頁 62 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S200APDG8C	Xilinx Inc.	IC PROM SER 200K C-TEMP 8-DIP Programmable Type: OTP Memory Size: 2Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存5,392
XC17512LPC20I	Xilinx Inc.	IC PROM SER I-TEMP 512K 20-PLCC Programmable Type: OTP Memory Size: 512kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存5,904
XC17512LPC20C	Xilinx Inc.	IC PROM SER C-TEMP 512K 20-PLCC Programmable Type: OTP Memory Size: 512kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存13,524
XCZU15EG-1FFVB1156E	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存4,896
XCZU7EG-L1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存7,264
XCZU4EG-1FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存2,960
XQ3S700A-DIE0628	Xilinx Inc.	IC SPARTAN-3E FPGA 700K DIE Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: - Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存2,688
XCV200-4BG256I	Xilinx Inc.	IC FPGA 180 I/O 256BGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 180 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	封裝: 256-BBGA	庫存5,024
XC4044XL-3HQ160I	Xilinx Inc.	IC FPGA 129 I/O 160HQFP Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 129 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Exposed Pad Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP Exposed Pad	庫存4,400
XC4044XL-3BG432I	Xilinx Inc.	IC FPGA 320 I/O 432MBGA Number of LABs/CLBs: 1600 Number of Logic Elements/Cells: 3800 Total RAM Bits: 51200 Number of I/O: 320 Number of Gates: 44000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	封裝: 432-LBGA, Metal	庫存3,280
XC4036XL-1HQ240I	Xilinx Inc.	IC FPGA 193 I/O 240HQFP Number of LABs/CLBs: 1296 Number of Logic Elements/Cells: 3078 Total RAM Bits: 41472 Number of I/O: 193 Number of Gates: 36000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存4,976
XC4025E-2PG299C	Xilinx Inc.	IC FPGA 256 I/O 299CPGA Number of LABs/CLBs: 1024 Number of Logic Elements/Cells: 2432 Total RAM Bits: 32768 Number of I/O: 256 Number of Gates: 25000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 299-BCPGA Supplier Device Package: 299-CPGA (52.3x52.3)	封裝: 299-BCPGA	庫存4,176
XC4006E-1TQ144C	Xilinx Inc.	IC FPGA 113 I/O 144TQFP Number of LABs/CLBs: 256 Number of Logic Elements/Cells: 608 Total RAM Bits: 8192 Number of I/O: 113 Number of Gates: 6000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存5,328
XCVU095-3FFVB2104E	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 62259200 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.970 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存6,864
XC5VSX240T-1FF1738I	Xilinx Inc.	IC FPGA 960 I/O 1738FCBGA Number of LABs/CLBs: 18720 Number of Logic Elements/Cells: 239616 Total RAM Bits: 19021824 Number of I/O: 960 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存3,168
XCVU095-1FFVA2104I	Xilinx Inc.	IC FPGA 832 I/O 2104FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 62259200 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存2,960
XC2VP100-6FF1696I	Xilinx Inc.	IC FPGA 1164 I/O 1696FCBGA Number of LABs/CLBs: 11024 Number of Logic Elements/Cells: 99216 Total RAM Bits: 8183808 Number of I/O: 1164 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1696-BBGA, FCBGA Supplier Device Package: 1696-FCBGA (42.5x42.5)	封裝: 1696-BBGA, FCBGA	庫存7,600
XCKU115-3FLVA2104E	Xilinx Inc.	IC FPGA 832 I/O 2104FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.970 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存5,152
XC6VLX365T-1FF1759C	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 28440 Number of Logic Elements/Cells: 364032 Total RAM Bits: 15335424 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存7,792
XC2VP7-6FFG672C	Xilinx Inc.	IC FPGA 396 I/O 672FCBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FCBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存4,544
XQ6SLX75T-3CSG484I	Xilinx Inc.	IC FPGA SPARTAN-6Q 484-CSBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 292 Number of Gates: - Voltage - Supply: 1.2 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-FBGA, CSPBGA	庫存3,088
XC7A100T-2FG484I	Xilinx Inc.	IC FPGA 285 I/O 484FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存7,856
XC7A100T-1FG484I	Xilinx Inc.	IC FPGA 285 I/O 484FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,264
XC3S700A-4FT256I	Xilinx Inc.	IC FPGA 161 I/O 256FTBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 161 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存5,696
XC6SLX4-L1CSG225C	Xilinx Inc.	IC FPGA 132 I/O 225CSBGA Number of LABs/CLBs: 300 Number of Logic Elements/Cells: 3840 Total RAM Bits: 221184 Number of I/O: 132 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封裝: 225-LFBGA, CSPBGA	庫存7,280
XC9536XL-7VQG64C	Xilinx Inc.	IC CPLD 36MC 7.5NS 64VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 36 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Supplier Device Package: 64-VQFP (10x10)	封裝: 64-TQFP	庫存9,960
XC7S6-2CPGA196I	Xilinx Inc.	XC7S6-2CPGA196I Number of LABs/CLBs: - Number of Logic Elements/Cells: 6000 Total RAM Bits: 184320 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8x8)	封裝: 196-TFBGA, CSBGA	庫存9,684
XCKU15P-1FFVA1156I	Xilinx Inc.	XCKU15P-1FFVA1156I Number of LABs/CLBs: 65340 Number of Logic Elements/Cells: 1143450 Total RAM Bits: 82329600 Number of I/O: 516 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,416

XC17S200APDG8C

Xilinx Inc.

