x19)
封裝: 324-LBGA
庫存5,104
hot EPM7128SQC160-10
Intel

IC CPLD 128MC 10NS 160QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 100
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
封裝: 160-BQFP
庫存6,960
EPM570T144C4N
Intel

IC CPLD 440MC 5.4NS 144TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 116
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存7,404
5AGXF35I3NAC
Intel

IC FPGA FLIPCHIP

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存5,616
EP4SGX110HF35C2G
Intel

IC FPGA 488 I/O 1152FBGA

  • Number of LABs/CLBs: 4224
  • Number of Logic Elements/Cells: 105600
  • Total RAM Bits: 9793536
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存4,464
5SGXMA4H3F35I3G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
AGFC019R24C2E2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
AGFB012R24C2I2V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXMBBR2H40I2N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封裝: -
Request a Quote
5SGXMA3H1F35C2WN
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote
AGFD019R24C3E3V
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封裝: -
Request a Quote
FAGD1652248BA
Intel

CLOCK RECOVERY CIRCUIT, 1-FUNC

  • PLL: Yes
  • Main Purpose: Gigabit Ethernet, SONET/SDH, STM
  • Input: CML, LVTTL
  • Output: Clock, CML
  • Number of Circuits: 1
  • Ratio - Input:Output: 4:7
  • Differential - Input:Output: Yes/Yes
  • Frequency - Max: 2.488GHz
  • Voltage - Supply: 2.97V ~ 3.6V
  • Operating Temperature: -40°C ~ 85°C (TC)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-TQFP-EDQUAD (7x7)
封裝: -
Request a Quote
1SG280HU3F50E2LG
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封裝: -
Request a Quote
1SG210HU1F50E2VGAS
Intel

IC FPGA 704 I/O 2397BGA

  • Number of LABs/CLBs: 262500
  • Number of Logic Elements/Cells: 2100000
  • Total RAM Bits: -
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封裝: -
Request a Quote
5AGZME7K2F40I3LG
Intel

IC FPGA 674 I/O 1517FBGA

  • Number of LABs/CLBs: 21225
  • Number of Logic Elements/Cells: 450000
  • Total RAM Bits: 40249344
  • Number of I/O: 674
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: -
Request a Quote
AGFA006R24C2E4F
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
Request a Quote
5SGXEA7H1F35I2G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: -
Request a Quote