Diodes Incorporated (Diodes) announces PCIe® 3.0 packet switcher ICs. PI7C9X3G1632GP provides flexible combinations of multiple ports and channel widths to improve performance and availability. This design helps the system handle artificial intelligence/deep learning workloads, data storage devices, servers in data centers, wireless/wired telecommunications infrastructure, and a variety of modern embedded hardware.
The PI7C9X3G1632GP's infrastructure consists of 2 bricks, each with 8 ports and 16 channels, supporting 32 channels of SERDES, with configuration options ranging from 2 ports to 16 ports. To meet a variety of potential product applications, such as port fan-out and multiple host connections, different port types can be configured, including upstream ports, downstream ports, and cross-domain endpoint (CDEP) ports.
PI7C9X3G1632GP is embedded with multiple DMA channels to improve the data communication efficiency between host/host and connecting endpoints. Low packet forwarding delay (typically <150ns) means high-efficiency data transfer. The integration of PCIe 3.0 clock buffers helps reduce total bill of materials cost and simplifies implementation.
The switch includes additional features, such as advanced error reporting, error handling and end-to-end data protection, which are critical to ensuring continuous transmission reliability. In addition, operation can be monitored using the built-in thermal sensor.
Advanced power management features provide significant savings in energy consumption, allowing the PI7C9X3G1632GP to operate over an industrial temperature range of -40°C to 85°C and can be used in a variety of product applications.the PI7C9X3G1632GP packet switcher is packaged in a 676-pin FCBGA package and measures 27mm x 27mm.
