圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adesto Technologies |
DATA FLASH
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存3,136 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 36BGA
|
封裝: 36-TFBGA |
庫存3,184 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC MEMORY 512MB PAGE 64FBGA
|
封裝: - |
庫存3,072 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 128MBIT 133MHZ 90BGA
|
封裝: 90-TFBGA |
庫存6,864 |
|
DRAM | SDRAM - Mobile | 128Mb (4M x 32) | Parallel | 133MHz | - | 5.4ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
封裝: 44-TSOP (0.400", 10.16mm Width) |
庫存3,920 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 20NS 28SOJ
|
封裝: 28-BSOJ (0.300", 7.62mm Width) |
庫存2,032 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 266MHZ 60FBGA
|
封裝: 60-FBGA |
庫存5,104 |
|
DRAM | SDRAM - DDR2 | 512Mb (64M x 8) | Parallel | 267MHz | 15ns | 500ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-FBGA | 60-FBGA |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
封裝: 28-TSSOP (0.465", 11.80mm Width) |
庫存2,288 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存144,000 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1.125MBIT 12NS 256CABGA
|
封裝: 256-LBGA |
庫存6,464 |
|
SRAM | SRAM - Dual Port, Asynchronous | 1.125Mb (32K x 36) | Parallel | - | 12ns | 12ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 54VFBGA
|
封裝: 54-VFBGA |
庫存53,400 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (8x8) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 55NS 48TSOP
|
封裝: 48-TFSOP (0.724", 18.40mm Width) |
庫存3,200 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 8KBIT 1MHZ 8TSSOP
|
封裝: 8-TSSOP (0.173", 4.40mm Width) |
庫存2,160 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 8KBIT 100KHZ 8DIP
|
封裝: 8-DIP (0.300", 7.62mm) |
庫存12,684 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ON Semiconductor |
IC EEPROM 1K SPI 1MHZ 14SOIC
|
封裝: 14-SOIC (0.154", 3.90mm Width) |
庫存2,688 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
ON Semiconductor |
IC EEPROM 256 SPI 250KHZ 8SO
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存12,900 |
|
EEPROM | EEPROM | 256b (16 x 16) | SPI | 250kHz | 15ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Macronix |
IC FLASH 512M SPI 166MHZ
|
封裝: - |
庫存7,568 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O, QPI, DTR | 166MHz | 60µs, 750µs | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32G MMC LBGA
|
封裝: - |
庫存6,928 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Insignis Technology Corporation |
LPDDR4 8GB X32 2400MHZ CL16 10X1
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | LVSTL | 1.2 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 0°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Infineon Technologies |
IC FRAM 4MBIT SPI 50MHZ 8GQFN
|
封裝: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 4Mbit | SPI | 50 MHz | - | 8 ns | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 8-UQFN | 8-GQFN (3.23x3.28) |
||
Micron Technology Inc. |
TLC 8T 1TX8 FBGA 8DP
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC SRAM 18MBIT PARALLEL 165FBGA
|
封裝: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Synchronous | 18Mbit | Parallel | 300 MHz | - | 0.45 ns | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Winbond Electronics |
SPIFLASH, 1.8V, 256M-BIT, 4KB UN
|
封裝: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 512KBIT SPI/DUAL 8USON
|
封裝: - |
庫存9,000 |
|
FLASH | FLASH - NOR | 512Kbit | SPI - Dual I/O | 100 MHz | 50µs, 4ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (1.5x1.5) |
||
Winbond Electronics |
IC DRAM 4GBIT LVSTL 11 200WFBGA
|
封裝: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
ISSI, Integrated Silicon Solution Inc |
4Mb,High-Speed/Low Power,Async,5
|
封裝: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Mbit | Parallel | - | 10ns | 10 ns | 2.4V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Winbond Electronics |
2G-BIT SERIAL NAND FLASH, 1.8V
|
封裝: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | SPI - Quad I/O | 104 MHz | 700µs | 8 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Galvantech |
IC SRAM 4MBIT 117MHZ
|
封裝: - |
Request a Quote |
|
SRAM | SRAM | 4Mbit | - | 117 MHz | - | 7.5 ns | 3.3V | 0°C ~ 70°C | Surface Mount | 100-TQFP | - |