頁 154 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCMECH-FFG676	Xilinx Inc.	FFG676 MECHANICAL SAMPLE Type: Mechanical Sample Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,520
XC18V01VQ44I	Xilinx Inc.	IC PROM SER I-TEMP 3.3V 44-VQFP Programmable Type: In System Programmable Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存20,532
XCZU4EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存3,312
XC6SLX45-N3FG484I	Xilinx Inc.	IC FPGA 316 I/O 484FBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 316 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,744
XC2V500-4FG256I	Xilinx Inc.	IC FPGA 172 I/O 256FBGA Number of LABs/CLBs: 768 Number of Logic Elements/Cells: - Total RAM Bits: 589824 Number of I/O: 172 Number of Gates: 500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存3,744
XC2V3000-5FG676I	Xilinx Inc.	IC FPGA 484 I/O 676FBGA Number of LABs/CLBs: 3584 Number of Logic Elements/Cells: - Total RAM Bits: 1769472 Number of I/O: 484 Number of Gates: 3000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存4,320
XA2S100E-6TQ144Q	Xilinx Inc.	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 40960 Number of I/O: 102 Number of Gates: 100000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,272
XC2V1500-5FGG676C	Xilinx Inc.	IC FPGA 392 I/O 676FBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 392 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存4,992
XCV405E-7FG676C	Xilinx Inc.	IC FPGA 404 I/O 676FBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 10800 Total RAM Bits: 573440 Number of I/O: 404 Number of Gates: 129600 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,088
XCV300E-6BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 131072 Number of I/O: 260 Number of Gates: 411955 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存4,736
XCV200E-7BG352I	Xilinx Inc.	IC FPGA 260 I/O 352MBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 114688 Number of I/O: 260 Number of Gates: 306393 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA, Metal Supplier Device Package: 352-MBGA (35x35)	封裝: 352-LBGA, Metal	庫存7,168
XC4020XL-2HT144C	Xilinx Inc.	IC FPGA 113 I/O 144HQFP Number of LABs/CLBs: 784 Number of Logic Elements/Cells: 1862 Total RAM Bits: 25088 Number of I/O: 113 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP Exposed Pad	庫存4,624
XC4010XL-3PQ208I	Xilinx Inc.	IC FPGA 160 I/O 208QFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 160 Number of Gates: 10000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存10,512
XC4005XL-3TQ144I	Xilinx Inc.	IC FPGA 112 I/O 144TQFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,784
XCKU115-1FLVB2104I	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 82920 Number of Logic Elements/Cells: 1451100 Total RAM Bits: 77721600 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存5,680
XCKU060-2FFVA1156I	Xilinx Inc.	IC FPGA 520 I/O 1156FCBGA Number of LABs/CLBs: 41460 Number of Logic Elements/Cells: 725550 Total RAM Bits: 38912000 Number of I/O: 520 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存6,224
XC5VSX50T-3FFG1136C	Xilinx Inc.	IC FPGA 480 I/O 1136FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1136-BBGA, FCBGA Supplier Device Package: 1136-FCBGA (35x35)	封裝: 1136-BBGA, FCBGA	庫存4,000
XC7K325T-1FBG676I	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,408
XA3S700A-4FGG484I	Xilinx Inc.	IC FPGA 372 I/O 484FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 372 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存6,848
XC2S200-5FGG456I	Xilinx Inc.	IC FPGA 284 I/O 456FBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 284 Number of Gates: 200000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 456-BBGA Supplier Device Package: 456-FBGA (23x23)	封裝: 456-BBGA	庫存4,544
XC6SLX25-N3FG484I	Xilinx Inc.	IC FPGA 266 I/O 484FBGA Number of LABs/CLBs: 1879 Number of Logic Elements/Cells: 24051 Total RAM Bits: 958464 Number of I/O: 266 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,760
XC9572-10PC44I	Xilinx Inc.	IC CPLD 72MC 10NS 44PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 34 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存4,832
XCR3384XL-12PQG208I	Xilinx Inc.	IC CPLD 384MC 10.8NS 208QFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 10.8ns Voltage Supply - Internal: 2.7 V ~ 3.6 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 172 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存7,616
XC2C256-6FTG256C	Xilinx Inc.	IC CPLD 256MC 5.7NS 256FTBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 5.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 256 Number of Gates: 6000 Number of I/O: 184 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存7,140
XC2C64A-7VQ44C	Xilinx Inc.	IC CPLD 64MC 6.7NS 44VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 6.7ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 33 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 44-TQFP Supplier Device Package: 44-VQFP (10x10)	封裝: 44-TQFP	庫存3,904
XC7S15-2CPGA196I	Xilinx Inc.	XC7S15-2CPGA196I Number of LABs/CLBs: 1000 Number of Logic Elements/Cells: 12800 Total RAM Bits: 368640 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 196-TFBGA, CSBGA Supplier Device Package: 196-CSPBGA (8x8)	封裝: 196-TFBGA, CSBGA	庫存9,120
XCVU095-H1FFVD1517E	Xilinx Inc.	IC FPGA VIRTEX-U 1517FCBGA Number of LABs/CLBs: 67200 Number of Logic Elements/Cells: 1176000 Total RAM Bits: 62259200 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.922 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存4,432
XCKU3P-L2FFVD900E	Xilinx Inc.	XCKU3P-L2FFVD900E Number of LABs/CLBs: 20340 Number of Logic Elements/Cells: 355950 Total RAM Bits: 31641600 Number of I/O: 304 Number of Gates: - Voltage - Supply: 0.698 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存3,680

XCMECH-FFG676

Xilinx Inc.

