Xilinx Inc. 產品

XCZU17EG-2FFVE1924I

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

XCZU19EG-1FFVB1517I

Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

XQ2S400E-DIE0628

Xilinx Inc.

IC FPGA VIRTEX-II PRO DIE

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 163840
• Number of I/O: -
• Number of Gates: 400000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: Die
• Supplier Device Package: Die

封裝: Die

XC2V2000-4FF896I

Xilinx Inc.

IC FPGA 624 I/O 896FCBGA

• Number of LABs/CLBs: 2688
• Number of Logic Elements/Cells: -
• Total RAM Bits: 1032192
• Number of I/O: 624
• Number of Gates: 2000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

XC2V4000-5BF957C

Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

• Number of LABs/CLBs: 5760
• Number of Logic Elements/Cells: -
• Total RAM Bits: 2211840
• Number of I/O: 684
• Number of Gates: 4000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 957-BBGA, FCBGA
• Supplier Device Package: 957-FCBGA (40x40)

封裝: 957-BBGA, FCBGA

XC4044XL-2HQ208I

Xilinx Inc.

IC FPGA 160 I/O 208HQFP

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 160
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

XC4025E-4PG299I

Xilinx Inc.

IC FPGA 256 I/O 299CPGA

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 256
• Number of Gates: 25000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 299-BCPGA
• Supplier Device Package: 299-CPGA (52.3x52.3)

封裝: 299-BCPGA

XC4013E-2BG225I

Xilinx Inc.

IC FPGA 192 I/O 225BGA

• Number of LABs/CLBs: 576
• Number of Logic Elements/Cells: 1368
• Total RAM Bits: 18432
• Number of I/O: 192
• Number of Gates: 13000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 225-BBGA
• Supplier Device Package: 225-PBGA (27x27)

封裝: 225-BBGA

XC6VHX255T-3FFG1923C

Xilinx Inc.

IC FPGA 480 I/O 1923FCBGA

• Number of LABs/CLBs: 19800
• Number of Logic Elements/Cells: 253440
• Total RAM Bits: 19021824
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

XC5VFX100T-2FF1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8000
• Number of Logic Elements/Cells: 102400
• Total RAM Bits: 8404992
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

XC2VP50-6FF1517C

Xilinx Inc.

IC FPGA 852 I/O 1517FCBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 852
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

XC6VLX195T-L1FFG1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 15600
• Number of Logic Elements/Cells: 199680
• Total RAM Bits: 12681216
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC6VLX130T-L1FF1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC7K325T-1FFG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

• Number of LABs/CLBs: 25475
• Number of Logic Elements/Cells: 326080
• Total RAM Bits: 16404480
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XQ6SLX150T-3FG676I

Xilinx Inc.

IC FPGA SPARTAN 6 147K 676BGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XC6SLX150T-2FG900I

Xilinx Inc.

IC FPGA 540 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 540
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

XC6SLX100T-N3FGG900I

Xilinx Inc.

IC FPGA 498 I/O 900FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 498
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

XC2VP2-7FG456C

Xilinx Inc.

IC FPGA 156 I/O 456FBGA

• Number of LABs/CLBs: 352
• Number of Logic Elements/Cells: 3168
• Total RAM Bits: 221184
• Number of I/O: 156
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

XC3SD3400A-4FG676C

Xilinx Inc.

IC FPGA 469 I/O 676FBGA

• Number of LABs/CLBs: 5968
• Number of Logic Elements/Cells: 53712
• Total RAM Bits: 2322432
• Number of I/O: 469
• Number of Gates: 3400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XC6SLX45T-2CSG484I

Xilinx Inc.

IC FPGA 296 I/O 484CSBGA

• Number of LABs/CLBs: 3411
• Number of Logic Elements/Cells: 43661
• Total RAM Bits: 2138112
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

XC3S250E-4FTG256I

Xilinx Inc.

IC FPGA 172 I/O 256FTBGA

• Number of LABs/CLBs: 612
• Number of Logic Elements/Cells: 5508
• Total RAM Bits: 221184
• Number of I/O: 172
• Number of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XA6SLX9-3FTG256Q

Xilinx Inc.

IC FPGA 186 I/O 256FTGBGA

• Number of LABs/CLBs: 715
• Number of Logic Elements/Cells: 9152
• Total RAM Bits: 589824
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XC3S500E-4VQG100C

Xilinx Inc.

IC FPGA 66 I/O 100VQFP

• Number of LABs/CLBs: 1164
• Number of Logic Elements/Cells: 10476
• Total RAM Bits: 368640
• Number of I/O: 66
• Number of Gates: 500000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

XC7A100T-1FGG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

XC95216-20HQ208C

Xilinx Inc.

IC CPLD 216MC 20NS 208HQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 12
• Number of Macrocells: 216
• Number of Gates: 4800
• Number of I/O: 166
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

XC95108-10PC84C

Xilinx Inc.

IC CPLD 108MC 10NS 84PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 6
• Number of Macrocells: 108
• Number of Gates: 2400
• Number of I/O: 69
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

XCR3384XL-10TQG144I

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.0ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 24
• Number of Macrocells: 384
• Number of Gates: 9000
• Number of I/O: 118
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

XCKU15P-L2FFVE1760E

Xilinx Inc.

XCKU15P-L2FFVE1760E

• Number of LABs/CLBs: 65340
• Number of Logic Elements/Cells: 1143450
• Total RAM Bits: 82329600
• Number of I/O: 668
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA