頁 162 - Intel 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
5ASXFB3G4F35C5N	Intel	IC FPGA 350 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,904
5CSXFC5D6F31C6N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BGA	庫存7,488
EP20K100EFC196-1	Intel	IC FPGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: - Number of Gates: 263000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 196-BGA Supplier Device Package: 196-BGA	封裝: 196-BGA	庫存6,256
EP2A15B724C8	Intel	IC FPGA 492 I/O 724BGA Number of LABs/CLBs: 1664 Number of Logic Elements/Cells: 16640 Total RAM Bits: 425984 Number of I/O: 492 Number of Gates: 1900000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 724-BBGA, FCBGA Supplier Device Package: 724-BGA (35x35)	封裝: 724-BBGA, FCBGA	庫存5,648
EP20K300EBC652-2	Intel	IC FPGA 408 I/O 652BGA Number of LABs/CLBs: 1152 Number of Logic Elements/Cells: 11520 Total RAM Bits: 147456 Number of I/O: 408 Number of Gates: 728000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 652-BBGA Supplier Device Package: 652-BGA (45x45)	封裝: 652-BBGA	庫存20,664
EPF10K100EQC240-3	Intel	IC FPGA 189 I/O 240QFP Number of LABs/CLBs: 624 Number of Logic Elements/Cells: 4992 Total RAM Bits: 49152 Number of I/O: 189 Number of Gates: 257000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BQFP	庫存5,648
5SEEBF45C2L	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359250 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存2,272
5SGSED6N3F45I4N	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 220000 Number of Logic Elements/Cells: 583000 Total RAM Bits: 54553600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: 1932-BBGA, FCBGA	庫存4,464
10AX090N2F40E2LG	Intel	IC FPGA 600 I/O 1517FCBGA Number of LABs/CLBs: 339620 Number of Logic Elements/Cells: 900000 Total RAM Bits: 59234304 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存4,384
5SGXMA7H3F35C4N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 59939840 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,224
5SGXMA3E1H29C2LN	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 128300 Number of Logic Elements/Cells: 340000 Total RAM Bits: 23704576 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封裝: 780-BBGA, FCBGA	庫存7,216
10AX032E2F29E2LG	Intel	780-PIN FBGA Number of LABs/CLBs: 119900 Number of Logic Elements/Cells: 320000 Total RAM Bits: 21040128 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存6,896
EP2SGX60CF780C5	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 3022 Number of Logic Elements/Cells: 60440 Total RAM Bits: 2544192 Number of I/O: 364 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA	庫存4,624
5CEFA7U19C6N	Intel	IC FPGA 240 I/O 484UBGA Number of LABs/CLBs: 56480 Number of Logic Elements/Cells: 149500 Total RAM Bits: 7880704 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存7,008
EP3C40F324I7	Intel	IC FPGA 195 I/O 324FBGA Number of LABs/CLBs: 2475 Number of Logic Elements/Cells: 39600 Total RAM Bits: 1161216 Number of I/O: 195 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-BGA Supplier Device Package: 324-FBGA (19x19)	封裝: 324-BGA	庫存6,240
EP3C10F256C6N	Intel	IC FPGA 182 I/O 256FBGA Number of LABs/CLBs: 645 Number of Logic Elements/Cells: 10320 Total RAM Bits: 423936 Number of I/O: 182 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-LBGA	庫存4,208
5SGXMB6R1F40I2LG	Intel	IC FPGA 432 I/O 1517FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-FBGA (40x40) Supplier Device Package: 1517-FBGA (40x40)	封裝: -	Request a Quote
EP4SGX360NF45C3G	Intel	IC FPGA 920 I/O 1932FCBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
AGID023R31B2I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote
5SGXMB6R2F43I3LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: -	Request a Quote
PDLXP610NE-B1	Intel	PDLXP610NE.B1 Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
5SGXMA4H2F35C2WN	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: -	Request a Quote
5SGXEA7N1F45C1G	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封裝: -	Request a Quote
PRIXP423ABD	Intel	IC MPU IXP423 533MHZ PBGA492 Core Processor: Intel® IXP42X Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100Mbps (2) SATA: - USB: USB 1.1 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, SHA-1 Package / Case: 492-BBGA Supplier Device Package: 492-PBGA (35x35)	封裝: -	Request a Quote
AGIB022R29A2I1VB	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote
PH28F320W30TD70	Intel	IC FLASH 32MBIT CFI 56VFBGA Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - Boot Block Memory Size: 32Mbit Memory Interface: CFI Clock Frequency: 40 MHz Write Cycle Time - Word, Page: - Access Time: 70 ns Voltage - Supply: 1.7V ~ 1.9V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFBGA Supplier Device Package: 56-VFBGA (7.7x9)	封裝: -	Request a Quote
AS83C196EA	Intel	16-BIT, MROM, 8096 CPU, 40MHZ Core Processor: 83C196EA Core Size: 16-Bit Speed: 40MHz Connectivity: SSIO Peripherals: PWM, WDT Number of I/O: 83 Program Memory Size: 8KB (8K x 8) Program Memory Type: ROM EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 16x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 160-QFP Supplier Device Package: 160-QFP	封裝: -	Request a Quote
5SGXEB6R2F43C2LG	Intel	IC FPGA 600 I/O 1760FBGA Number of LABs/CLBs: 225400 Number of Logic Elements/Cells: 597000 Total RAM Bits: 53248000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: -	Request a Quote

5ASXFB3G4F35C5N

Intel

IC FPGA 350 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,904

5CSXFC5D6F31C6N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BGA

庫存7,488

EP20K100EFC196-1

Intel

IC FPGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: -
Number of Gates: 263000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 196-BGA
Supplier Device Package: 196-BGA

封裝: 196-BGA

庫存6,256

EP2A15B724C8

Intel

IC FPGA 492 I/O 724BGA

Number of LABs/CLBs: 1664
Number of Logic Elements/Cells: 16640
Total RAM Bits: 425984
Number of I/O: 492
Number of Gates: 1900000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 724-BBGA, FCBGA
Supplier Device Package: 724-BGA (35x35)

封裝: 724-BBGA, FCBGA

庫存5,648

EP20K300EBC652-2

Intel

IC FPGA 408 I/O 652BGA

Number of LABs/CLBs: 1152
Number of Logic Elements/Cells: 11520
Total RAM Bits: 147456
Number of I/O: 408
Number of Gates: 728000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 652-BBGA
Supplier Device Package: 652-BGA (45x45)

封裝: 652-BBGA

庫存20,664

EPF10K100EQC240-3

Intel

IC FPGA 189 I/O 240QFP

Number of LABs/CLBs: 624
Number of Logic Elements/Cells: 4992
Total RAM Bits: 49152
Number of I/O: 189
Number of Gates: 257000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BQFP

庫存5,648

5SEEBF45C2L

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359250
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存2,272

5SGSED6N3F45I4N

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 220000
Number of Logic Elements/Cells: 583000
Total RAM Bits: 54553600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: 1932-BBGA, FCBGA

庫存4,464

10AX090N2F40E2LG

Intel

IC FPGA 600 I/O 1517FCBGA

Number of LABs/CLBs: 339620
Number of Logic Elements/Cells: 900000
Total RAM Bits: 59234304
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存4,384

5SGXMA7H3F35C4N

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 59939840
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,224

5SGXMA3E1H29C2LN

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 128300
Number of Logic Elements/Cells: 340000
Total RAM Bits: 23704576
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封裝: 780-BBGA, FCBGA

庫存7,216

10AX032E2F29E2LG

Intel

780-PIN FBGA

Number of LABs/CLBs: 119900
Number of Logic Elements/Cells: 320000
Total RAM Bits: 21040128
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存6,896

EP2SGX60CF780C5

Intel

IC FPGA 364 I/O 780FBGA

Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 364
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA

庫存4,624

5CEFA7U19C6N

Intel

IC FPGA 240 I/O 484UBGA

Number of LABs/CLBs: 56480
Number of Logic Elements/Cells: 149500
Total RAM Bits: 7880704
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存7,008

EP3C40F324I7

Intel

IC FPGA 195 I/O 324FBGA

Number of LABs/CLBs: 2475
Number of Logic Elements/Cells: 39600
Total RAM Bits: 1161216
Number of I/O: 195
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-BGA
Supplier Device Package: 324-FBGA (19x19)

封裝: 324-BGA

庫存6,240

EP3C10F256C6N

Intel

IC FPGA 182 I/O 256FBGA

Number of LABs/CLBs: 645
Number of Logic Elements/Cells: 10320
Total RAM Bits: 423936
Number of I/O: 182
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-LBGA

庫存4,208

5SGXMB6R1F40I2LG

Intel

IC FPGA 432 I/O 1517FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-FBGA (40x40)
Supplier Device Package: 1517-FBGA (40x40)

封裝: -

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EP4SGX360NF45C3G

Intel

IC FPGA 920 I/O 1932FCBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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AGID023R31B2I2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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5SGXMB6R2F43I3LG

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: -

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PDLXP610NE-B1

Intel

PDLXP610NE.B1

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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5SGXMA4H2F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: -

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5SGXEA7N1F45C1G

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封裝: -

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PRIXP423ABD

Intel

IC MPU IXP423 533MHZ PBGA492

Core Processor: Intel® IXP42X
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100Mbps (2)
SATA: -
USB: USB 1.1 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: 3DES, AES, DES, MD5, SHA-1
Package / Case: 492-BBGA
Supplier Device Package: 492-PBGA (35x35)

封裝: -

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AGIB022R29A2I1VB

Intel

IC FPGA AGILEX-I 2957BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

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PH28F320W30TD70

Intel

IC FLASH 32MBIT CFI 56VFBGA

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 32Mbit
Memory Interface: CFI
Clock Frequency: 40 MHz
Write Cycle Time - Word, Page: -
Access Time: 70 ns
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFBGA
Supplier Device Package: 56-VFBGA (7.7x9)

封裝: -

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AS83C196EA

Intel

16-BIT, MROM, 8096 CPU, 40MHZ

Core Processor: 83C196EA
Core Size: 16-Bit
Speed: 40MHz
Connectivity: SSIO
Peripherals: PWM, WDT
Number of I/O: 83
Program Memory Size: 8KB (8K x 8)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Data Converters: A/D 16x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-QFP
Supplier Device Package: 160-QFP

封裝: -

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5SGXEB6R2F43C2LG

Intel

IC FPGA 600 I/O 1760FBGA

Number of LABs/CLBs: 225400
Number of Logic Elements/Cells: 597000
Total RAM Bits: 53248000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: -

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