Bergquist announced the combination of the latest Gap Pad HC 3.0 gap filler with high thermal conductivity and adaptability, creating a high-performance thermally conductive material for applications requiring low assembly stress.
Hard-working components (such as ASICs and DSPs) can now operate in electronic devices (such as telecommunication line cards and consumer products), using the new highly compatible Gap Pad HC 3.0 to eliminate insulation air gaps without PCB Or the fragile component I / apply excessive pressure to make the heat sink work cooler. The
gap pad HC 3.0 can also be inserted between the electronic module and the heat sink to maximize heat dissipation. Gap Pad HC 3.0 is available in sheet form or die-cutting pads with thicknesses ranging from 0.508mm to 3.175mm. By combining the unique 3.0 W / mK packing and low modulus resin, low thermal resistance can be achieved at low pressure.
In addition, the company claims that the natural inherent tack on the Gap Pad HC 3.0 side can further increase thermal efficiency by eliminating any need for an adhesive layer.
