頁 58 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S40XLPD8C	Xilinx Inc.	IC PROM PROG C-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 400kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存15,252
XCF128XFTG64C	Xilinx Inc.	IC PROM SRL 128M GATE 64-FTBGA Programmable Type: In System Programmable Memory Size: 128Mb Voltage - Supply: 1.7 V ~ 2 V Operating Temperature: -40°C ~ 85°C Package / Case: 64-TBGA Supplier Device Package: 64-FTBGA (10x13)	封裝: 64-TBGA	庫存24,768
XCZU11EG-L2FFVC1156E	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,680
XCZU7CG-2FFVF1517I	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,920
XCZU7CG-L1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,840
XC7Z045-1FBG676C	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,216
XCV100E-7FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 176 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,528
XC4020XL-3PQ160C	Xilinx Inc.	IC FPGA 129 I/O 160QFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 129 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存7,664
XC4020XL-1HT144C	Xilinx Inc.	IC FPGA 113 I/O 144HQFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 113 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存8,844
XC4013XL-2PQ240I	Xilinx Inc.	IC FPGA 192 I/O 240QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 13000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存3,632
XC4008E-2PQ208I	Xilinx Inc.	IC FPGA 144 I/O 208QFP Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 144 Number of Gates: 8000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存2,560
XC4008E-1PC84C	Xilinx Inc.	IC FPGA 61 I/O 84PLCC Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 61 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存6,948
XC7V2000T-2FLG1925C	Xilinx Inc.	IC FPGA 1200 I/O 1925FCBGA Number of LABs/CLBs: 152700 Number of Logic Elements/Cells: 1954560 Total RAM Bits: 47628288 Number of I/O: 1200 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1925-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存4,176
XCKU115-1FLVB1760I	Xilinx Inc.	IC FPGA 702 I/O 1760FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,968
XC5VLX155T-2FF1136I	Xilinx Inc.	IC FPGA 640 I/O 1136FCBGA Number of LABs/CLBs: 12160 Number of Logic Elements/Cells: 155648 Total RAM Bits: 7815168 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存3,248
XC5VTX150T-2FFG1156C	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Number of LABs/CLBs: 11600 Number of Logic Elements/Cells: 148480 Total RAM Bits: 8404992 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,376
XC7K410T-2FB900I	Xilinx Inc.	IC FPGA 350 I/O 900FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 350 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存6,720
XC5VLX85-2FFG676I	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 6480 Number of Logic Elements/Cells: 82944 Total RAM Bits: 3538944 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,416
XC7K410T-1FF900C	Xilinx Inc.	IC FPGA 500 I/O 900FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存4,976
XC2VP20-7FFG1152C	Xilinx Inc.	IC FPGA 564 I/O 1152FCBGA Number of LABs/CLBs: 2320 Number of Logic Elements/Cells: 20880 Total RAM Bits: 1622016 Number of I/O: 564 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存5,248
XQV100-4BG256N	Xilinx Inc.	IC FPGA 2.5V 108K GATES 256-BGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 180 Number of Gates: 108904 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	封裝: 256-BBGA	庫存6,736
XA3SD1800A-4CSG484Q	Xilinx Inc.	IC FPGA 309 I/O 484CSBG Number of LABs/CLBs: 4160 Number of Logic Elements/Cells: 37440 Total RAM Bits: 1548288 Number of I/O: 309 Number of Gates: 1800000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-FBGA, CSPBGA	庫存4,576
XC2S100-5PQG208I	Xilinx Inc.	IC FPGA 140 I/O 208QFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 140 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,928
XC9572-10TQG100C	Xilinx Inc.	IC CPLD 72MC 10NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-LQFP	庫存27,588
XA9572XL-15TQG100Q	Xilinx Inc.	IC CPLD 72MC 15.5NS 100TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 15.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 72 Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	封裝: 100-LQFP	庫存7,504
XCR3256XL-10TQG144I	Xilinx Inc.	IC CPLD 256MC 9NS 144TQFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 120 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存41,220
XCVU11P-3FLGB2104E	Xilinx Inc.	XCVU11P-3FLGB2104E Number of LABs/CLBs: 162000 Number of Logic Elements/Cells: 2835000 Total RAM Bits: 396150400 Number of I/O: 572 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存3,456
XCVU11P-1FSGD2104I	Xilinx Inc.	XCVU11P-1FSGD2104I Number of LABs/CLBs: 162000 Number of Logic Elements/Cells: 2835000 Total RAM Bits: 396150400 Number of I/O: 572 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存7,968

XC17S40XLPD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 400kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存15,252

XCF128XFTG64C

Xilinx Inc.

