頁 184 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FFG1517	Xilinx Inc.	FFG1517 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,544
XC18V512VQ44I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 44-VQFP Programmable Type: In System Programmable Memory Size: 512kb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存5,776
XCZU17EG-1FFVD1760I	Xilinx Inc.	IC FPGA 308 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,016
XCZU5CG-L1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存5,968
XC7Z035-1FFG676C	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,056
XCV600E-7FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存2,096
XCV50E-7FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 65536 Number of I/O: 176 Number of Gates: 71693 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存6,576
XCV2600E-8FG1156C	Xilinx Inc.	IC FPGA 804 I/O 1156FBGA Number of LABs/CLBs: 12696 Number of Logic Elements/Cells: 57132 Total RAM Bits: 753664 Number of I/O: 804 Number of Gates: 3263755 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA Supplier Device Package: 1156-FBGA (35x35)	封裝: 1156-BBGA	庫存5,584
XCV200-4BG352C	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 260 Number of Gates: 236666 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存6,300
XCS40XL-4CS280C	Xilinx Inc.	IC FPGA 224 I/O 280CSBGA Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 224 Number of Gates: 40000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	封裝: 280-TFBGA, CSPBGA	庫存10,236
XC4010E-2PG191C	Xilinx Inc.	IC FPGA 160 I/O 191CPGA Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 160 Number of Gates: 10000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Through Hole Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 191-BCPGA Supplier Device Package: 191-CPGA (47.25x47.25)	封裝: 191-BCPGA	庫存6,544
XCVU125-2FLVD1517I	Xilinx Inc.	IC FPGA 338 I/O 1517FCBGA Number of LABs/CLBs: 89520 Number of Logic Elements/Cells: 1566600 Total RAM Bits: 90726400 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存3,552
XQ6VSX315T-2RF1759I	Xilinx Inc.	IC FPGA VIRTEX 6 314K 1759-BGA Number of LABs/CLBs: 24600 Number of Logic Elements/Cells: 314880 Total RAM Bits: 25952256 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存5,104
XC2VP70-6FF1517I	Xilinx Inc.	IC FPGA 964 I/O 1517FCBGA Number of LABs/CLBs: 8272 Number of Logic Elements/Cells: 74448 Total RAM Bits: 6045696 Number of I/O: 964 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存5,904
XC6VLX240T-L1FFG1759C	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 18840 Number of Logic Elements/Cells: 241152 Total RAM Bits: 15335424 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存2,352
XQ6VLX130T-L1FFG1156I	Xilinx Inc.	IC FPGA VIRTEX 6 128K 1156-BGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,472
XC5VLX50T-2FF1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 2211840 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存2,416
XC3S4000-5FG900C	Xilinx Inc.	IC FPGA 633 I/O 900FBGA Number of LABs/CLBs: 6912 Number of Logic Elements/Cells: 62208 Total RAM Bits: 1769472 Number of I/O: 633 Number of Gates: 4000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	封裝: 900-BBGA	庫存4,400
XC3S5000-4FGG676I	Xilinx Inc.	IC FPGA 489 I/O 676FBGA Number of LABs/CLBs: 8320 Number of Logic Elements/Cells: 74880 Total RAM Bits: 1916928 Number of I/O: 489 Number of Gates: 5000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存7,476
XC3S500E-4FG320C	Xilinx Inc.	IC FPGA 232 I/O 320FBGA Number of LABs/CLBs: 1164 Number of Logic Elements/Cells: 10476 Total RAM Bits: 368640 Number of I/O: 232 Number of Gates: 500000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 320-BGA Supplier Device Package: 320-FBGA (19x19)	封裝: 320-BGA	庫存4,480
XA6SLX16-2CSG324I	Xilinx Inc.	IC FPGA 232 I/O 324CSGBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 232 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存3,616
XC3S400A-5FTG256C	Xilinx Inc.	IC FPGA 195 I/O 256FTBGA Number of LABs/CLBs: 896 Number of Logic Elements/Cells: 8064 Total RAM Bits: 368640 Number of I/O: 195 Number of Gates: 400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,480
XC7K410T-1FBG676C	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 31775 Number of Logic Elements/Cells: 406720 Total RAM Bits: 29306880 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存4,480
XC9536-5VQ44C	Xilinx Inc.	IC CPLD 36MC 5NS 44VQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 5.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 36 Number of Gates: 800 Number of I/O: 34 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存20,160
XC2C512-7FTG256I	Xilinx Inc.	IC CPLD 512MC 7.1NS 256FTBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 212 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存5,520
XCR3064XL-10CS48C	Xilinx Inc.	IC CPLD 64MC 9.1NS 48CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 40 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 48-FBGA, CSPBGA Supplier Device Package: 48-CSBGA (7x7)	封裝: 48-FBGA, CSPBGA	庫存2,000
XCR3032XL-10CS48I	Xilinx Inc.	IC CPLD 32MC 9.1NS 48CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 9.1ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 2 Number of Macrocells: 32 Number of Gates: 750 Number of I/O: 36 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-FBGA, CSPBGA Supplier Device Package: 48-CSBGA (7x7)	封裝: 48-FBGA, CSPBGA	庫存16,404
XAZU3EG-1SFVA625Q	Xilinx Inc.	XAZU3EG-1SFVA625Q Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,424

XCMECH-FFG1517

Xilinx Inc.

