頁 98 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC18V256PC20I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 20-PLCC Programmable Type: In System Programmable Memory Size: 256Kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存2,288
XC18V01PC20I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 20-PLCC Programmable Type: In System Programmable Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存16,584
XCZU11EG-L1FFVF1517I	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,952
XCZU2CG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存6,832
XC6SLX25-N3FG484C	Xilinx Inc.	IC FPGA 266 I/O 484FBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 266 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,648
XA3SD3400A-4FGG676I	Xilinx Inc.	IC FPGA 469 I/O 676FBGA Number of LABs/CLBs: 5968 Number of Logic Elements/Cells: 53712 Total RAM Bits: 2322432 Number of I/O: 469 Number of Gates: 3400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存3,712
XC5VSX50T-1FFG1136CES	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存5,616
XCV100-4CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 94 Number of Gates: 108904 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存10,788
XC4036XL-09BG432C	Xilinx Inc.	IC FPGA 288 I/O 432MBGA Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 288 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存9,300
XC4006E-2PC84C	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 256 Number of Logic Elements/Cells: 608 Total RAM Bits: 8192 Number of I/O: 61 Number of Gates: 6000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存2,592
XC7VX690T-2FF1927I	Xilinx Inc.	IC FPGA 600 I/O 1927FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1927-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存2,336
XQ4VFX100-11FF1152I4012	Xilinx Inc.	IC FPGA VIRTEX-4FX 1152FFBGA Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,576
XC6VLX240T-1FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,476
XC5VFX70T-3FFG665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存6,720
XC5VSX50T-2FF665I	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存8,604
XC4VLX25-12SFG363C	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存4,448
XC7A100T-1CSG324I	Xilinx Inc.	IC FPGA ARTIX7 210 I/O 324CSBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存4,208
XA6SLX45-2FGG484I	Xilinx Inc.	IC FPGA 316 I/O 484FGGBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 316 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,720
XC3S1000-4FG456I	Xilinx Inc.	IC FPGA 333 I/O 456FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 333 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存4,640
XA6SLX4-3CSG225Q	Xilinx Inc.	IC FPGA 132 I/O 225CSGBGA Number of LABs/CLBs: 300 Number of Logic Elements/Cells: 3840 Total RAM Bits: 221184 Number of I/O: 132 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存3,376
XA3S100E-4TQG144I	Xilinx Inc.	IC FPGA 108 I/O 144TQFP Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 108 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存4,672
XC3S200-4VQG100C	Xilinx Inc.	IC FPGA 63 I/O 100VQFP Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 4320 Total RAM Bits: 221184 Number of I/O: 63 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存80,160
XC3S250E-4VQG100I	Xilinx Inc.	IC FPGA 66 I/O 100VQFP Number of LABs/CLBs: 612 Number of Logic Elements/Cells: 5508 Total RAM Bits: 221184 Number of I/O: 66 Number of Gates: 250000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	封裝: 100-TQFP	庫存8,088
XC9572-10PQG100C	Xilinx Inc.	IC CPLD 72MC 10NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存31,908
XC95216-20PQ160C	Xilinx Inc.	IC CPLD 216MC 20NS 160QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 133 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存11,040
XC2C512-7FGG324C	Xilinx Inc.	IC CPLD 512MC 7.1NS 324FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 270 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 324-BBGA Supplier Device Package: 324-FBGA (23x23)	封裝: 324-BBGA	庫存26,544
XCKU15P-1FFVA1760E	Xilinx Inc.	XCKU15P-1FFVA1760E Number of LABs/CLBs: 65340 Number of Logic Elements/Cells: 1143450 Total RAM Bits: 82329600 Number of I/O: 512 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存6,128
XCDAISY-CSG324	Xilinx Inc.	IC 225 BALL CHIP-SCALE BGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,160

XC18V256PC20I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 20-PLCC

Programmable Type: In System Programmable
Memory Size: 256Kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存2,288

XC18V01PC20I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 20-PLCC

Programmable Type: In System Programmable
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存16,584

XCZU11EG-L1FFVF1517I

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,952

XCZU2CG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存6,832

XC6SLX25-N3FG484C

Xilinx Inc.

