The 66AK2L06 SoC integrates the JESD204B interface standard, which reduces the total board area by up to 66%. This integration also enables users in the avionics, defense, medical, and test and measurement markets to develop products with higher performance and reduced power consumption by up to 50%. In addition, developers will benefit from TI's digital signal processing (DSP) programmability and pre-verification of multiple high-speed ADCs, DACs, and AFEs. Multi-core software development kit (MCSDK) and RF software development kit (RFSDK) further support TI's system-level solutions on the 66AK2L06 SoC, thereby reducing time to market by three times.
Breakthrough in embedded SoC and system integration – extending TI ’s highly integrated and scalable KeyStone multi-core architecture, digital front end (DFE) / digital down converter-up converter (DDUC) and 66AK2L06 SoC integration with JESD204B interface, Reduce system cost and power. The integration of TI's industry-leading DSPs with ARM Cortex processors provides software programmability with twice the performance of today's competitive solutions on the market today. Four TMS320C66x DSP cores (each core can provide signal processing capabilities up to 1.2GHz) allow customers flexible programming through floating-point programming. In order to perform complex control code processing, the dual ARM Cortex-A15 MPCore processor can provide up to 1.2 GHz of processing power and can directly access I / O with low latency in real time.
MBDA representative said: "TI's Keystone is based on 66AK2L06 SoC with adaptive power technology, which provides us with the best integrated processing capability for power-constrained and harsh environment applications." Fast Fourier Transform Coprocessor (FFTC) Module Accessible between all DSP cores to accelerate FFT and IFFT calculations required in applications such as radar systems. In addition, the Network Coprocessor (NETCP) is a hardware accelerator that processes packets, mainly processing Ethernet packets. It has four Gigabit Ethernet (GbE) modules for sending packets from a network compliant with IEEE 802.3 and Receive a packet from a packet. Accelerator (PA) to perform packet classification operations such as header matching, integration reduces power consumption and programmability, reduces power consumption by 50%, reduces floor space by 66% – adaptive power technology in 66AK2L06 reduces Up to 50% more power consumption than competing devices with cooling requirements. With integrated wideband sample rate conversion and digital filtering of up to 48 channels, the 66AK2L06 eliminates the need for additional equipment, reducing board area by up to 66%.
Software Programmability: Three Times the Speed ??of Development-SoCs have powerful features, configurable and programmable performance, enabling customers to develop three times faster than FPGAs or competing solutions on the market today. With the 66AK2L06 SoC, developers can change the DFE configuration immediately after deployment through software, while storing multiple configurations in DDR or flash memory with the ability to dynamically switch. The integration of the DFE and JESD204B interfaces allows the user to change the filter for optimization in a matter of days (instead of weeks for today's FPGAs) through software programmability. The company said that enhanced performance, lower power consumption, and smaller board size collectively reduced overall system costs by 50%.
JESD204B integrated integration simplifies digital data interfaces – JESD204B is an efficient, industry-standard serial communication link that simplifies data converters and processors in high-speed applications such as test and measurement, medical, defense and avionics Digital data interface. . In addition to the 66AK2L06 SoC, TI's JESD204B product portfolio also includes high-speed ADCs, such as 12-bit 4-GSPS ADC12J4000 and 16-bit 250-MSPS ADS42JB69. High-speed DACs, such as the 16-bit 2.5GSPS DAC38J84; and clock products, including the LMK04828 clock jitter cleaner.
Provide complete system solutions with time-to-market advantages – ensure customers have the right tools, software and support to quickly bring complete system solutions to the high-speed data generation and acquisition market. The TI 66AK2L06 SoC is software programmable, enabling manufacturing Businesses can quickly distinguish and adapt to changing market demands. With TI ’s KeyStone-based MCSDK and RFSDK, the 66AK2L06 SoC enables developers to speed time to market by providing out-of-the-box solutions. TI's development tools and runtime software support make migration and development of multi-core ARM platforms easier than ever. MCSDK supports TI SYS / BIOS operating system with open source Linux and ARM cores. MCSDK and RFSDK with pre-installed sample projects will provide evaluation modules (EVM). MCSDK and RFSDK are provided with XEVMK2LX EVM. In addition, TI Designs enables customers to use current FPGAs to connect data converters to signal processors through direct JESD204B interconnects to reduce costs, and the extensive ecosystem provides additional resources to help customers meet hardware, software, and new feature development demand. 66AK2L06 is currently sampling. The company said that it will achieve full volume shipments in the third quarter of 2015. TI Designs enables customers who currently use FPGAs to connect data converters to signal processors to reduce costs through direct JESD204B interconnects, and an extensive ecosystem provides additional resources that can help customers meet their hardware, software, and new feature development needs. 66AK2L06 is currently sampling. The company said that it will achieve full volume shipments in the third quarter of 2015. TI Designs enables customers who currently use FPGAs to connect data converters to signal processors to reduce costs through direct JESD204B interconnects, and an extensive ecosystem provides additional resources that can help customers meet their hardware, software, and new feature development needs. 66AK2L06 is currently sampling. The company said that it will achieve full volume shipments in the third quarter of 2015.
