頁 241 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S20VO8C	Xilinx Inc.	IC PROM SER 200K 8-SOIC Programmable Type: OTP Memory Size: 200kb Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: 0°C ~ 70°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存7,392
XQ7Z020-1CL484I4332	Xilinx Inc.	IC FPGA QPRO 484BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19)	封裝: 484-LFBGA, CSPBGA	庫存7,120
XCZU11EG-2FFVC1760E	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,512
XCZU7CG-L2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存7,872
XC7Z045-2FBG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,304
XCZU4EV-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存5,840
XC7K325T-2FB676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,672
XC6SLX150T-N3FGG900I	Xilinx Inc.	IC FPGA 540 I/O 900FBGA Number of LABs/CLBs: 11519 Number of Logic Elements/Cells: 147443 Total RAM Bits: 4939776 Number of I/O: 540 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存2,672
XC2V1000-4FGG456I	Xilinx Inc.	IC FPGA 324 I/O 456FBGA Number of LABs/CLBs: 1280 Number of Logic Elements/Cells: - Total RAM Bits: 737280 Number of I/O: 324 Number of Gates: 1000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存2,100
XCV400-4FG676I	Xilinx Inc.	IC FPGA 404 I/O 676FBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 81920 Number of I/O: 404 Number of Gates: 468252 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,896
XCV200-5PQ240C	Xilinx Inc.	IC FPGA 166 I/O 240QFP Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 166 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存6,832
XC4013E-3PG223I	Xilinx Inc.	IC FPGA 192 I/O 223CPGA Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 13000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Through Hole Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 223-BCPGA Supplier Device Package: 223-CPGA (47.25x47.25)	封裝: 223-BCPGA	庫存6,156
XC4005E-4PQ160I	Xilinx Inc.	IC FPGA 112 I/O 160QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存3,728
XC2S100-6FG456C	Xilinx Inc.	IC FPGA 196 I/O 456FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 196 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存7,488
XC7VX330T-1FFG1157C	Xilinx Inc.	IC FPGA 600 I/O 1157FCBGA Number of LABs/CLBs: 25500 Number of Logic Elements/Cells: 326400 Total RAM Bits: 27648000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1157-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存3,632
XC7K410T-2FF676I	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存13,260
XC4VLX25-11FFG668C	Xilinx Inc.	IC FPGA 448 I/O 668FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 448 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存5,776
XC4VFX12-12FFG668C	Xilinx Inc.	IC FPGA 320 I/O 668FCBGA Number of LABs/CLBs: 1368 Number of Logic Elements/Cells: 12312 Total RAM Bits: 663552 Number of I/O: 320 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 668-BBGA, FCBGA Supplier Device Package: 668-FCBGA (27x27)	封裝: 668-BBGA, FCBGA	庫存5,520
XC7K160T-1FFG676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 12675 Number of Logic Elements/Cells: 162240 Total RAM Bits: 11980800 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,296
XC3S4000-5FGG900C	Xilinx Inc.	IC FPGA 633 I/O 900FBGA Number of LABs/CLBs: 6912 Number of Logic Elements/Cells: 62208 Total RAM Bits: 1769472 Number of I/O: 633 Number of Gates: 4000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存9,768
XC6SLX25T-N3FG484I	Xilinx Inc.	IC FPGA 250 I/O 484FBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 250 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,408
XC2S50-5FGG256I	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 32768 Number of I/O: 176 Number of Gates: 50000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存15,696
XC3S200-4TQG144C	Xilinx Inc.	IC FPGA 97 I/O 144TQFP Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 4320 Total RAM Bits: 221184 Number of I/O: 97 Number of Gates: 200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存11,964
XCR3512XL-12FT256C	Xilinx Inc.	IC CPLD 512MC 10.8NS 256BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存3,216
XCR3384XL-10FT256C	Xilinx Inc.	IC CPLD 384MC 9NS 256BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 212 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存4,944
XC95288XL-7PQG208C	Xilinx Inc.	IC CPLD 288MC 7.5NS 208QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 168 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存6,720
XC2C384-10PQG208C	Xilinx Inc.	IC CPLD 384MC 9.2NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.2ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 173 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,328
XC7S50-1FTGB196I	Xilinx Inc.	XC7S50-1FTGB196I Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-LBGA, CSPBGA Supplier Device Package: 196-CSBGA (15x15)	封裝: 196-LBGA, CSPBGA	庫存7,760

XC17S20VO8C

Xilinx Inc.

