Infineon Technologies AG has introduced new HYPERRAM 3.0 devices to further complement its high-bandwidth, low-pin-count memory solutions. The device has a new 16-bit extended HyperBus interface, which can double the throughput to 800MBps. The data throughput per pin of the new HYPERRAM3.0 memory solution is much higher than that of PSRAM, SDR DRAM and other existing technologies on the market. .
Infineon Technologies AG has combined the hybrid flyback (HFB) controller, XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs.
Infineon Technologies has announced the launch of a battery-powered intelligent alarm system (SAS). The technology platform utilizes artificial intelligence/machine learning (AI/ML) -based sensor fusion technology to achieve high accuracy and ultra-low power consumption. Combined with a low-power acoustic event detection scheme, this results in excellent performance.
Infineon Technologies AG has added HYPERRAM 3.0 to its portfolio of high-bandwidth, low-pin count memory solutions. The device provides a new, 16-bit extended version of the HyperBus interface that doubles throughput to 800MBps.
Infineon Technologies AG launches NFC security tag products that meet high security requirements and can be used to verify the authenticity of products: NFC4TCxxx tags introduce an open, standardized security architecture using the AES-128 encryption algorithm and have differential power analysis ( DPA), Differential Failure Analysis (DFA), etc. are inherently resistant to physical attacks.
Infineon Technologies Inc. 's OPTIGA™ Trust M security chip has become the first security platform to receive CLS-READY certification from the Cyber Security Agency of Singapore (CSA). As the first CLS-Ready security platform, Infineon OPTIGA™ Trust M security chips can help customers save significant test costs and time, reducing technical and operational risks.
Infineon Technologies Inc. has further expanded its LI TIX Power lineup with the launch of the dual-channel stand-alone DC-DC controller TLD6098-2ES. The controller is the first product that can drive an entire LED headlight without an additional microcontroller.
Infineon Technologies Bipolar GmbH & Co. KG is further expanding its high-power Prime Switch product lineup with the launch of new opt-on IGBT (PPI) in ceramic plate package with internal continuous current diode (FWD). Designed for transmission and distribution applications, the PPI is ideal for high-current modular multilevel converters (MMCS), medium-voltage drivers, DC grid circuit breakers, wind power converters, and traction systems
Infineon Technologies has released the new 1700 V TRENCH STOP™ IGBT7 module in EconoDUAL™ 3 standard industrial packaging. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings, further extending the inverter's power range. The module can be widely used in wind power, motor drive, static reactive power generator (SVG) and other applications.
Infineon Technologies AG has launched the new XENSIV™ PAS CO2 Shield2Go evaluation board for air quality monitoring and on-demand ventilation control to help achieve energy savings. This new evaluation board is part of Infineon's Shield2Go product portfolio. The product portfolio covers sensors, microcontrollers and safety ICs, which can be freely combined as part of integrated prototyping.
The XENSIV™ automotive millimeter-wave radar sensor (BGT60ATR24C) launched by Infineon Technologies is applied to the Intelligent Cockpit Monitoring System (ICMS), which can detect the slight movements and vital signs of babies and animals left in the car, and sound an alarm. In addition, this small, cost-effective chipset can be used for gesture sensing in front-end radars, high-resolution frequency modulated continuous wave (FM CW) radar ranging, proximity sensing operations, and covert sensing in radomes, among many others. application.
The leading semiconductor component distributor dedicated to the Asia-Pacific market, Dalian General Holdings, announced that its subsidiary Pinjia has launched a 60W high-efficiency ultra-low standby power supply solution based on Infineon's ICE5GSAG device.
Infineon Technologies AG has combined the hybrid flyback (HFB) controller, XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs.
Infineon has announced the WLC1115 transmitter controller IC, the first product in the new WLC line of controllers, which uses inductive wireless charging technology. In addition, Infineon offers a WLC1115-based and Qi V1.3.2 certified MP A11 wireless charging transmitter reference design solution that can be used in a variety of applications such as smartphones, smart speakers, docking stations, display holders, industrial or medical device accessories.
Infineon Technologies AG has released an innovative solution that integrates a hybrid flyback (HFB) controller XDP™ digital power controller with a 600 V CoolGaN™ integrated power stage (IPS) product (IGI60F1414A1L) , which can be used to design energy-efficient, high-power-density chargers and adapters.
In the future, keys will be a thing of the past in many areas of people's daily lives. Infineon Technologies AG will bring to the market a smart lock solution that can be opened and closed via a mobile phone. The smart lock requires no batteries and can be wirelessly charged using a mobile phone, a technique known as "energy harvesting".
Infineon has developed a 32-bit programmable microcontroller based on the ARM® Cortex®-M0 core, and the NAC1080 MCU has an NFC interface that can directly control the device through a smartphone. Advanced on-premises and cloud capabilities are extensible in mobile apps provided by regional marketing partners. This helps customers reduce BOM cost and supports miniaturized design of products.
Infineon technologies inc. has introduced efficient and reliable DC-DC buck converter modules to further expand its POL (load power) module lineup. These modules are ideal for system designers who want POL products that are compact, fully integrated, and easy to design to help them speed new products to market.