IC PROM SRL 128M GATE 64-FTBGA

Programmable Type: In System Programmable
Memory Size: 128Mb
Voltage - Supply: 1.7 V ~ 2 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-TBGA
Supplier Device Package: 64-FTBGA (10x13)

封裝: 64-TBGA

庫存24,768

XCZU11EG-L2FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,680

XCZU7CG-2FFVF1517I

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,920

XCZU7CG-L1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,840

XC7Z045-1FBG676C

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,216

XCV100E-7FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 176
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,528

XC4020XL-3PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 129
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存7,664

XC4020XL-1HT144C

Xilinx Inc.

IC FPGA 113 I/O 144HQFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 113
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存8,844

XC4013XL-2PQ240I

Xilinx Inc.

IC FPGA 192 I/O 240QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 13000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存3,632

XC4008E-2PQ208I

Xilinx Inc.

IC FPGA 144 I/O 208QFP

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 144
Number of Gates: 8000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存2,560

XC4008E-1PC84C

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 61
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存6,948

XC7V2000T-2FLG1925C

Xilinx Inc.

IC FPGA 1200 I/O 1925FCBGA

Number of LABs/CLBs: 152700
Number of Logic Elements/Cells: 1954560
Total RAM Bits: 47628288
Number of I/O: 1200
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1925-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存4,176

XCKU115-1FLVB1760I

Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

Number of LABs/CLBs: 82920
Number of Logic Elements/Cells: 1451100
Total RAM Bits: 77721600
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,968

XC5VLX155T-2FF1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

Number of LABs/CLBs: 12160
Number of Logic Elements/Cells: 155648
Total RAM Bits: 7815168
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存3,248

XC5VTX150T-2FFG1156C

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Number of LABs/CLBs: 11600
Number of Logic Elements/Cells: 148480
Total RAM Bits: 8404992
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,376

XC7K410T-2FB900I

Xilinx Inc.

IC FPGA 350 I/O 900FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 350
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存6,720

XC5VLX85-2FFG676I

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 6480
Number of Logic Elements/Cells: 82944
Total RAM Bits: 3538944
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,416

XC7K410T-1FF900C

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存4,976

XC2VP20-7FFG1152C

Xilinx Inc.

IC FPGA 564 I/O 1152FCBGA

Number of LABs/CLBs: 2320
Number of Logic Elements/Cells: 20880
Total RAM Bits: 1622016
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存5,248

XQV100-4BG256N

Xilinx Inc.

IC FPGA 2.5V 108K GATES 256-BGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 180
Number of Gates: 108904
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)

封裝: 256-BBGA

庫存6,736

XA3SD1800A-4CSG484Q

Xilinx Inc.

IC FPGA 309 I/O 484CSBG

Number of LABs/CLBs: 4160
Number of Logic Elements/Cells: 37440
Total RAM Bits: 1548288
Number of I/O: 309
Number of Gates: 1800000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 484-FBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

庫存4,576

XC2S100-5PQG208I

Xilinx Inc.

IC FPGA 140 I/O 208QFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 140
Number of Gates: 100000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,928

XC9572-10TQG100C

Xilinx Inc.

IC CPLD 72MC 10NS 100TQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 72
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-LQFP

庫存27,588

XA9572XL-15TQG100Q

Xilinx Inc.

IC CPLD 72MC 15.5NS 100TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 15.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 72
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

封裝: 100-LQFP

庫存7,504

XCR3256XL-10TQG144I

Xilinx Inc.

IC CPLD 256MC 9NS 144TQFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 120
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存41,220

XCVU11P-3FLGB2104E

Xilinx Inc.

XCVU11P-3FLGB2104E

Number of LABs/CLBs: 162000
Number of Logic Elements/Cells: 2835000
Total RAM Bits: 396150400
Number of I/O: 572
Number of Gates: -
Voltage - Supply: 0.873 V ~ 0.927 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存3,456

XCVU11P-1FSGD2104I

Xilinx Inc.

XCVU11P-1FSGD2104I

Number of LABs/CLBs: 162000
Number of Logic Elements/Cells: 2835000
Total RAM Bits: 396150400
Number of I/O: 572
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存7,968