頁 84 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FFG1153	Xilinx Inc.	FFG1153 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,048
XC17V04PC44C	Xilinx Inc.	IC PROM SER 4MBIT 3.3V 44-PLCC Programmable Type: OTP Memory Size: 4Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存5,824
XC17256ELPD8C	Xilinx Inc.	IC 3V SER CFG PROM 256K 8-DIP Programmable Type: OTP Memory Size: 256Kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存16,320
XCZU11EG-3FFVC1156E	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存4,368
XCZU9EG-2FFVC900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,344
XCV200E-8CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 94 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	封裝: 144-TFBGA, CSPBGA	庫存5,200
XCS30-3PQ240C	Xilinx Inc.	IC FPGA 192 I/O 240QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 30000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存6,224
XCVU125-2FLVD1517E	Xilinx Inc.	IC FPGA 338 I/O 1517FCBGA Number of LABs/CLBs: 89520 Number of Logic Elements/Cells: 1566600 Total RAM Bits: 90726400 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,256
XC6VLX365T-L1FF1156C	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 28440 Number of Logic Elements/Cells: 364032 Total RAM Bits: 15335424 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存4,240
XC6VLX240T-2FF1759I	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,600
XC5VLX110-3FF1153C	Xilinx Inc.	IC FPGA 800 I/O 1153FCBGA Number of LABs/CLBs: 8640 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4718592 Number of I/O: 800 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1153-BBGA, FCBGA Supplier Device Package: 1153-FCBGA (35x35)	封裝: 1153-BBGA, FCBGA	庫存3,504
XC6VLX240T-1FFG1759C	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,984
XCKU5P-1SFVB784E	Xilinx Inc.	XCKU5P-1SFVB784E Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 35737600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,656
XC2VP40-6FG676C	Xilinx Inc.	IC FPGA 416 I/O 676FBGA Number of LABs/CLBs: 4848 Number of Logic Elements/Cells: 43632 Total RAM Bits: 3538944 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存3,616
XC5VLX20T-2FF323I	Xilinx Inc.	IC FPGA 172 I/O 323FCBGA Number of LABs/CLBs: 1560 Number of Logic Elements/Cells: 19968 Total RAM Bits: 958464 Number of I/O: 172 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 323-BBGA, FCBGA Supplier Device Package: 323-FCBGA (19x19)	封裝: 323-BBGA, FCBGA	庫存7,568
XC5VLX20T-1FFG323I	Xilinx Inc.	IC FPGA 172 I/O 323FCBGA Number of LABs/CLBs: 1560 Number of Logic Elements/Cells: 19968 Total RAM Bits: 958464 Number of I/O: 172 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 323-BBGA, FCBGA Supplier Device Package: 323-FCBGA (19x19)	封裝: 323-BBGA, FCBGA	庫存4,832
XC6SLX150-L1FG900C	Xilinx Inc.	IC FPGA 576 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存6,432
XC6SLX100-2FG676C	Xilinx Inc.	IC FPGA 480 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,992
XA3S700A-4FGG400Q	Xilinx Inc.	IC FPGA 311 I/O 400FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 311 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存5,520
XC3S1200E-4FGG320I	Xilinx Inc.	IC FPGA 250 I/O 320FBGA Number of LABs/CLBs: 2168 Number of Logic Elements/Cells: 19512 Total RAM Bits: 516096 Number of I/O: 250 Number of Gates: 1200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 320-BGA Supplier Device Package: 320-FBGA (19x19)	封裝: 320-BGA	庫存2,100
XC6SLX16-L1CSG324C	Xilinx Inc.	IC FPGA 232 I/O 324CSBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 232 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存5,920
XC95216-15PQ160I	Xilinx Inc.	IC CPLD 216MC 15NS 160QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 133 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存10,020
XC95144-15PQ100C	Xilinx Inc.	IC CPLD 144MC 15NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 15.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 81 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存6,608
XC2C512-7PQ208C	Xilinx Inc.	IC CPLD 512MC 7.1NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 173 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存4,304
XC2C384-10PQ208C	Xilinx Inc.	IC CPLD 384MC 9.2NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.2ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 173 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,024
XC2C512-7FTG256C	Xilinx Inc.	IC CPLD 512MC 7.1NS 256BGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存9,072
XC7S75-1FGGA484I	Xilinx Inc.	XC7S75-1FGGA484I Number of LABs/CLBs: 6000 Number of Logic Elements/Cells: 76800 Total RAM Bits: 4331520 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存7,520
XC7S25-2CSGA225C	Xilinx Inc.	XC7S25-2CSGA225C Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存5,536

XCMECH-FFG1153

Xilinx Inc.

