Linear Technology Corporation introduced the LTM9100 µModule, a all-in-one isolated Anyside switch controller that protects and monitors high-voltage DC power supplies up to 1000V. High-voltage power supplies used in industrial, data communications, avionics, and medical applications require controlled continuity and need isolation to control circuit protection, operator safety, and disconnecting ground paths. Relay-based alternatives or discrete solutions are bulky, complex, densely packed, and lack safety certification. By packaging all necessary functions, including isolated power and digital telemetry, in a compact BGA package, this innovative device saves design time, certification effort, and board area.
The device's internal 5kVRMS galvanic isolation barrier separates the digital interface from the switch controller to drive an external N-channel MOSFET or IGBT switch. To ensure a strong isolation barrier, the controller has undergone 6kVRMS production testing and will be recognized at the component-level UL 1577 standard, saving months of certification time for end equipment manufacturers. I²C / SMBus interface provides access to isolated digital measurements of load current, bus voltage and temperature, allowing monitoring of power and energy on high-voltage buses.
Due to its isolation characteristics, the device can be easily configured for high-side, low-side (ground return) and floating applications. Soft-start loads minimize inrush current and protect the power supply from overloads and short circuits with current-limiting circuit breakers. The LTM9100 is versatile enough to control inrush currents in hot-swap cards, AC transformers, motor drives and inductive loads. Adjustable undervoltage and overvoltage lockout thresholds ensure that the load can operate only when the input power is within its effective range. A fully integrated DC-DC converter, including a transformer, powers the isolated switch control terminal.
The device is specified over the −40C to 105C temperature range and is packaged in a 22mm x 9mm x 5.16mm BGA package with a creepage distance of 14.6mm between the logic side and the isolated side.