IC FPGA 266 I/O 484FBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 266
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,648

XA3SD3400A-4FGG676I

Xilinx Inc.

IC FPGA 469 I/O 676FBGA

Number of LABs/CLBs: 5968
Number of Logic Elements/Cells: 53712
Total RAM Bits: 2322432
Number of I/O: 469
Number of Gates: 3400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存3,712

XC5VSX50T-1FFG1136CES

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 4080
Number of Logic Elements/Cells: 52224
Total RAM Bits: 4866048
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存5,616

XCV100-4CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 94
Number of Gates: 108904
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存10,788

XC4036XL-09BG432C

Xilinx Inc.

IC FPGA 288 I/O 432MBGA

Number of LABs/CLBs: 1296
Number of Logic Elements/Cells: 3078
Total RAM Bits: 41472
Number of I/O: 288
Number of Gates: 36000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存9,300

XC4006E-2PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 256
Number of Logic Elements/Cells: 608
Total RAM Bits: 8192
Number of I/O: 61
Number of Gates: 6000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存2,592

XC7VX690T-2FF1927I

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

Number of LABs/CLBs: 54150
Number of Logic Elements/Cells: 693120
Total RAM Bits: 54190080
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1927-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存2,336

XQ4VFX100-11FF1152I4012

Xilinx Inc.

IC FPGA VIRTEX-4FX 1152FFBGA

Number of LABs/CLBs: 10544
Number of Logic Elements/Cells: 94896
Total RAM Bits: 6930432
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,576

XC6VLX240T-1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,476

XC5VFX70T-3FFG665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 5600
Number of Logic Elements/Cells: 71680
Total RAM Bits: 5455872
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存6,720

XC5VSX50T-2FF665I

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 4080
Number of Logic Elements/Cells: 52224
Total RAM Bits: 4866048
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存8,604

XC4VLX25-12SFG363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存4,448

XC7A100T-1CSG324I

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存4,208

XA6SLX45-2FGG484I

Xilinx Inc.

IC FPGA 316 I/O 484FGGBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 316
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,720

XC3S1000-4FG456I

Xilinx Inc.

IC FPGA 333 I/O 456FBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 333
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存4,640

XA6SLX4-3CSG225Q

Xilinx Inc.

IC FPGA 132 I/O 225CSGBGA

Number of LABs/CLBs: 300
Number of Logic Elements/Cells: 3840
Total RAM Bits: 221184
Number of I/O: 132
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存3,376

XA3S100E-4TQG144I

Xilinx Inc.

IC FPGA 108 I/O 144TQFP

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 108
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存4,672

XC3S200-4VQG100C

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 4320
Total RAM Bits: 221184
Number of I/O: 63
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存80,160

XC3S250E-4VQG100I

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

Number of LABs/CLBs: 612
Number of Logic Elements/Cells: 5508
Total RAM Bits: 221184
Number of I/O: 66
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

庫存8,088

XC9572-10PQG100C

Xilinx Inc.

IC CPLD 72MC 10NS 100QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 72
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存31,908

XC95216-20PQ160C

Xilinx Inc.

IC CPLD 216MC 20NS 160QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 216
Number of Gates: 4800
Number of I/O: 133
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存11,040

XC2C512-7FGG324C

Xilinx Inc.

IC CPLD 512MC 7.1NS 324FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.1ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 270
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Supplier Device Package: 324-FBGA (23x23)

封裝: 324-BBGA

庫存26,544

XCKU15P-1FFVA1760E

Xilinx Inc.

XCKU15P-1FFVA1760E

Number of LABs/CLBs: 65340
Number of Logic Elements/Cells: 1143450
Total RAM Bits: 82329600
Number of I/O: 512
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存6,128

XCDAISY-CSG324

Xilinx Inc.

IC 225 BALL CHIP-SCALE BGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,160