頁 45 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S30XLVOG8C	Xilinx Inc.	IC PROM SERIAL 3.3V 300K 8-SOIC Programmable Type: OTP Memory Size: 300kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存6,496
XC17S10XLPD8C	Xilinx Inc.	IC PROM PROG C-TEMP 3.3V 8-DIP Programmable Type: OTP Memory Size: 100kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存10,332
XCZU19EG-3FFVC1760E	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,120
XCZU4EG-2FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存4,960
XCZU2EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存5,760
XC6SLX45T-4FGG484C	Xilinx Inc.	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,832
XC2V1500-5FGG676I	Xilinx Inc.	IC FPGA 392 I/O 676FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 392 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存2,240
XC2S200E-6PQG208C	Xilinx Inc.	IC FPGA 146 I/O 208QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 146 Number of Gates: 200000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存14,352
XCV150-5FG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 164674 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存3,968
XC4010E-2PQ208I	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 160 Number of Gates: 10000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,608
XC3090L-8PC84I	Xilinx Inc.	IC FPGA 70 I/O 84PLCC Number of LABs/CLBs: 320 Number of Logic Elements/Cells: - Total RAM Bits: 64160 Number of I/O: 70 Number of Gates: 6000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存5,184
XC7VX690T-2FF1157I	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 54150 Number of Logic Elements/Cells: 693120 Total RAM Bits: 54190080 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存7,696
XCKU115-1FLVA2104I	Xilinx Inc.	IC FPGA 832 I/O 2104FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存3,088
XC6VLX550T-2FF1760C	Xilinx Inc.	IC FPGA 1200 I/O 1760FBGA Number of LABs/CLBs: 42960 Number of Logic Elements/Cells: 549888 Total RAM Bits: 23298048 Number of I/O: 1200 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存7,616
XC4VLX100-11FFG1513C	Xilinx Inc.	IC FPGA 960 I/O 1513FCBGA Number of LABs/CLBs: 12288 Number of Logic Elements/Cells: 110592 Total RAM Bits: 4423680 Number of I/O: 960 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1513-BBGA, FCBGA Supplier Device Package: 1513-FCBGA (40x40)	封裝: 1513-BBGA, FCBGA	庫存3,552
XC4VFX60-11FF1152I	Xilinx Inc.	IC FPGA 576 I/O 1152FCBGA Number of LABs/CLBs: 6320 Number of Logic Elements/Cells: 56880 Total RAM Bits: 4276224 Number of I/O: 576 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-CFCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存6,592
XC7K325T-3FBG676E	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,928
XC7A200T-2FFV1156I	Xilinx Inc.	XC7A200T-2FFV1156I Number of LABs/CLBs: 16825 Number of Logic Elements/Cells: 215360 Total RAM Bits: 13455360 Number of I/O: 500 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: - Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存7,984
XQ4VSX35-DIE4058	Xilinx Inc.	IC FPGA VIRTEX-4 35K DIE Number of LABs/CLBs: 3840 Number of Logic Elements/Cells: 34560 Total RAM Bits: 3538944 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存3,536
XC4VLX25-11SFG363C	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存14,148
XC7K70T-2FBG484C	Xilinx Inc.	IC FPGA 285 I/O 484FCBGA Number of LABs/CLBs: 5125 Number of Logic Elements/Cells: 65600 Total RAM Bits: 4976640 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存6,352
XC6SLX100-2FGG676C	Xilinx Inc.	IC FPGA 480 I/O 676FBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存15,312
XC7A35T-2CSG324C	Xilinx Inc.	IC FPGA ARTIX7 210 I/O 324CSBGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33208 Total RAM Bits: 1843200 Number of I/O: 210 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存6,048
XC2S150-5FGG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 864 Number of Logic Elements/Cells: 3888 Total RAM Bits: 49152 Number of I/O: 176 Number of Gates: 150000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存5,248
XC2S30-5TQG144I	Xilinx Inc.	IC FPGA 92 I/O 144TQFP Number of LABs/CLBs: 216 Number of Logic Elements/Cells: 972 Total RAM Bits: 24576 Number of I/O: 92 Number of Gates: 30000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存21,660
XC3S50-4TQ144I	Xilinx Inc.	IC FPGA 97 I/O 144TQFP Number of LABs/CLBs: 192 Number of Logic Elements/Cells: 1728 Total RAM Bits: 73728 Number of I/O: 97 Number of Gates: 50000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存3,584
XC2C128-7CPG132I	Xilinx Inc.	IC CPLD 128MC 7NS 132CSBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 100 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	封裝: 132-TFBGA, CSPBGA	庫存72,696
XC7A12T-L2CPG238E	Xilinx Inc.	XC7A12T-L2CPG238E Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 12800 Total RAM Bits: 737280 Number of I/O: 106 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 238-LFBGA, CSPBGA Supplier Device Package: 236-CSBGA (10x10)	封裝: 238-LFBGA, CSPBGA	庫存4,032

XC17S30XLVOG8C

Xilinx Inc.

