頁 9 - 3M 產品 - IC、電晶體用插槽

零件編號	製造商	描述	封裝	庫存	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
CUSTOM BGA	3M	CONN SOCKET BGA CUSTOM Type: BGA Number of Positions or Pins (Grid): Custom Pitch - Mating: 0.026" ~ 0.050" (0.65mm ~ 1.27mm) Contact Finish - Mating: Custom Contact Finish Thickness - Mating: Custom Contact Material - Mating: - Mounting Type: Through Hole Features: Custom Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存7,038	Custom	0.026" ~ 0.050" (0.65mm ~ 1.27mm)	Custom	Custom	-	Through Hole	Custom	-	-	-	-	-	-	-
249-930X-XX-2401	3M	CONN SOCKET BGA 49POS GOLD Type: BGA Number of Positions or Pins (Grid): 49 (Verification Required) Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存3,580	49 (Verification Required)	0.039" (1.00mm)	Gold	-	-	Through Hole	Closed Frame	-	-	-	-	-	-	-
500-032-050	3M	CONN SOCKET SIP 32POS GOLD Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存3,042	32 (1 x 32)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-040-050	3M	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存5,742	40 (2 x 20)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-032-050	3M	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存7,758	32 (2 x 16)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
400-028-050	3M	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Open Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存4,518	28 (2 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
300-032-050	3M	CONN SOCKET SIP 32POS GOLD Type: SIP Number of Positions or Pins (Grid): 32 (1 x 32) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: - Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 8µin (0.20µm) Contact Material - Post: - Housing Material: - Operating Temperature: -	封裝: -	庫存8,262	32 (1 x 32)	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	Through Hole	Closed Frame	-	0.100" (2.54mm)	Gold	8µin (0.20µm)	-	-	-
130-028-050	3M	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	封裝: -	庫存7,236	28 (2 x 14)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
130-024-050	3M	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	封裝: -	庫存5,454	24 (2 x 12)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
110-024-050	3M	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 8µin (0.20µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: Flash Contact Material - Post: Brass Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -65°C ~ 125°C	封裝: -	庫存3,474	24 (2 x 12)	0.100" (2.54mm)	Gold	8µin (0.20µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C