Infineon Technologies AG has released an innovative solution that integrates a hybrid flyback (HFB) controller XDP™ digital power controller with a 600 V CoolGaN™ integrated power stage (IPS) product (IGI60F1414A1L) , which can be used to design energy-efficient, high-power-density chargers and adapters.
Mouser Electronics Announces the Release of a New eBook, "Effortless Embedded Solutions," in collaboration with Microchip Technology, exploring the use of embedded microcontrollers in device design
Winbond Electronics, a global leader in semiconductor storage solutions, announced that its new package 100BGA LPDDR4/4X complies with the JEDEC JED209-4 standard, which can achieve energy saving and carbon reduction. The product can significantly reduce PCB size for a more compact design for IoT applications that require higher data throughput in a small package.
Nexperia announces PMCB60XN and PMCB60XNE 30V N-Channel Small Signal Trench MOSFETs in an ultra-compact wafer-level DSN1006 package with market-leading RDS(on) characteristics where space is constrained and battery life is critical , which can make the power more durable.
KEMET has announced the launch of its new GTX series of metal-encased three-phase filters. This series addresses the growing demand for EMI-RFI filters to suppress electromagnetically conducted noise in general-purpose inverters and medical power supplies. KEMET GTX Metal Housing Filters meet 3-phase EMC requirements with various characteristics. Manufactured with nanocrystalline cores, these filters achieve excellent damping and attenuation characteristics in a compact size with a wider frequency range.
TDK introduces the CLT32 series of power inductors with a new design. The components of this series are not only extremely compact in size, but also have excellent electrical specifications and are available in nine models. The operating temperature range is -40 °C to 165 °C including inductor temperature rise. They are all extremely compact, with a footprint of only 3.2 x 2.5 mm and a height of 2.5 mm
SABIC introduces its first polyetherimide (PEI) resin-based material for surface mount technology (SMT), ULTEM 3473 resin. This new product is designed to respond to the market trend of miniaturization and light weight of 5G base stations by providing metal replacement.
Bourns, the world's leading manufacturer of electronic components, introduces a new high-current shielded power inductor. The five series utilize Bourns' advanced metal powder magnetic core and manufacturing process design, as well as the advantages of magnetically shielded construction to achieve low radiation, high saturation current, high temperature rise or effective current, and low DC resistance.
Yageo, a global leader in passive components, has launched the CL series of MLCCs for applications requiring low ESL (equivalent series inductance). Yageo's CL series MLCC product portfolio covers X5R (sizes from 0204 to 0612) and X7R (sizes from 0306 to 0612), with a capacitance value up to 1uF and a rated voltage of 50V.
u-blox, a leading global provider of positioning and wireless communication technologies and services, announces the u-blox MAYA-W2 “3-in-1” short-range communication module supporting Wi-Fi 6, Bluetooth® Low Energy (LE) 5.2 and IEEE 802.15.4 (Thread and Zigbee), suitable for industrial automation, smart buildings, energy management, healthcare, smart home and many other industry applications, will take the lead in applying Wi-Fi 6 technology to the industrial and consumer mass markets.
SIKO presents the most compact product in this segment - the AP05 with integrated IO-Link interface. Networked position indicators are now indispensable in the machine building industry as a central component for monitoring format changeovers. They show the machine operator the setpoint and actual value on the adjustment spindle, which greatly improves the operator's comfort.
Smart Microelectronics pre-drive MCU microcontroller MM32SPIN580C uses high-performance Arm®Cortex®-M0 as the core 32-bit MCU. Arm®'s Cortex®-M0 processor is the latest generation of embedded Arm processors that provide a low-cost platform, reduced pin count, and reduced system power consumption for implementing MCU needs, while delivering superior computing performance and advanced interrupt system response.
Posifa Technologies has announced the new PVC4100 series of fully calibrated MEMS Pirani vacuum sensors. This solution consists of a surface mount MEMS Pirani sensor and a microcontroller-based measurement circuit designed for cost-effective OEM integration, all packaged on an ultra-compact PCB with connector-terminated wiring harnesses superior.
Vishay Custom Magnetics IHDM-1107BBEV-20 and IHDM-1107BBEV-30 use iron powder core technology to provide excellent inductance and saturation current stability over the harsh operating temperature range of -55 °C to +180 °C. Low power consumption and excellent heat dissipation performance.
In the future, keys will be a thing of the past in many areas of people's daily lives. Infineon Technologies AG will bring to the market a smart lock solution that can be opened and closed via a mobile phone. The smart lock requires no batteries and can be wirelessly charged using a mobile phone, a technique known as "energy harvesting".
Maxim Integrated's MAX32672 is an ultra-low-power, highly integrated, cost-effective, and highly reliable 32-bit microcontroller that allows the design of complex sensor processing without compromising battery life. It combines a flexible and versatile power management unit with a powerful Arm Cortex-M4 processor with FPU.
ST's VNF1048F automotive-grade high-side switch controller integrates enhanced system protection diagnostics and ST's I2-t silicon fuse protection technology.
The u-blox MIA-M10 module has a built-in miniature antenna and battery, and is only the size of a chip, providing ultra-low power consumption and reliable positioning performance, helping to shorten the development cycle of compact asset tracking solutions.
