Lattice Semiconductor has expanded its automotive portfolio with new ECP5 and CrossLink programmable devices tailored specifically for interface bridging applications.
The company said that the two products provide optimized connectivity solutions for advanced driver assistance systems (ADAS) and infotainment applications, while also reducing the gap between emerging image sensors and video display interfaces and traditional automotive interfaces. difference.
Rob Lineback, senior market research analyst at IC Insights, said: "The CMOS image sensor market is expected to maintain steady growth over the next five years." "Automotive systems are expected to be the fastest growing applications for CMOS image sensors. By 2020, the compound annual growth rate will be It will reach 55% to $ 2.2 billion, or about 14% of the market's total estimated $ 15.2 billion. "
The tremendous advances in mobile application processors, the rapid spread of low-cost image sensors and displays, and the widespread adoption of MIPI standard interfaces have accelerated innovation in automotive applications over the past few years. Ideally, every device in the system should interface directly with the application processor, but this is not always the case. With the increasing use of mobile platforms in automotive applications, this problem is more complicated. Interface bridge devices solve this problem by supporting multiple interfaces and protocols (including MIPI D-PHY, MIPI CSI-2, MIPI DSI) and a long list of traditional video interfaces and protocols (such as CMOS, RGB, MIPI DPI, MIPI). , SubLVDS, SLVS, LVDS and OpenLDI.
Deepak Boppana, Director of Marketing, Lattice Semiconductor, added: "The automotive industry has seen the addition of cameras and sensors in vehicles in order to accommodate technological advances and demand for ADAS and infotainment applications. This dynamic has led to mobile image sensors Interface between application processors and embedded displays used in these applications. Our ECP5 and CrossLink devices enable our automotive customers to use cameras and displays with the latest mobile interface technology to reduce overall system cost Consumption and size, while speeding time to market for next-generation designs. "
Main features: ECP5 1-Cost-optimized architecture with high-speed SERDES channels, providing video interfaces for Open LDI, LVDS FPD-Link, eDP, PCIe and GigE. 2-Small package with high functional density. 3-Low power consumption. 4 – pre / post processing (ie image signal processing). 5-Software support in Lattice Diamond 3.8.
CrossLink 1-The world's fastest MIPI D-PHY bridge device, providing up to 4K UHD resolution at 12Gbps bandwidth. 2-Supports popular mobile devices, cameras, displays and legacy interfaces, such as MIPI D-PHY, MIPI CSI-2, MIPI DSI, MIPI DPI, CMOS and SubLVDS, LVDS, etc. 3-Industry's smallest package size, optional 6mm2. 4-Lowest power programmable bridge solution in active mode. 5-Built-in sleep mode. 6-Leverage the most powerful features of ASSP and FPGA to provide the best solution for the best of both worlds. 7-Software support in Lattice Diamond 3.8.