FFG1153 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,048

XC17V04PC44C

Xilinx Inc.

IC PROM SER 4MBIT 3.3V 44-PLCC

Programmable Type: OTP
Memory Size: 4Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存5,824

XC17256ELPD8C

Xilinx Inc.

IC 3V SER CFG PROM 256K 8-DIP

Programmable Type: OTP
Memory Size: 256Kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存16,320

XCZU11EG-3FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存4,368

XCZU9EG-2FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,344

XCV200E-8CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 94
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

庫存5,200

XCS30-3PQ240C

Xilinx Inc.

IC FPGA 192 I/O 240QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 30000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存6,224

XCVU125-2FLVD1517E

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

Number of LABs/CLBs: 89520
Number of Logic Elements/Cells: 1566600
Total RAM Bits: 90726400
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,256

XC6VLX365T-L1FF1156C

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 28440
Number of Logic Elements/Cells: 364032
Total RAM Bits: 15335424
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存4,240

XC6VLX240T-2FF1759I

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,600

XC5VLX110-3FF1153C

Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

Number of LABs/CLBs: 8640
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4718592
Number of I/O: 800
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1153-BBGA, FCBGA
Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

庫存3,504

XC6VLX240T-1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,984

XCKU5P-1SFVB784E

Xilinx Inc.

XCKU5P-1SFVB784E

Number of LABs/CLBs: 27120
Number of Logic Elements/Cells: 474600
Total RAM Bits: 35737600
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,656

XC2VP40-6FG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

Number of LABs/CLBs: 4848
Number of Logic Elements/Cells: 43632
Total RAM Bits: 3538944
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存3,616

XC5VLX20T-2FF323I

Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

Number of LABs/CLBs: 1560
Number of Logic Elements/Cells: 19968
Total RAM Bits: 958464
Number of I/O: 172
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 323-BBGA, FCBGA
Supplier Device Package: 323-FCBGA (19x19)

封裝: 323-BBGA, FCBGA

庫存7,568

XC5VLX20T-1FFG323I

Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

Number of LABs/CLBs: 1560
Number of Logic Elements/Cells: 19968
Total RAM Bits: 958464
Number of I/O: 172
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 323-BBGA, FCBGA
Supplier Device Package: 323-FCBGA (19x19)

封裝: 323-BBGA, FCBGA

庫存4,832

XC6SLX150-L1FG900C

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存6,432

XC6SLX100-2FG676C

Xilinx Inc.

IC FPGA 480 I/O 676FCBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,992

XA3S700A-4FGG400Q

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存5,520

XC3S1200E-4FGG320I

Xilinx Inc.

IC FPGA 250 I/O 320FBGA

Number of LABs/CLBs: 2168
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 250
Number of Gates: 1200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 320-BGA
Supplier Device Package: 320-FBGA (19x19)

封裝: 320-BGA

庫存2,100

XC6SLX16-L1CSG324C

Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 232
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存5,920

XC95216-15PQ160I

Xilinx Inc.

IC CPLD 216MC 15NS 160QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 216
Number of Gates: 4800
Number of I/O: 133
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存10,020

XC95144-15PQ100C

Xilinx Inc.

IC CPLD 144MC 15NS 100QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 15.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 144
Number of Gates: 3200
Number of I/O: 81
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存6,608

XC2C512-7PQ208C

Xilinx Inc.

IC CPLD 512MC 7.1NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.1ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 173
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存4,304

XC2C384-10PQ208C

Xilinx Inc.

IC CPLD 384MC 9.2NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 9.2ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 173
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,024

XC2C512-7FTG256C

Xilinx Inc.

IC CPLD 512MC 7.1NS 256BGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.1ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存9,072

XC7S75-1FGGA484I

Xilinx Inc.

XC7S75-1FGGA484I

Number of LABs/CLBs: 6000
Number of Logic Elements/Cells: 76800
Total RAM Bits: 4331520
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存7,520

XC7S25-2CSGA225C

Xilinx Inc.

XC7S25-2CSGA225C

Number of LABs/CLBs: 1825
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存5,536