頁 66 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCZU11EG-2FFVC1156E	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,344
XCZU6EG-L1FFVB1156I	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存2,960
XCZU3EG-L1SBVA484I	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封裝: 484-BBGA, FCBGA	庫存5,248
XCZU2CG-2SBVA484I	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封裝: 484-BBGA, FCBGA	庫存5,888
XC7Z020-1CLG484I	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 484BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-LFBGA, CSPBGA	庫存9,228
XC2V8000-4FFG1517C	Xilinx Inc.	IC FPGA 1108 I/O 1517FCBGA Number of LABs/CLBs: 11648 Number of Logic Elements/Cells: - Total RAM Bits: 3096576 Number of I/O: 1108 Number of Gates: 8000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,528
XCV600E-7FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,480
XCV600-4FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 444 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,208
XCV400-5BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 81920 Number of I/O: 404 Number of Gates: 468252 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	封裝: 560-LBGA, Metal	庫存6,384
XCV1000E-8FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 6144 Number of Logic Elements/Cells: 27648 Total RAM Bits: 393216 Number of I/O: 512 Number of Gates: 1569178 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存5,680
XCVU7P-1FLVC2104E	Xilinx Inc.	XCVU7P-1FLVC2104E Number of LABs/CLBs: 98520 Number of Logic Elements/Cells: 1724100 Total RAM Bits: 236134400 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存3,792
XC7VX690T-3FFG1926E	Xilinx Inc.	IC FPGA 720 I/O 1926FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1926-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存2,784
XC7VX485T-2FFG1930I	Xilinx Inc.	IC FPGA 700 I/O 1930FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1930-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存2,448
XC6VSX315T-L1FFG1156I	Xilinx Inc.	IC FPGA 600 I/O 1156FCBGA Number of LABs/CLBs: 24600 Number of Logic Elements/Cells: 314880 Total RAM Bits: 25952256 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,528
XC6VHX250T-1FFG1154I	Xilinx Inc.	IC FPGA 320 I/O 1156FCBGA Number of LABs/CLBs: 19680 Number of Logic Elements/Cells: 251904 Total RAM Bits: 18579456 Number of I/O: 320 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,168
XC2VP70-5FFG1517C	Xilinx Inc.	IC FPGA 964 I/O 1517FCBGA Number of LABs/CLBs: 8272 Number of Logic Elements/Cells: 74448 Total RAM Bits: 6045696 Number of I/O: 964 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存11,364
XC7K410T-3FBG676E	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,920
XC2VP40-5FG676C	Xilinx Inc.	IC FPGA 416 I/O 676FBGA Number of LABs/CLBs: 4848 Number of Logic Elements/Cells: 43632 Total RAM Bits: 3538944 Number of I/O: 416 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存13,944
XC4VLX25-12SF363C	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存4,768
XC2VP7-6FG456C	Xilinx Inc.	IC FPGA 248 I/O 456FBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 248 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存6,912
XA7A15T-2CSG324I	Xilinx Inc.	IC FPGA 210 I/O 324BGA Number of LABs/CLBs: 1300 Number of Logic Elements/Cells: 16640 Total RAM Bits: 921600 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存4,720
XC3S200-4TQ144C	Xilinx Inc.	IC FPGA 97 I/O 144TQFP Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 4320 Total RAM Bits: 221184 Number of I/O: 97 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存12,348
XC7VX485T-1FFG1157I	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 37950 Number of Logic Elements/Cells: 485760 Total RAM Bits: 37969920 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,544
XCR3064XL-7PC44C	Xilinx Inc.	IC CPLD 64MC 7NS 44PLCC Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存6,640
XC95144-7PQ160C	Xilinx Inc.	IC CPLD 144MC 7.5NS 160QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 133 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存5,760
XC95108-20PQ100C	Xilinx Inc.	IC CPLD 108MC 20NS 100QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 20.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 108 Number of Gates: 2400 Number of I/O: 81 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存4,880
XCR3128XL-6TQG144C	Xilinx Inc.	IC CPLD 128MC 144TQFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 5.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 108 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存3,680
XC7S50-1FGGA484Q	Xilinx Inc.	XC7S50-1FGGA484Q Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存7,888