IC PROM SER 200K 8-SOIC

Programmable Type: OTP
Memory Size: 200kb
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存7,392

XQ7Z020-1CL484I4332

Xilinx Inc.

IC FPGA QPRO 484BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-LFBGA, CSPBGA

庫存7,120

XCZU11EG-2FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,512

XCZU7CG-L2FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存7,872

XC7Z045-2FBG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,304

XCZU4EV-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存5,840

XC7K325T-2FB676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,672

XC6SLX150T-N3FGG900I

Xilinx Inc.

IC FPGA 540 I/O 900FBGA

Number of LABs/CLBs: 11519
Number of Logic Elements/Cells: 147443
Total RAM Bits: 4939776
Number of I/O: 540
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存2,672

XC2V1000-4FGG456I

Xilinx Inc.

IC FPGA 324 I/O 456FBGA

Number of LABs/CLBs: 1280
Number of Logic Elements/Cells: -
Total RAM Bits: 737280
Number of I/O: 324
Number of Gates: 1000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存2,100

XCV400-4FG676I

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 10800
Total RAM Bits: 81920
Number of I/O: 404
Number of Gates: 468252
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,896

XCV200-5PQ240C

Xilinx Inc.

IC FPGA 166 I/O 240QFP

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 166
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存6,832

XC4013E-3PG223I

Xilinx Inc.

IC FPGA 192 I/O 223CPGA

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 13000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 223-BCPGA
Supplier Device Package: 223-CPGA (47.25x47.25)

封裝: 223-BCPGA

庫存6,156

XC4005E-4PQ160I

Xilinx Inc.

IC FPGA 112 I/O 160QFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存3,728

XC2S100-6FG456C

Xilinx Inc.

IC FPGA 196 I/O 456FBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 196
Number of Gates: 100000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存7,488

XC7VX330T-1FFG1157C

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Number of LABs/CLBs: 25500
Number of Logic Elements/Cells: 326400
Total RAM Bits: 27648000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1157-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存3,632

XC7K410T-2FF676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存13,260

XC4VLX25-11FFG668C

Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存5,776

XC4VFX12-12FFG668C

Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

Number of LABs/CLBs: 1368
Number of Logic Elements/Cells: 12312
Total RAM Bits: 663552
Number of I/O: 320
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA (27x27)

封裝: 668-BBGA, FCBGA

庫存5,520

XC7K160T-1FFG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 12675
Number of Logic Elements/Cells: 162240
Total RAM Bits: 11980800
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,296

XC3S4000-5FGG900C

Xilinx Inc.

IC FPGA 633 I/O 900FBGA

Number of LABs/CLBs: 6912
Number of Logic Elements/Cells: 62208
Total RAM Bits: 1769472
Number of I/O: 633
Number of Gates: 4000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存9,768

XC6SLX25T-N3FG484I

Xilinx Inc.

IC FPGA 250 I/O 484FBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,408

XC2S50-5FGG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 32768
Number of I/O: 176
Number of Gates: 50000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存15,696

XC3S200-4TQG144C

Xilinx Inc.

IC FPGA 97 I/O 144TQFP

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 4320
Total RAM Bits: 221184
Number of I/O: 97
Number of Gates: 200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存11,964

XCR3512XL-12FT256C

Xilinx Inc.

IC CPLD 512MC 10.8NS 256BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 10.8ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存3,216

XCR3384XL-10FT256C

Xilinx Inc.

IC CPLD 384MC 9NS 256BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 212
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存4,944

XC95288XL-7PQG208C

Xilinx Inc.

IC CPLD 288MC 7.5NS 208QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 168
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存6,720

XC2C384-10PQG208C

Xilinx Inc.

IC CPLD 384MC 9.2NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 9.2ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 173
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,328

XC7S50-1FTGB196I

Xilinx Inc.

XC7S50-1FTGB196I

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 100
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 196-LBGA, CSPBGA
Supplier Device Package: 196-CSBGA (15x15)

封裝: 196-LBGA, CSPBGA

庫存7,760