頁 213 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FFG1136	Xilinx Inc.	FFG1136 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,896
XCF04SVO20C	Xilinx Inc.	IC PROM IN SYST PRG 3.3V 20TSSOP Programmable Type: In System Programmable Memory Size: 4Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存125,724
XCZU6CG-1FFVB1156E	Xilinx Inc.	XCZU6CG-1FFVB1156E Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存4,496
XCZU5EG-2SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存2,656
XC5VSX35T-X1FFG665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 2720 Number of Logic Elements/Cells: 34816 Total RAM Bits: 3096576 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存5,392
XCV400-4BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 81920 Number of I/O: 404 Number of Gates: 468252 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	封裝: 560-LBGA, Metal	庫存4,240
XCV2000E-7FG860C	Xilinx Inc.	IC FPGA 660 I/O 860FBGA Number of LABs/CLBs: 9600 Number of Logic Elements/Cells: 43200 Total RAM Bits: 655360 Number of I/O: 660 Number of Gates: 2541952 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 860-BGA Supplier Device Package: 860-FBGA (42.5x42.5)	封裝: 860-BGA	庫存2,608
XCV100E-7PQ240C	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 158 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP	庫存6,624
XC4013E-2HQ240I	Xilinx Inc.	IC FPGA 192 I/O 240HQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 13000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	封裝: 240-BFQFP Exposed Pad	庫存3,344
XC4008E-1PQ208C	Xilinx Inc.	IC FPGA 144 I/O 208QFP Number of LABs/CLBs: 324 Number of Logic Elements/Cells: 770 Total RAM Bits: 10368 Number of I/O: 144 Number of Gates: 8000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存4,192
XCVU7P-1FLVA2104E	Xilinx Inc.	XCVU7P-1FLVA2104E Number of LABs/CLBs: 98520 Number of Logic Elements/Cells: 1724100 Total RAM Bits: 236134400 Number of I/O: 832 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: - Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存4,592
XCVU080-2FFVB1760I	Xilinx Inc.	IC FPGA 702 I/O 1760FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存4,992
XQL4VFX140-9FFG1517I4095	Xilinx Inc.	IC FPGA VIRTEX-4FX 140K 1517BGA Number of LABs/CLBs: 15792 Number of Logic Elements/Cells: 142128 Total RAM Bits: 10174464 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,848
XC5VTX240T-1FFG1759C	Xilinx Inc.	IC FPGA 680 I/O 1759FCBGA Number of LABs/CLBs: 18720 Number of Logic Elements/Cells: 239616 Total RAM Bits: 11943936 Number of I/O: 680 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存7,600
XC4VLX160-11FF1513C	Xilinx Inc.	IC FPGA 960 I/O 1513FCBGA Number of LABs/CLBs: 16896 Number of Logic Elements/Cells: 152064 Total RAM Bits: 5308416 Number of I/O: 960 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1513-BBGA, FCBGA Supplier Device Package: 1513-FCBGA (40x40)	封裝: 1513-BBGA, FCBGA	庫存6,448
XC7K355T-2FFV901C	Xilinx Inc.	IC FPGA 300 I/O 901FCBGA Number of LABs/CLBs: 27825 Number of Logic Elements/Cells: 356160 Total RAM Bits: 26357760 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存4,992
XC4VLX40-11FF1148C	Xilinx Inc.	IC FPGA 640 I/O 1148FCBGA Number of LABs/CLBs: 4608 Number of Logic Elements/Cells: 41472 Total RAM Bits: 1769472 Number of I/O: 640 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1148-BBGA, FCBGA Supplier Device Package: 1148-FCPBGA (35x35)	封裝: 1148-BBGA, FCBGA	庫存4,976
XC6SLX75-2FG676C	Xilinx Inc.	IC FPGA 408 I/O 676FCBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 408 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存2,720
XC3S1600E-4FGG400C	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 3688 Number of Logic Elements/Cells: 33192 Total RAM Bits: 663552 Number of I/O: 304 Number of Gates: 1600000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存16,296
XC6SLX45T-N3FGG484C	Xilinx Inc.	IC FPGA 296 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 296 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存4,896
XC3S700A-4FG400C	Xilinx Inc.	IC FPGA 311 I/O 400FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 311 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存3,440
XA6SLX16-2CSG324Q	Xilinx Inc.	IC FPGA 232 I/O 324CSGBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 232 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存7,680
XC7S50-2FGGA484C	Xilinx Inc.	XC7S50-2FGGA484C Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存2,880
XC2S100-5PQG208C	Xilinx Inc.	IC FPGA 140 I/O 208QFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 140 Number of Gates: 100000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存17,688
XCR3384XL-12TQG144I	Xilinx Inc.	IC CPLD 384MC 10.8NS 144QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 118 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,160
XCR3064XL-10CPG56I	Xilinx Inc.	IC CPLD 64MC 9.1NS 56CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 48 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-LFBGA, CSPBGA Supplier Device Package: 56-CSBGA (6x6)	封裝: 56-LFBGA, CSPBGA	庫存4,576
XC9536XL-7CSG48I	Xilinx Inc.	IC CPLD 36MC 7.5NS 48CSBGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-FBGA, CSPBGA Supplier Device Package: 48-CSBGA (7x7)	封裝: 48-FBGA, CSPBGA	庫存3,824
XCVU13P-2FHGC2104E	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 216000 Number of Logic Elements/Cells: 3780000 Total RAM Bits: 514867200 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (52.5x52.5)	封裝: 2104-BBGA, FCBGA	庫存6,128

XCMECH-FFG1136

Xilinx Inc.