FFG1517 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,544

XC18V512VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

Programmable Type: In System Programmable
Memory Size: 512kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存5,776

XCZU17EG-1FFVD1760I

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,016

XCZU5CG-L1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存5,968

XC7Z035-1FFG676C

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,056

XCV600E-7FG900C

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存2,096

XCV50E-7FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 65536
Number of I/O: 176
Number of Gates: 71693
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存6,576

XCV2600E-8FG1156C

Xilinx Inc.

IC FPGA 804 I/O 1156FBGA

Number of LABs/CLBs: 12696
Number of Logic Elements/Cells: 57132
Total RAM Bits: 753664
Number of I/O: 804
Number of Gates: 3263755
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1156-BBGA
Supplier Device Package: 1156-FBGA (35x35)

封裝: 1156-BBGA

庫存5,584

XCV200-4BG352C

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 260
Number of Gates: 236666
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存6,300

XCS40XL-4CS280C

Xilinx Inc.

IC FPGA 224 I/O 280CSBGA

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 224
Number of Gates: 40000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 280-TFBGA, CSPBGA
Supplier Device Package: 280-CSBGA (16x16)

封裝: 280-TFBGA, CSPBGA

庫存10,236

XC4010E-2PG191C

Xilinx Inc.

IC FPGA 160 I/O 191CPGA

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 160
Number of Gates: 10000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 191-BCPGA
Supplier Device Package: 191-CPGA (47.25x47.25)

封裝: 191-BCPGA

庫存6,544

XCVU125-2FLVD1517I

Xilinx Inc.

IC FPGA 338 I/O 1517FCBGA

Number of LABs/CLBs: 89520
Number of Logic Elements/Cells: 1566600
Total RAM Bits: 90726400
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存3,552

XQ6VSX315T-2RF1759I

Xilinx Inc.

IC FPGA VIRTEX 6 314K 1759-BGA

Number of LABs/CLBs: 24600
Number of Logic Elements/Cells: 314880
Total RAM Bits: 25952256
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存5,104

XC2VP70-6FF1517I

Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

Number of LABs/CLBs: 8272
Number of Logic Elements/Cells: 74448
Total RAM Bits: 6045696
Number of I/O: 964
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存5,904

XC6VLX240T-L1FFG1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 18840
Number of Logic Elements/Cells: 241152
Total RAM Bits: 15335424
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存2,352

XQ6VLX130T-L1FFG1156I

Xilinx Inc.

IC FPGA VIRTEX 6 128K 1156-BGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,472

XC5VLX50T-2FF1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 2211840
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存2,416

XC3S4000-5FG900C

Xilinx Inc.

IC FPGA 633 I/O 900FBGA

Number of LABs/CLBs: 6912
Number of Logic Elements/Cells: 62208
Total RAM Bits: 1769472
Number of I/O: 633
Number of Gates: 4000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

庫存4,400

XC3S5000-4FGG676I

Xilinx Inc.

IC FPGA 489 I/O 676FBGA

Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
Total RAM Bits: 1916928
Number of I/O: 489
Number of Gates: 5000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存7,476

XC3S500E-4FG320C

Xilinx Inc.

IC FPGA 232 I/O 320FBGA

Number of LABs/CLBs: 1164
Number of Logic Elements/Cells: 10476
Total RAM Bits: 368640
Number of I/O: 232
Number of Gates: 500000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 320-BGA
Supplier Device Package: 320-FBGA (19x19)

封裝: 320-BGA

庫存4,480

XA6SLX16-2CSG324I

Xilinx Inc.

IC FPGA 232 I/O 324CSGBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 232
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存3,616

XC3S400A-5FTG256C

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Number of LABs/CLBs: 896
Number of Logic Elements/Cells: 8064
Total RAM Bits: 368640
Number of I/O: 195
Number of Gates: 400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,480

XC7K410T-1FBG676C

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 31775
Number of Logic Elements/Cells: 406720
Total RAM Bits: 29306880
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存4,480

XC9536-5VQ44C

Xilinx Inc.

IC CPLD 36MC 5NS 44VQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 5.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 36
Number of Gates: 800
Number of I/O: 34
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存20,160

XC2C512-7FTG256I

Xilinx Inc.

IC CPLD 512MC 7.1NS 256FTBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.1ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 212
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存5,520

XCR3064XL-10CS48C

Xilinx Inc.

IC CPLD 64MC 9.1NS 48CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 40
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-FBGA, CSPBGA
Supplier Device Package: 48-CSBGA (7x7)

封裝: 48-FBGA, CSPBGA

庫存2,000

XCR3032XL-10CS48I

Xilinx Inc.

IC CPLD 32MC 9.1NS 48CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 9.1ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 2
Number of Macrocells: 32
Number of Gates: 750
Number of I/O: 36
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-FBGA, CSPBGA
Supplier Device Package: 48-CSBGA (7x7)

封裝: 48-FBGA, CSPBGA

庫存16,404

XAZU3EG-1SFVA625Q

Xilinx Inc.

XAZU3EG-1SFVA625Q

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,424