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Xilinx Inc. 產品

記錄 7,167
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XCZU11EG-2FFVC1760I
Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存2,752
XA3S1500-4FGG456I
Xilinx Inc.

IC FPGA 333 I/O 456FBGA

  • Number of LABs/CLBs: 3328
  • Number of Logic Elements/Cells: 29952
  • Total RAM Bits: 589824
  • Number of I/O: 333
  • Number of Gates: 1500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
封裝: 456-BBGA
庫存4,112
XCV100E-6CS144I
Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 81920
  • Number of I/O: 94
  • Number of Gates: 128236
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
封裝: 144-TFBGA, CSPBGA
庫存5,200
XCV1000E-7HQ240I
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP Exposed Pad
庫存2,912
hot XC4013XL-3HT144C
Xilinx Inc.

IC FPGA 113 I/O 144HQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP Exposed Pad
庫存6,352
XC4010E-1PQ208C
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存2,160
XC4005E-3PG156I
Xilinx Inc.

IC FPGA 112 I/O 156CPGA

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 156-BCPGA
  • Supplier Device Package: 156-CPGA (42.17x42.17)
封裝: 156-BCPGA
庫存4,256
XC7VH580T-G2FLG1155E
Xilinx Inc.

IC FPGA 400 I/O 1155FCBGA

  • Number of LABs/CLBs: 45350
  • Number of Logic Elements/Cells: 580480
  • Total RAM Bits: 34652160
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: 1155-FCBGA (35x35)
封裝: -
庫存2,992
XC7VX485T-L2FFG1761E
Xilinx Inc.

IC FPGA 700 I/O 1761FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 700
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1761-FCBGA (42.5x42.5)
封裝: 1760-BBGA, FCBGA
庫存5,840
XC5VLX110-2FF676I
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
封裝: 676-BBGA, FCBGA
庫存2,960
XC5VLX155-1FF1153C
Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1153-BBGA, FCBGA
  • Supplier Device Package: 1153-FCBGA (35x35)
封裝: 1153-BBGA, FCBGA
庫存7,472
hot XC4VLX100-10FFG1148C
Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

  • Number of LABs/CLBs: 12288
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4423680
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
封裝: 1148-BBGA, FCBGA
庫存4,672
hot XC6VCX195T-1FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 15600
  • Number of Logic Elements/Cells: 199680
  • Total RAM Bits: 12681216
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
封裝: 1156-BBGA, FCBGA
庫存4,800
hot XC5VLX30T-3FF323C
Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 30720
  • Total RAM Bits: 1327104
  • Number of I/O: 172
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 323-BBGA, FCBGA
  • Supplier Device Package: 323-FCBGA (19x19)
封裝: 323-BBGA, FCBGA
庫存4,240
XC4VFX20-11FF672C
Xilinx Inc.

IC FPGA 320 I/O 672FCBGA

  • Number of LABs/CLBs: 2136
  • Number of Logic Elements/Cells: 19224
  • Total RAM Bits: 1253376
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存5,984
hot XC2VP7-6FF672C
Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
封裝: 672-BBGA, FCBGA
庫存6,736
XC6SLX45-L1CSG484I
Xilinx Inc.

IC FPGA 320 I/O 484CSBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
封裝: 484-FBGA, CSPBGA
庫存2,752
XA6SLX45-2CSG324I
Xilinx Inc.

IC FPGA 218 I/O 324CSGBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 218
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
封裝: 324-LFBGA, CSPBGA
庫存3,200
XC3S1400A-4FT256C
Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 161
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
封裝: 256-LBGA
庫存4,304
XC7A15T-L1CPG236I
Xilinx Inc.

IC FPGA ARTIX7 106 I/O 236BGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
封裝: 238-LFBGA, CSPBGA
庫存3,056
hot XC3S400-4FT256I
Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

  • Number of LABs/CLBs: 896
  • Number of Logic Elements/Cells: 8064
  • Total RAM Bits: 294912
  • Number of I/O: 173
  • Number of Gates: 400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
封裝: 256-LBGA
庫存7,152
XC3S100E-4TQ144I
Xilinx Inc.

IC FPGA 108 I/O 144TQFP

  • Number of LABs/CLBs: 240
  • Number of Logic Elements/Cells: 2160
  • Total RAM Bits: 73728
  • Number of I/O: 108
  • Number of Gates: 100000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存4,304
hot XC6SLX4-3CSG225C
Xilinx Inc.

IC FPGA 132 I/O 225CSBGA

  • Number of LABs/CLBs: 300
  • Number of Logic Elements/Cells: 3840
  • Total RAM Bits: 221184
  • Number of I/O: 132
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
封裝: 225-LFBGA, CSPBGA
庫存81,408
XCR3064XL-10PC44I
Xilinx Inc.

IC CPLD 64MC 9.1NS 44PLCC

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存5,968
XC9536-6VQ44C
Xilinx Inc.

IC CPLD 36MC 6NS 44VQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 6.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
封裝: 44-TQFP
庫存2,672
hot XC95144XL-5CSG144C
Xilinx Inc.

IC CPLD 144MC 5NS 144CSBGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 144
  • Number of Gates: 3200
  • Number of I/O: 117
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
封裝: 144-TFBGA, CSPBGA
庫存6,272
XC7S75-1FGGA676C
Xilinx Inc.

XC7S75-1FGGA676C

  • Number of LABs/CLBs: 6000
  • Number of Logic Elements/Cells: 76800
  • Total RAM Bits: 4331520
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FPBGA (27x27)
封裝: 676-BGA
庫存3,248
XCKU5P-L2FFVD900E
Xilinx Inc.

XCKU5P-L2FFVD900E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 41984000
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
封裝: 900-BBGA, FCBGA
庫存6,144