FFG1136 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,896

XCF04SVO20C

Xilinx Inc.

IC PROM IN SYST PRG 3.3V 20TSSOP

Programmable Type: In System Programmable
Memory Size: 4Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存125,724

XCZU6CG-1FFVB1156E

Xilinx Inc.

XCZU6CG-1FFVB1156E

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存4,496

XCZU5EG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存2,656

XC5VSX35T-X1FFG665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 2720
Number of Logic Elements/Cells: 34816
Total RAM Bits: 3096576
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存5,392

XCV400-4BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 10800
Total RAM Bits: 81920
Number of I/O: 404
Number of Gates: 468252
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

庫存4,240

XCV2000E-7FG860C

Xilinx Inc.

IC FPGA 660 I/O 860FBGA

Number of LABs/CLBs: 9600
Number of Logic Elements/Cells: 43200
Total RAM Bits: 655360
Number of I/O: 660
Number of Gates: 2541952
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 860-BGA
Supplier Device Package: 860-FBGA (42.5x42.5)

封裝: 860-BGA

庫存2,608

XCV100E-7PQ240C

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 158
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

庫存6,624

XC4013E-2HQ240I

Xilinx Inc.

IC FPGA 192 I/O 240HQFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 13000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

庫存3,344

XC4008E-1PQ208C

Xilinx Inc.

IC FPGA 144 I/O 208QFP

Number of LABs/CLBs: 324
Number of Logic Elements/Cells: 770
Total RAM Bits: 10368
Number of I/O: 144
Number of Gates: 8000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存4,192

XCVU7P-1FLVA2104E

Xilinx Inc.

XCVU7P-1FLVA2104E

Number of LABs/CLBs: 98520
Number of Logic Elements/Cells: 1724100
Total RAM Bits: 236134400
Number of I/O: 832
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: -
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,592

XCVU080-2FFVB1760I

Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存4,992

XQL4VFX140-9FFG1517I4095

Xilinx Inc.

IC FPGA VIRTEX-4FX 140K 1517BGA

Number of LABs/CLBs: 15792
Number of Logic Elements/Cells: 142128
Total RAM Bits: 10174464
Number of I/O: 768
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,848

XC5VTX240T-1FFG1759C

Xilinx Inc.

IC FPGA 680 I/O 1759FCBGA

Number of LABs/CLBs: 18720
Number of Logic Elements/Cells: 239616
Total RAM Bits: 11943936
Number of I/O: 680
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存7,600

XC4VLX160-11FF1513C

Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

Number of LABs/CLBs: 16896
Number of Logic Elements/Cells: 152064
Total RAM Bits: 5308416
Number of I/O: 960
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1513-BBGA, FCBGA
Supplier Device Package: 1513-FCBGA (40x40)

封裝: 1513-BBGA, FCBGA

庫存6,448

XC7K355T-2FFV901C

Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

Number of LABs/CLBs: 27825
Number of Logic Elements/Cells: 356160
Total RAM Bits: 26357760
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存4,992

XC4VLX40-11FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

Number of LABs/CLBs: 4608
Number of Logic Elements/Cells: 41472
Total RAM Bits: 1769472
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1148-BBGA, FCBGA
Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

庫存4,976

XC6SLX75-2FG676C

Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 408
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存2,720

XC3S1600E-4FGG400C

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 3688
Number of Logic Elements/Cells: 33192
Total RAM Bits: 663552
Number of I/O: 304
Number of Gates: 1600000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存16,296

XC6SLX45T-N3FGG484C

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 296
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存4,896

XC3S700A-4FG400C

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存3,440

XA6SLX16-2CSG324Q

Xilinx Inc.

IC FPGA 232 I/O 324CSGBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 232
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存7,680

XC7S50-2FGGA484C

Xilinx Inc.

XC7S50-2FGGA484C

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存2,880

XC2S100-5PQG208C

Xilinx Inc.

IC FPGA 140 I/O 208QFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 140
Number of Gates: 100000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存17,688

XCR3384XL-12TQG144I

Xilinx Inc.

IC CPLD 384MC 10.8NS 144QFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 10.8ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 118
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,160

XCR3064XL-10CPG56I

Xilinx Inc.

IC CPLD 64MC 9.1NS 56CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 48
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-LFBGA, CSPBGA
Supplier Device Package: 56-CSBGA (6x6)

封裝: 56-LFBGA, CSPBGA

庫存4,576

XC9536XL-7CSG48I

Xilinx Inc.

IC CPLD 36MC 7.5NS 48CSBGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-FBGA, CSPBGA
Supplier Device Package: 48-CSBGA (7x7)

封裝: 48-FBGA, CSPBGA

庫存3,824

XCVU13P-2FHGC2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

Number of LABs/CLBs: 216000
Number of Logic Elements/Cells: 3780000
Total RAM Bits: 514867200
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (52.5x52.5)

封裝: 2104-BBGA, FCBGA

庫存6,128