XCZU11EG-2FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,344

XCZU6EG-L1FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存2,960

XCZU3EG-L1SBVA484I

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封裝: 484-BBGA, FCBGA

庫存5,248

XCZU2CG-2SBVA484I

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封裝: 484-BBGA, FCBGA

庫存5,888

XC7Z020-1CLG484I

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-LFBGA, CSPBGA

庫存9,228

XC2V8000-4FFG1517C

Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

Number of LABs/CLBs: 11648
Number of Logic Elements/Cells: -
Total RAM Bits: 3096576
Number of I/O: 1108
Number of Gates: 8000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,528

XCV600E-7FG676I

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,480

XCV600-4FG676C

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 444
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,208

XCV400-5BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 10800
Total RAM Bits: 81920
Number of I/O: 404
Number of Gates: 468252
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

庫存6,384

XCV1000E-8FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 6144
Number of Logic Elements/Cells: 27648
Total RAM Bits: 393216
Number of I/O: 512
Number of Gates: 1569178
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存5,680

XCVU7P-1FLVC2104E

Xilinx Inc.

XCVU7P-1FLVC2104E

Number of LABs/CLBs: 98520
Number of Logic Elements/Cells: 1724100
Total RAM Bits: 236134400
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,792

XC7VX690T-3FFG1926E

Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

Number of LABs/CLBs: 54150
Number of Logic Elements/Cells: 693120
Total RAM Bits: 54190080
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1926-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存2,784

XC7VX485T-2FFG1930I

Xilinx Inc.

IC FPGA 700 I/O 1930FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1930-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存2,448

XC6VSX315T-L1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

Number of LABs/CLBs: 24600
Number of Logic Elements/Cells: 314880
Total RAM Bits: 25952256
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,528

XC6VHX250T-1FFG1154I

Xilinx Inc.

IC FPGA 320 I/O 1156FCBGA

Number of LABs/CLBs: 19680
Number of Logic Elements/Cells: 251904
Total RAM Bits: 18579456
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,168

XC2VP70-5FFG1517C

Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

Number of LABs/CLBs: 8272
Number of Logic Elements/Cells: 74448
Total RAM Bits: 6045696
Number of I/O: 964
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存11,364

XC7K410T-3FBG676E

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,920

XC2VP40-5FG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

Number of LABs/CLBs: 4848
Number of Logic Elements/Cells: 43632
Total RAM Bits: 3538944
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存13,944

XC4VLX25-12SF363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存4,768

XC2VP7-6FG456C

Xilinx Inc.

IC FPGA 248 I/O 456FBGA

Number of LABs/CLBs: 1232
Number of Logic Elements/Cells: 11088
Total RAM Bits: 811008
Number of I/O: 248
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存6,912

XA7A15T-2CSG324I

Xilinx Inc.

IC FPGA 210 I/O 324BGA

Number of LABs/CLBs: 1300
Number of Logic Elements/Cells: 16640
Total RAM Bits: 921600
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存4,720

XC3S200-4TQ144C

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 4320
Total RAM Bits: 221184
Number of I/O: 97
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存12,348

XC7VX485T-1FFG1157I

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 37950
Number of Logic Elements/Cells: 485760
Total RAM Bits: 37969920
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,544

XCR3064XL-7PC44C

Xilinx Inc.

IC CPLD 64MC 7NS 44PLCC

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 36
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存6,640

XC95144-7PQ160C

Xilinx Inc.

IC CPLD 144MC 7.5NS 160QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 144
Number of Gates: 3200
Number of I/O: 133
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存5,760

XC95108-20PQ100C

Xilinx Inc.

IC CPLD 108MC 20NS 100QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 20.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 108
Number of Gates: 2400
Number of I/O: 81
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存4,880

XCR3128XL-6TQG144C

Xilinx Inc.

IC CPLD 128MC 144TQFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 5.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 108
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存3,680

XC7S50-1FGGA484Q

Xilinx Inc.

XC7S50-1FGGA484Q

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存7,888