MediaTek unveils its first 5G mmWave chip, the Dimensity 1050, with seamless connectivity, fast display, gaming and power efficiency. With dual connectivity, the device provides sub-6 GHz (FR1) and ultra-fast mmWave (FR2) connectivity over long distances, even in densely populated areas.
By performing 3CC carrier aggregation on the sub-6 GHz spectrum and 4CC carrier aggregation on the mmWave spectrum, the Dimensity 1050 is 53% faster than LTE + mmWave aggregation alone, and provides greater coverage. Additionally, the part includes built-in Wi-Fi 6E and Bluetooth 5.2 capabilities.
Manufactured on a 6nm process, the Dimensity 1050 features an octa-core CPU consisting of two 2.5-GHz Arm Cortex-A78 cores and six 2.0-GHz Arm Cortex-A55 cores. It also contains an Arm Mali-G610 graphics engine. MediaTek's HyperEngine 5.0 gaming technology improves power efficiency and ensures low-latency connections for longer gaming sessions and performance. Other chip features include support for 144-Hz Full HD displays with intense, vivid colors and dual High Dynamic Range (HDR) video capture.
Smartphones powered by the Dimensity 1050 are expected to be available in the third quarter of 2022.
