The ZGM230S Z-Wave 800 SIP module from Silicon Labs. This module provides developers with the Sub-GHZ connection of Z-Wave Mesh and Z-Wave Long Range, which is more than 50%longer than the battery life of the Z-Wave 700 series. The next-generation Z-WAVE 800 device is based on its low-power wireless GECKO platform, allowing fast development of Z-Wave grid network solutions for rapid development of energy saving and remote interoperability. , Sensor, lighting, door locks and heating air conditioners.
The SIP module is based on EFR32ZG23 SOC. 6.5mm × 6.5mm module includes 32-bit ARM Cortex-M33 core, 512KB flash memory (64KB application flash memory), local safety stacks using its Secure Vault technology, highly integrated sub-GHZ transceiver and crystal, decoupled and matching, providing a one The complete Z-WAVE solution only needs an external antenna. This module adopts low -power GECKO technology, including innovative low energy consumption technology, fast awakening time and energy -saving mode, which reduces the overall power consumption. It has a maximum extension of the battery life -a coin battery can be used for 10 years.
The Z-WAVE 800 development tool of Silicon Lab also includes the Z-Wave 800 Pro kit (ZWAVE-PK800A) and ZGM230S Z-Wave SIP module radio board (ZGM230-RB4205B). PRO Kit contains radio boards, providing a complete reference design for the 800 series EFR32ZG23 SOC and ZGM230s modules, providing all the necessary tools for the development of strong, high-capacity, scalable Z-Wave applications. ZGM230S Z-WAVE SIP module radio board (+14dBm) inserts the main development board of Pro Kit, including antenna with 868MHz and 915MHz frequencies.