FFG676 MECHANICAL SAMPLE

Type: Mechanical Sample
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,520

XC18V01VQ44I

Xilinx Inc.

IC PROM SER I-TEMP 3.3V 44-VQFP

Programmable Type: In System Programmable
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存20,532

XCZU4EG-1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存3,312

XC6SLX45-N3FG484I

Xilinx Inc.

IC FPGA 316 I/O 484FBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 316
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,744

XC2V500-4FG256I

Xilinx Inc.

IC FPGA 172 I/O 256FBGA

Number of LABs/CLBs: 768
Number of Logic Elements/Cells: -
Total RAM Bits: 589824
Number of I/O: 172
Number of Gates: 500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存3,744

XC2V3000-5FG676I

Xilinx Inc.

IC FPGA 484 I/O 676FBGA

Number of LABs/CLBs: 3584
Number of Logic Elements/Cells: -
Total RAM Bits: 1769472
Number of I/O: 484
Number of Gates: 3000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存4,320

XA2S100E-6TQ144Q

Xilinx Inc.

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 40960
Number of I/O: 102
Number of Gates: 100000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,272

XC2V1500-5FGG676C

Xilinx Inc.

IC FPGA 392 I/O 676FBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: -
Total RAM Bits: 884736
Number of I/O: 392
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存4,992

XCV405E-7FG676C

Xilinx Inc.

IC FPGA 404 I/O 676FBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 10800
Total RAM Bits: 573440
Number of I/O: 404
Number of Gates: 129600
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,088

XCV300E-6BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 131072
Number of I/O: 260
Number of Gates: 411955
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存4,736

XCV200E-7BG352I

Xilinx Inc.

IC FPGA 260 I/O 352MBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 114688
Number of I/O: 260
Number of Gates: 306393
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 352-LBGA, Metal
Supplier Device Package: 352-MBGA (35x35)

封裝: 352-LBGA, Metal

庫存7,168

XC4020XL-2HT144C

Xilinx Inc.

IC FPGA 113 I/O 144HQFP

Number of LABs/CLBs: 784
Number of Logic Elements/Cells: 1862
Total RAM Bits: 25088
Number of I/O: 113
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP Exposed Pad

庫存4,624

XC4010XL-3PQ208I

Xilinx Inc.

IC FPGA 160 I/O 208QFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 160
Number of Gates: 10000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存10,512

XC4005XL-3TQ144I

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,784

XCKU115-1FLVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 82920
Number of Logic Elements/Cells: 1451100
Total RAM Bits: 77721600
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存5,680

XCKU060-2FFVA1156I

Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

Number of LABs/CLBs: 41460
Number of Logic Elements/Cells: 725550
Total RAM Bits: 38912000
Number of I/O: 520
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存6,224

XC5VSX50T-3FFG1136C

Xilinx Inc.

IC FPGA 480 I/O 1136FCBGA

Number of LABs/CLBs: 4080
Number of Logic Elements/Cells: 52224
Total RAM Bits: 4866048
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1136-BBGA, FCBGA
Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

庫存4,000

XC7K325T-1FBG676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,408

XA3S700A-4FGG484I

Xilinx Inc.

IC FPGA 372 I/O 484FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 372
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存6,848

XC2S200-5FGG456I

Xilinx Inc.

IC FPGA 284 I/O 456FBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 284
Number of Gates: 200000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

庫存4,544

XC6SLX25-N3FG484I

Xilinx Inc.

IC FPGA 266 I/O 484FBGA

Number of LABs/CLBs: 1879
Number of Logic Elements/Cells: 24051
Total RAM Bits: 958464
Number of I/O: 266
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,760

XC9572-10PC44I

Xilinx Inc.

IC CPLD 72MC 10NS 44PLCC

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存4,832

XCR3384XL-12PQG208I

Xilinx Inc.

IC CPLD 384MC 10.8NS 208QFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 10.8ns
Voltage Supply - Internal: 2.7 V ~ 3.6 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 172
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存7,616

XC2C256-6FTG256C

Xilinx Inc.

IC CPLD 256MC 5.7NS 256FTBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 5.7ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 256
Number of Gates: 6000
Number of I/O: 184
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存7,140

XC2C64A-7VQ44C

Xilinx Inc.

IC CPLD 64MC 6.7NS 44VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 6.7ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 33
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

庫存3,904

XC7S15-2CPGA196I

Xilinx Inc.

XC7S15-2CPGA196I

Number of LABs/CLBs: 1000
Number of Logic Elements/Cells: 12800
Total RAM Bits: 368640
Number of I/O: 100
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 196-TFBGA, CSBGA
Supplier Device Package: 196-CSPBGA (8x8)

封裝: 196-TFBGA, CSBGA

庫存9,120

XCVU095-H1FFVD1517E

Xilinx Inc.

IC FPGA VIRTEX-U 1517FCBGA

Number of LABs/CLBs: 67200
Number of Logic Elements/Cells: 1176000
Total RAM Bits: 62259200
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.922 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存4,432

XCKU3P-L2FFVD900E

Xilinx Inc.

XCKU3P-L2FFVD900E

Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM Bits: 31641600
Number of I/O: 304
Number of Gates: -
Voltage - Supply: 0.698 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存3,680