Silicon Labs announced the launch of the new BGM240P and MGM240PPCB modules. The module is designed to provide faster time to market for connected products for smart home and industrial applications; At the same time, as the expansion products of BG24 and MG24 series wireless SoC, these new modules can support developers to obtain reliable wireless performance, energy efficiency and protect devices from network attacks.
The new BGM240P and MGM240P PCB modules are designed to provide industry-leading RF performance, low power consumption and extensive regulatory certification, so developers can bring devices to the market faster. These certified modules are designed for developers without rich RF experience and provide many of the same advantages as their SoC counterparts, including Cortex M33 processor with 1.5 MB flash memory and 256 kB RAM, and PSA Level 3 security certification
With the proven RF performance, the new BGM240P and MGM240P modules have passed the stringent wireless regulatory certification of FCC, CE, IC/ISED, MIC/TELEC and KCC. Therefore, designers can achieve rapid product launch by simplifying complex RF design and testing. These modules enable designers to avoid long development and certification cycles, and provide support for a variety of 2.4 GHz wireless Internet of Things protocols, including low-power Bluetooth and Bluetooth Mesh, as well as Zigbee, OpenThread, Matter, and multiple protocols.
Security is the core function of these PCB modules, which includes Secure VaultTM with PSA Level 3 authentication, and provides a special security engine with advanced security functions, including advanced hardware encryption of DPA countermeasures for AES128/256 and other security algorithms, safe startup with trust root and security loader (RTSL) technology, tamper detection, And security key management with physical non cloning function (PUF) and true random number generator (TRNG).
Silicon Labs also provides a wireless Pro kit with corresponding RF circuit boards to help designers quickly start developing applications using BGM240P and MGM240P PCB modules. The suite provides all necessary development tools for developing wireless applications such as smart home devices, smart lighting, gateways and digital assistants, as well as building automation and security.the new BGM240P and MGM240P modules are now available for booking. Their overall dimensions are very small, only 12.9 mm x 15.0 mm. Its working range is 1.8 V~3.8 V, - 40 ℃~+105 ℃.