IC PROM SER 200K C-TEMP 8-DIP

Programmable Type: OTP
Memory Size: 2Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存5,392

XC17512LPC20I

Xilinx Inc.

IC PROM SER I-TEMP 512K 20-PLCC

Programmable Type: OTP
Memory Size: 512kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存5,904

XC17512LPC20C

Xilinx Inc.

IC PROM SER C-TEMP 512K 20-PLCC

Programmable Type: OTP
Memory Size: 512kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存13,524

XCZU15EG-1FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存4,896

XCZU7EG-L1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存7,264

XCZU4EG-1FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存2,960

XQ3S700A-DIE0628

Xilinx Inc.

IC SPARTAN-3E FPGA 700K DIE

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存2,688

XCV200-4BG256I

Xilinx Inc.

IC FPGA 180 I/O 256BGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 180
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)

封裝: 256-BBGA

庫存5,024

XC4044XL-3HQ160I

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

Number of LABs/CLBs: 1600
Number of Logic Elements/Cells: 3800
Total RAM Bits: 51200
Number of I/O: 129
Number of Gates: 44000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 160-BQFP Exposed Pad
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP Exposed Pad

庫存4,400

XC4044XL-3BG432I

Xilinx Inc.

IC FPGA 320 I/O 432MBGA

Number of LABs/CLBs: 1600
Number of Logic Elements/Cells: 3800
Total RAM Bits: 51200
Number of I/O: 320
Number of Gates: 44000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

封裝: 432-LBGA, Metal

庫存3,280

XC4036XL-1HQ240I

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

Number of LABs/CLBs: 1296
Number of Logic Elements/Cells: 3078
Total RAM Bits: 41472
Number of I/O: 193
Number of Gates: 36000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存4,976

XC4025E-2PG299C

Xilinx Inc.

IC FPGA 256 I/O 299CPGA

Number of LABs/CLBs: 1024
Number of Logic Elements/Cells: 2432
Total RAM Bits: 32768
Number of I/O: 256
Number of Gates: 25000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 299-BCPGA
Supplier Device Package: 299-CPGA (52.3x52.3)

封裝: 299-BCPGA

庫存4,176

XC4006E-1TQ144C

Xilinx Inc.

IC FPGA 113 I/O 144TQFP

Number of LABs/CLBs: 256
Number of Logic Elements/Cells: 608
Total RAM Bits: 8192
Number of I/O: 113
Number of Gates: 6000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存5,328

XCVU095-3FFVB2104E

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 62259200
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存6,864

XC5VSX240T-1FF1738I

Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

Number of LABs/CLBs: 18720
Number of Logic Elements/Cells: 239616
Total RAM Bits: 19021824
Number of I/O: 960
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存3,168

XCVU095-1FFVA2104I

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 62259200
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存2,960

XC2VP100-6FF1696I

Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

Number of LABs/CLBs: 11024
Number of Logic Elements/Cells: 99216
Total RAM Bits: 8183808
Number of I/O: 1164
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1696-BBGA, FCBGA
Supplier Device Package: 1696-FCBGA (42.5x42.5)

封裝: 1696-BBGA, FCBGA

庫存7,600

XCKU115-3FLVA2104E

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

Number of LABs/CLBs: 82920
Number of Logic Elements/Cells: 1451100
Total RAM Bits: 77721600
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存5,152

XC6VLX365T-1FF1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 28440
Number of Logic Elements/Cells: 364032
Total RAM Bits: 15335424
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存7,792

XC2VP7-6FFG672C

Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

Number of LABs/CLBs: 1232
Number of Logic Elements/Cells: 11088
Total RAM Bits: 811008
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FCBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存4,544

XQ6SLX75T-3CSG484I

Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 292
Number of Gates: -
Voltage - Supply: 1.2 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

庫存3,088

XC7A100T-2FG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存7,856

XC7A100T-1FG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,264

XC3S700A-4FT256I

Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 161
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存5,696

XC6SLX4-L1CSG225C

Xilinx Inc.

IC FPGA 132 I/O 225CSBGA

Number of LABs/CLBs: 300
Number of Logic Elements/Cells: 3840
Total RAM Bits: 221184
Number of I/O: 132
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

庫存7,280

XC9536XL-7VQG64C

Xilinx Inc.

IC CPLD 36MC 7.5NS 64VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 36
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Supplier Device Package: 64-VQFP (10x10)

封裝: 64-TQFP

庫存9,960

XC7S6-2CPGA196I

Xilinx Inc.

XC7S6-2CPGA196I

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 6000
Total RAM Bits: 184320
Number of I/O: 100
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 196-TFBGA, CSBGA
Supplier Device Package: 196-CSPBGA (8x8)

封裝: 196-TFBGA, CSBGA

庫存9,684

XCKU15P-1FFVA1156I

Xilinx Inc.

XCKU15P-1FFVA1156I

Number of LABs/CLBs: 65340
Number of Logic Elements/Cells: 1143450
Total RAM Bits: 82329600
Number of I/O: 516
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,416