TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU) | 黑森爾電子
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TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU)

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發佈日期: 2015-08-10
TE Connectivity's AMPMODU MTE interconnect system is targeted at wire-to-board and wire-to-wire applications and can be found in many types of electronic devices, including computers, copiers, commercial printers, appliances, medical equipment and automotive controls. This product implements Insulated Displacement Contacts (IDC) or crimp-in contacts to meet the individual needs of the end user.