IC PROM SERIAL 3.3V 300K 8-SOIC

Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存6,496

XC17S10XLPD8C

Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

Programmable Type: OTP
Memory Size: 100kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存10,332

XCZU19EG-3FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,120

XCZU4EG-2FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存4,960

XCZU2EG-1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存5,760

XC6SLX45T-4FGG484C

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,832

XC2V1500-5FGG676I

Xilinx Inc.

IC FPGA 392 I/O 676FBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: -
Total RAM Bits: 884736
Number of I/O: 392
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存2,240

XC2S200E-6PQG208C

Xilinx Inc.

IC FPGA 146 I/O 208QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 146
Number of Gates: 200000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存14,352

XCV150-5FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 176
Number of Gates: 164674
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存3,968

XC4010E-2PQ208I

Xilinx Inc.

IC FPGA 160 I/O 208QFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 160
Number of Gates: 10000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,608

XC3090L-8PC84I

Xilinx Inc.

IC FPGA 70 I/O 84PLCC

Number of LABs/CLBs: 320
Number of Logic Elements/Cells: -
Total RAM Bits: 64160
Number of I/O: 70
Number of Gates: 6000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存5,184

XC7VX690T-2FF1157I

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 54150
Number of Logic Elements/Cells: 693120
Total RAM Bits: 54190080
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存7,696

XCKU115-1FLVA2104I

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

Number of LABs/CLBs: 82920
Number of Logic Elements/Cells: 1451100
Total RAM Bits: 77721600
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存3,088

XC6VLX550T-2FF1760C

Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

Number of LABs/CLBs: 42960
Number of Logic Elements/Cells: 549888
Total RAM Bits: 23298048
Number of I/O: 1200
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存7,616

XC4VLX100-11FFG1513C

Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

Number of LABs/CLBs: 12288
Number of Logic Elements/Cells: 110592
Total RAM Bits: 4423680
Number of I/O: 960
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1513-BBGA, FCBGA
Supplier Device Package: 1513-FCBGA (40x40)

封裝: 1513-BBGA, FCBGA

庫存3,552

XC4VFX60-11FF1152I

Xilinx Inc.

IC FPGA 576 I/O 1152FCBGA

Number of LABs/CLBs: 6320
Number of Logic Elements/Cells: 56880
Total RAM Bits: 4276224
Number of I/O: 576
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存6,592

XC7K325T-3FBG676E

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,928

XC7A200T-2FFV1156I

Xilinx Inc.

XC7A200T-2FFV1156I

Number of LABs/CLBs: 16825
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 500
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: -
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,984

XQ4VSX35-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-4 35K DIE

Number of LABs/CLBs: 3840
Number of Logic Elements/Cells: 34560
Total RAM Bits: 3538944
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存3,536

XC4VLX25-11SFG363C

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存14,148

XC7K70T-2FBG484C

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

Number of LABs/CLBs: 5125
Number of Logic Elements/Cells: 65600
Total RAM Bits: 4976640
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存6,352

XC6SLX100-2FGG676C

Xilinx Inc.

IC FPGA 480 I/O 676FBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存15,312

XC7A35T-2CSG324C

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33208
Total RAM Bits: 1843200
Number of I/O: 210
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存6,048

XC2S150-5FGG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 864
Number of Logic Elements/Cells: 3888
Total RAM Bits: 49152
Number of I/O: 176
Number of Gates: 150000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存5,248

XC2S30-5TQG144I

Xilinx Inc.

IC FPGA 92 I/O 144TQFP

Number of LABs/CLBs: 216
Number of Logic Elements/Cells: 972
Total RAM Bits: 24576
Number of I/O: 92
Number of Gates: 30000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存21,660

XC3S50-4TQ144I

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

Number of LABs/CLBs: 192
Number of Logic Elements/Cells: 1728
Total RAM Bits: 73728
Number of I/O: 97
Number of Gates: 50000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存3,584

XC2C128-7CPG132I

Xilinx Inc.

IC CPLD 128MC 7NS 132CSBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 100
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Supplier Device Package: 132-CSPBGA (8x8)

封裝: 132-TFBGA, CSPBGA

庫存72,696

XC7A12T-L2CPG238E

Xilinx Inc.

XC7A12T-L2CPG238E

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 12800
Total RAM Bits: 737280
Number of I/O: 106
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 238-LFBGA, CSPBGA
Supplier Device Package: 236-CSBGA (10x10)

封裝: 238-LFBGA, CSPBGA

庫存4,032